Patents by Inventor Chia-Jen HUANG

Chia-Jen HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113636
    Abstract: A dual mode charge control method includes steps of: detecting an input voltage of the resonance tank, a resonance current of the resonance tank, an output current of the load, and an output voltage of the load; performing a single-band charge control when determining a light-load condition or a no-load condition of the load according to the output current; compensating the output voltage to generate an upper threshold voltage in the single-band charge control, and acquiring a resonance voltage by calculating the resonance current by a resettable integrator; comparing the resonance voltage and the upper threshold voltage to generate a first control signal; generating a second control signal complementary to the first control signal by a pulse-width modulation duplicator; providing the first control signal and the second control signal to respectively control a first power switch and a second power switch of the resonance circuit.
    Type: Application
    Filed: January 19, 2023
    Publication date: April 4, 2024
    Inventors: Bo-Ruei PENG, Chang-Chung LIN, Yu-Jen LIN, Chia-Hsiong HUANG
  • Patent number: 11940906
    Abstract: A method to be implemented by the server includes steps of: during a power-on self-test, determining whether a storage device is communicatively connected to the server; when it is determined that a storage device is communicatively connected to the server, determining whether the storage device stores a script file having a preset filename; and when it is determined that the storage device stores a script file having the preset filename, performing a process of modifying the BIOS based on the script file.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: March 26, 2024
    Assignee: Mitac Computing Technology Corporation
    Inventor: Chia-Jen Huang
  • Patent number: 11942464
    Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 11934035
    Abstract: An optical mechanism is provided, including a housing, a base, and a metal supporting member. The housing has a top cover and a sidewall connected to the top cover, wherein the top cover and the sidewall comprises plastic material. The base is connected to the housing, wherein an optical element is accommodated in a space between the housing and the base. At least a part of the metal supporting member is embedded in the housing.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chien-Lun Huang, Shou-Jen Liu, Chia-Pin Hsu, Sin-Jhong Song
  • Patent number: 11928882
    Abstract: The present invention provides a display device, which includes a frame having an accommodating cavity and a display module disposed in the accommodating cavity. The display module includes a first light source, an optical unit, an imaging unit arranged on a side of the optical unit facing away from the first light source, and a lens array arranged on a side of the imaging unit facing away from the first light source. Corresponding to a preset pattern, light emitted by the first light source passes through the optical unit, the imaging unit and the lens array to form a default floating image in a floating display area outside the accommodating cavity. In addition, the present invention also provides a non-contact key and an input device including the above display module.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: March 12, 2024
    Assignee: DARWIN PRECISIONS CORPORATION
    Inventors: Yu Jen Lai, Ya Han Ko, Yu-Ming Huang, Chia Tsun Huang
  • Publication number: 20240071442
    Abstract: A method is provided, including following operations: activating a first word line to couple a first bit line with a second bit line to form a first conductive loop through a first transistor having a first terminal coupled to the first bit line and a second transistor having a first terminal coupled to the second bit line, wherein second terminals of the first and second transistors are coupled together; activating a second word line to couple a third bit line with a fourth bit line to form a second conductive loop, wherein the first and second word lines are disposed below the first to fourth bit lines; and identifying that the first conductive loop, the second conductive loop, or the combinations thereof is short-circuited or open-circuited.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Min-Chiao YEH, Chieh LEE, Chia-En HUANG, Ji Kuan LEE, Yao-Jen YANG
  • Publication number: 20220197785
    Abstract: A method to be implemented by the server includes steps of: during a power-on self-test, determining whether a storage device is communicatively connected to the server; when it is determined that a storage device is communicatively connected to the server, determining whether the storage device stores a script file having a preset filename; and when it is determined that the storage device stores a script file having the preset filename, performing a process of modifying the BIOS based on the script file.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 23, 2022
    Applicant: Mitac Computing Technology Corporation
    Inventor: Chia-Jen HUANG
  • Patent number: 10970151
    Abstract: A method for controlling a correctable error reporting function and applicable to a server device is provided, including: receiving, by control unit, a plurality of first error messages sent by a first hardware component in which a plurality of correctable errors occurs in a plurality of hardware components; determining, by the control unit, according to the first error messages, error types of the errors occurring in the first hardware component; determining, by the control unit, whether the number of occurrences of the errors of the error types that occur in the first hardware component within first preset duration reaches a preset number of times; and if the determining result is yes, controlling, by the control unit, the first hardware component to stop performing an error reporting function corresponding to the first error type.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: April 6, 2021
    Assignee: MITAC COMPUTING TECHNOLOGY CORPORATION
    Inventor: Chia-Jen Huang
  • Publication number: 20190310908
    Abstract: A method for controlling a correctable error reporting function and applicable to a server device is provided, including: receiving, by control unit, a plurality of first error messages sent by a first hardware component in which a plurality of correctable errors occurs in a plurality of hardware components; determining, by the control unit, according to the first error messages, error types of the errors occurring in the first hardware component; determining, by the control unit, whether the number of occurrences of the errors of the error types that occur in the first hardware component within first preset duration reaches a preset number of times; and if the determining result is yes, controlling, by the control unit, the first hardware component to stop performing an error reporting function corresponding to the first error type.
    Type: Application
    Filed: April 4, 2019
    Publication date: October 10, 2019
    Applicant: MITAC COMPUTING TECHNOLOGY CORPORATION
    Inventor: Chia-Jen HUANG