Patents by Inventor Chia-Jen LIN

Chia-Jen LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154301
    Abstract: A radome for protecting a radar device is disposed in the transmission path of signals to/from the radar device. The radome includes a shell; a first circuit board disposed at a side of the shell facing a radar device to be protected, and configured with a first inner circuit ring and a first outer circuit ring facing toward the shell; a second circuit board disposed between the first circuit board and the shell, and configured with a second inner circuit ring and a second outer circuit ring facing toward the shell; a first insulation layer disposed between the first circuit board and the second circuit board; and a second insulation layer disposed between the second circuit board and the shell. The first and second inner circuit rings are enclosed with and insulated from the first and second outer rings, respectively, and each of the circuit rings forms a closed loop.
    Type: Application
    Filed: February 8, 2023
    Publication date: May 9, 2024
    Inventors: YAO-JEN CHEN, PAO-WEI LIN, CHIA-HSIEN CHEN
  • Publication number: 20240153842
    Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 9, 2024
    Inventors: Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang, Chih-Wei Lin, Hsiu-Jen Lin, Ching-Hua Hsieh, Chung-Shi Liu
  • Publication number: 20240113636
    Abstract: A dual mode charge control method includes steps of: detecting an input voltage of the resonance tank, a resonance current of the resonance tank, an output current of the load, and an output voltage of the load; performing a single-band charge control when determining a light-load condition or a no-load condition of the load according to the output current; compensating the output voltage to generate an upper threshold voltage in the single-band charge control, and acquiring a resonance voltage by calculating the resonance current by a resettable integrator; comparing the resonance voltage and the upper threshold voltage to generate a first control signal; generating a second control signal complementary to the first control signal by a pulse-width modulation duplicator; providing the first control signal and the second control signal to respectively control a first power switch and a second power switch of the resonance circuit.
    Type: Application
    Filed: January 19, 2023
    Publication date: April 4, 2024
    Inventors: Bo-Ruei PENG, Chang-Chung LIN, Yu-Jen LIN, Chia-Hsiong HUANG
  • Patent number: 11947886
    Abstract: A development system and a method of an offline software-in-the-loop simulation are disclosed. A common firmware architecture generates a chip control program. The common firmware architecture has an application layer and a hardware abstraction layer. The application layer has a configuration header file and a product program. A processing program required by a peripheral module is added to the hardware abstraction layer during compiling. The chip control program is provided to a controller chip or a circuit simulation software to be executed to control the product-related circuit through controlling the peripheral module.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: April 2, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yu-Jen Lin, Chang-Chung Lin, Chia-Wei Chu, Terng-Wei Tsai, Feng-Hsuan Tung
  • Publication number: 20240105642
    Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
  • Patent number: 11942464
    Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Publication number: 20240094625
    Abstract: A method of making a semiconductor device includes forming at least one fiducial mark on a photomask. The method further includes defining a pattern including a plurality of sub-patterns on the photomask in a pattern region. The defining the pattern includes defining a first sub-pattern of the plurality of sub-patterns having a first spacing from a second sub-pattern of the plurality of sub-patterns, wherein the first spacing is different from a second spacing between the second sub-pattern and a third sub-pattern of the plurality of sub-patterns.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Hsin-Chang LEE, Ping-Hsun LIN, Chih-Cheng LIN, Chia-Jen CHEN
  • Publication number: 20240094783
    Abstract: An example computing device includes a first housing portion, a second housing portion moveably connected to the first housing portion, a link to selectively secure the second housing portion to the first housing portion to inhibit movement of the second housing portion relative to the first housing portion, and a shape-memory alloy element to release the link to allow the second housing portion to move relative to the first housing portion.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 21, 2024
    Inventors: Yu-Wen LIN, Chia-Ming TSAI, Shih-Jen CHOU, John Joseph GRODEN
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20240088062
    Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
  • Patent number: 11833265
    Abstract: A mobile device includes a mobile platform, a spray generating assembly, an ultraviolet light-emitting module, a scanning module and a controlling module. The spray generating assembly is to generate a disinfecting and sterilizing spray for a spraying, disinfecting and sterilizing operation in the working area. The ultraviolet light-emitting module is configured to generate ultraviolet beams for performing a radiating, disinfecting and sterilizing operation onto a ground surface of the working area. The scanning module defined with an entire scan range is configured to generate a warning signal upon a human in the entire scan range. The controlling module, electrically connected with the scanning module and the spray generating assembly, is configured to control the spray generating assembly to stop generating the disinfecting and sterilizing sprays upon receiving the warning signal, so as to prevent the human from inhaling excessive sprays.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: December 5, 2023
    Assignee: TECO ELECTRIC & MACHINERY CO., LTD.
    Inventors: Chia-Jen Lin, Shih-Chang Cheu
  • Publication number: 20230122850
    Abstract: A microfluidic sensor chip includes a body comprising a substrate and an upper cover, and the upper cover having at least one opening, at least one microfluidic channel formed on the substrate and has a supporting surface, wherein the at least one microfluidic channel communicates with the at least one opening, and a metamaterial layer coated on the supporting surface, wherein the metamaterial layer has a plurality of regions, and each region has a corresponding resonance pattern. The present disclosure further provides a measuring system for microfluidic sensor chip includes a carrying board, a plurality of the microfluidic sensor chips, a transmitter emitting a terahertz wave corresponding to the resonance pattern of one of the microfluidic sensor chips, a receiver receiving a reflected wave corresponding to the terahertz wave, and a processor receiving the reflected wave from the processor, and determining a testing sample characteristic according to the reflected wave.
    Type: Application
    Filed: January 13, 2022
    Publication date: April 20, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Tai LI, Chia-Jen LIN, Wei-Yu LIN, Kao-Chi LIN, Cho-Fan HSIEH, Teng-Chun WU
  • Patent number: 11573175
    Abstract: The disclosure provides a calibration assembly for a scan device. The calibration assembly includes a plurality of light-permeable plates and a reflection plate. The light-permeable plates are different in size, and the light-permeable plates are arranged along thicknesses directions thereof to form a step shape. The light-permeable plates define a plurality of light-permeable areas that respectively have different numbers of layers of the light-permeable plates inversely proportional to transmittances of the light-permeable areas. The light-permeable areas are configured to be permeable to a light having a predetermined frequency. The reflection plate is disposed at a side of one of the light-permeable plates in the thickness direction thereof. The reflection plate has a plurality of first holes having different sizes, and the reflection plate is configured to block the light having the predetermined frequency. The disclosure also provides a calibration system having the calibration assembly.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: February 7, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Tai Li, Wei-Yu Lin, Chia-Jen Lin, Chin Lien, Cho-Fan Hsieh
  • Publication number: 20220309641
    Abstract: A system for analyzing image includes a data-acquiring module, a waveform-constructing module, a sampling module, a transforming module, and an analyzing module. The present system is utilized to retrieve normal data and real-time data, generate a normal waveform and a real-time waveform, sample normal sampling data from normal data and real-time sampling data from real-time data, transform first RGB values and second RGB values, and generate normal images and real-time images. The present system is utilized to detect whether a servo motor system is abnormal by analyzing real-time images with respect to normal images. In addition, a method of analyzing image is also provided.
    Type: Application
    Filed: June 18, 2021
    Publication date: September 29, 2022
    Inventors: Chia-Jen LIN, Feng-Chieh LIN, Chun-Chi LAI, Chin-Sheng CHEN
  • Publication number: 20220308099
    Abstract: A system for analyzing waveform, applied to a servo motor system, includes a data-acquiring module, a waveform-constructing module, a sampling module, a data-processing module, and a deep learning module. The present system retrieves normal data, abnormal date, and real-time data for generating a normal waveform, an abnormal waveform, and a real-time waveform, and then samples normal sampling data from the normal data, abnormal sampling data from the abnormal data, and real-time sampling data from the real-time data. The data-processing module is utilized to add the normal data and the abnormal data to form corresponding total data. The deep learning module utilizes a deep learning model to identify whether or not the real-time waveform is the normal waveform or the abnormal waveform by evaluating the normal waveform, the abnormal waveform and the total data.
    Type: Application
    Filed: June 18, 2021
    Publication date: September 29, 2022
    Inventors: Chia-Jen LIN, Feng-Chieh LIN, Chun-Chi LAI, Chin-Sheng CHEN
  • Publication number: 20220196549
    Abstract: The disclosure provides a calibration assembly for a scan device. The calibration assembly includes a plurality of light-permeable plates and a reflection plate. The light-permeable plates are different in size, and the light-permeable plates are arranged along thicknesses directions thereof to form a step shape. The light-permeable plates define a plurality of light-permeable areas that respectively have different numbers of layers of the light-permeable plates inversely proportional to transmittances of the light-permeable areas. The light-permeable areas are configured to be permeable to a light having a predetermined frequency. The reflection plate is disposed at a side of one of the light-permeable plates in the thickness direction thereof. The reflection plate has a plurality of first holes having different sizes, and the reflection plate is configured to block the light having the predetermined frequency. The disclosure also provides a calibration system having the calibration assembly.
    Type: Application
    Filed: December 22, 2020
    Publication date: June 23, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Tai LI, Wei-Yu LIN, Chia-Jen LIN, Chin LIEN, Cho-Fan HSIEH
  • Patent number: 11243161
    Abstract: A gas measurement device is provided and includes a gas channel module and a sensor component disposed within the gas channel module. The sensor component includes a substrate, a porous membrane, and a metal layer disposed between the substrate and the porous membrane. A gas measurement method is also provided.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: February 8, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chin Lien, Cho-Fan Hsieh, Chia-Jen Lin, Yu-Tai Li, Wei-You Lin
  • Patent number: 11221219
    Abstract: A system is applied for calibrating a map data configured for a mobile platform to generate a calibration map after an impact, and includes a map-generating module, a positioning module, an impact-detecting module, an image-analyzing module, a coordinate-reconstructing module and a map data-calibrating module. The map-generating module generates a global map with a first coordinate system. The positioning module positions a mobile platform before the impact. The impact detecting module generates a reconstructing signal after the impact upon the mobile platform is detected. The image-analyzing module searches and analyzes an image of a feature object. The coordinate-reconstructing module re-establishes a second coordinate system, and the map data-calibrating module calibrates the global map to generate the calibration map after the impact.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: January 11, 2022
    Assignee: TECO ELECTRIC & MACHINERY CO., LTD.
    Inventors: Chia-Jen Lin, Shih-Chang Cheu
  • Patent number: 11209545
    Abstract: An auxiliary positioning system includes a mobile platform and a plurality of reflective stickers. The reflective stickers are disposed in a navigation space. The mobile platform includes a map-establishing module, a positioning module, a laser scan and analysis module, a coordinate-processing module, a comparison module and a calibration module. The map-establishing module is utilized to generate a global map. The positioning module is utilized to locate a position coordinate. The laser scan and analysis module is utilized to scan the navigating space to generate a scan direction and distance vector. The coordinate-processing module is utilized to generate a position direction and distance vector. The comparison module is utilized to compare the scanning coordinate with the mapping coordinate. The calibration module is utilized to calibrate the position coordinate.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: December 28, 2021
    Assignee: TECO ELECTRIC & MACHINERY CO., LTD.
    Inventors: Chia-Jen Lin, Cheng-Yun Chung, Shih-Chang Cheu, Chun Chi Lai