Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: An optical mechanism is provided, including a housing, a base, and a metal supporting member. The housing has a top cover and a sidewall connected to the top cover, wherein the top cover and the sidewall comprises plastic material. The base is connected to the housing, wherein an optical element is accommodated in a space between the housing and the base. At least a part of the metal supporting member is embedded in the housing.

Abstract: The present invention discloses a high-temperature stable, low density and transparent silica aerogel prepared by carrying out a sol-gel process of a mixture containing a main precursor of inorganic siloxane and a high-temperature stable precursor to form a wet gel, wherein the high-temperature stable precursor and the main precursor undergo covalent-bond crosslinking; aging and supercritical drying the wet gel to form a low density, tough, hydrophobic silica aerogel of a porous network structure. The hydrophobation of the aerogel of the present invention prevails after several times of heating at 500° C., and the structure of the aerogel will not collapse caused by moisture.