Patents by Inventor Chia-Jen Liang
Chia-Jen Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10886593Abstract: An antenna package structure comprises a substrate with a first surface and a second surface; a dielectric layer, disposed on the first surface of the substrate comprises at least a impedance matching structure and an interconnection structure; a molding layer, disposed on the dielectric layer comprises a plurality of chips wherein a control chip electrically connects to the impedance matching structure and a plurality of conducting structures; an antenna layer, disposed on the second surface of the substrate comprising at least an antenna electrically connects to the substrate; and a protection layer covers the antenna layer.Type: GrantFiled: December 26, 2018Date of Patent: January 5, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ching-Wen Chiang, Yen-Cheng Kuan, Chia-Jen Liang
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Patent number: 10707835Abstract: A wireless receiving device is provided. The wireless receiving device includes a first passive mixer and a common gate amplifier. The first passive mixer receives an oscillation signal. The common gate amplifier is coupled to the first passive mixer, and automatically adjusts the input impedance of the common gate amplifier according to the oscillation frequency of the oscillation signal.Type: GrantFiled: December 26, 2018Date of Patent: July 7, 2020Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chia-Jen Liang, Yen-Cheng Kuan, Ching-Wen Chiang, Mau-Chung Chang
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Publication number: 20200203817Abstract: An antenna package structure comprises a substrate with a first surface and a second surface; a dielectric layer, disposed on the first surface of the substrate comprises at least a impedance matching structure and an interconnection structure; a molding layer, disposed on the dielectric layer comprises a plurality of chips wherein a control chip electrically connects to the impedance matching structure and a plurality of conducting structures; an antenna layer, disposed on the second surface of the substrate comprising at least an antenna electrically connects to the substrate; and a protection layer covers the antenna layer.Type: ApplicationFiled: December 26, 2018Publication date: June 25, 2020Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ching-Wen CHIANG, Yen-Cheng KUAN, Chia-Jen LIANG
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Publication number: 20200195231Abstract: A wireless receiving device is provided. The wireless receiving device includes a first passive mixer and a common gate amplifier. The first passive mixer receives an oscillation signal. The common gate amplifier is coupled to the first passive mixer, and automatically adjusts the input impedance of the common gate amplifier according to the oscillation frequency of the oscillation signal.Type: ApplicationFiled: December 26, 2018Publication date: June 18, 2020Inventors: Chia-Jen LIANG, Yen-Cheng KUAN, Ching-Wen CHIANG, Mau-Chung CHANG
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Patent number: 10566299Abstract: Method for manufacturing a multi-band antenna package structure includes providing a first temporary substrate; forming a first dielectric material layer, and first metal patterns; forming at least one metal via; forming at least one metal pillar, and disposing an integrated circuit chip; forming a molding layer; thinning down the molding layer thus forming an integrated circuit chip layer; forming a first redistribution layer; forming a first antenna unit layer; forming a first protection layer, thus a first stacked structure formed; removing the first temporary substrate, and facing down the first stacked structure to adhere it on a second temporary substrate with a second glue layer; forming a second redistribution layer; forming a second protection layer; forming bump balls, thus a second stacked structure formed; removing the second temporary substrate with the second glue layer, facing down and mounting the second stacked structure on a substrate through the bump balls.Type: GrantFiled: July 8, 2019Date of Patent: February 18, 2020Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Ching-Wen Chiang, Yen-Cheng Kuan, Chia-Jen Liang, Chien-Te Yu
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Publication number: 20190333883Abstract: Method for manufacturing a multi-band antenna package structure includes providing a first temporary substrate; forming a first dielectric material layer, and first metal patterns; forming at least one metal via; forming at least one metal pillar, and disposing an integrated circuit chip; forming a molding layer; thinning down the molding layer thus forming an integrated circuit chip layer; forming a first redistribution layer; forming a first antenna unit layer; forming a first protection layer, thus a first stacked structure formed; removing the first temporary substrate, and facing down the first stacked structure to adhere it on a second temporary substrate with a second glue layer; forming a second redistribution layer; forming a second protection layer; forming bump balls, thus a second stacked structure formed; removing the second temporary substrate with the second glue layer, facing down and mounting the second stacked structure on a substrate through the bump balls.Type: ApplicationFiled: July 8, 2019Publication date: October 31, 2019Inventors: CHING-WEN CHIANG, YEN-CHENG KUAN, CHIA-JEN LIANG, CHIEN-TE YU
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Patent number: 10424550Abstract: A multi-band antenna package structure includes a first redistribution layer; an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns of the first redistribution layer; a second redistribution layer, formed on the integrated circuit layer; and a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit.Type: GrantFiled: December 19, 2017Date of Patent: September 24, 2019Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Ching-Wen Chiang, Yen-Cheng Kuan, Chia-Jen Liang, Chien-Te Yu
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Patent number: 10361154Abstract: A variable inductor which comprises a primary conductor, first and second secondary conductors and one or more switch. The primary conductor has a first node and a second node, wherein the first node is used to connect a first external component and the second node is used to connect a second external component. The first and second secondary conductors magnetically couple to the primary conductor. The one or more switch has two sides connected to the first or second secondary conductor, respectively. The first and second secondary conductors are formed a single-loop structure with two or more changeable current paths which are operated by the states of the one or more switch. An integrated circuit using the variable inductor is also introduced.Type: GrantFiled: December 20, 2017Date of Patent: July 23, 2019Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Chia-Jen Liang, Yen-Cheng Kuan, Ching-Wen Chiang, Chien-Te Yu
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Publication number: 20190189572Abstract: A multi-band antenna package structure includes a first redistribution layer; an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns of the first redistribution layer; a second redistribution layer, formed on the integrated circuit layer; and a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit.Type: ApplicationFiled: December 19, 2017Publication date: June 20, 2019Inventors: CHING-WEN CHIANG, YEN-CHENG KUAN, CHIA-JEN LIANG, CHIEN-TE YU
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Publication number: 20190189342Abstract: A variable inductor comprises a primary conductor, a first secondary conductor and one or more switch. The primary conductor has a first node and a second node, wherein the first node is used to connect a first external component and the second node is used to connect a second external component. The first secondary conductor magnetically couples to the primary conductor. The one or more switch has two sides connected to the first secondary conductor, respectively. The first secondary conductor is formed a single-loop structure with two or more changeable current paths which are operated by the states of the one or more switch. An integrated circuit using the variable inductor is also introduced.Type: ApplicationFiled: December 20, 2017Publication date: June 20, 2019Inventors: CHIA-JEN LIANG, YEN-CHENG KUAN, CHING-WEN CHIANG, CHIEN-TE YU
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Publication number: 20190189556Abstract: A variable inductor which comprises a primary conductor, first and second secondary conductors and one or more switch. The primary conductor has a first node and a second node, wherein the first node is used to connect a first external component and the second node is used to connect a second external component. The first and second secondary conductors magnetically couple to the primary conductor. The one or more switch has two sides connected to the first or second secondary conductor, respectively. The first and second secondary conductors are formed a single-loop structure with two or more changeable current paths which are operated by the states of the one or more switch. An integrated circuit using the variable inductor is also introduced.Type: ApplicationFiled: December 20, 2017Publication date: June 20, 2019Inventors: CHIA-JEN LIANG, YEN-CHENG KUAN, CHING-WEN CHIANG, CHIEN-TE YU
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Patent number: 10298182Abstract: A radio frequency amplifier comprises a transistor, a transformer and a variable capacitor. The transistor has an input terminal, an output terminal and a control terminal. The transformer has a first coil conductor and a second coil conductor. The first coil conductor magnetically couples to the second coil conductor. The second coil conductor connects to the control terminal. The first coil conductor connects to the input terminal. The variable capacitor connects in parallel with the second coil conductor. An integrated circuit using the radio frequency amplifier is also introduced.Type: GrantFiled: December 19, 2017Date of Patent: May 21, 2019Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Chia-Jen Liang, Yen-Cheng Kuan, Ching-Wen Chiang, Hung-Ting Chou
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Patent number: 10277170Abstract: A radio frequency amplifier comprises a transistor, a transformer and a variable capacitor. The transistor has an input terminal, an output terminal and a control terminal. The transformer has a first coil conductor and a second coil conductor. The first coil conductor magnetically couples to the second coil conductor. The second coil conductor connects to the control terminal. The first coil conductor connects to the input terminal. The variable capacitor connects in parallel with the second coil conductor. The radio frequency amplifier is configured to be an input or output stage of an integrated circuit. An integrated circuit using the radio frequency amplifier is also introduced.Type: GrantFiled: December 19, 2017Date of Patent: April 30, 2019Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Chia-Jen Liang, Yen-Cheng Kuan, Ching-Wen Chiang, Hung-Ting Chou
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Patent number: 10096558Abstract: A multi-band antenna package structure includes a first redistribution layer; an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns of the first redistribution layer; a second redistribution layer, formed on the integrated circuit layer; and a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit.Type: GrantFiled: December 20, 2017Date of Patent: October 9, 2018Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Ching-Wen Chiang, Yen-Cheng Kuan, Chia-Jen Liang, Chien-Te Yu