Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A point cloud positioning error detection method, performed by a processing device, includes: obtaining a plurality of pieces of first point data and a target point cloud map, wherein the target point cloud map includes a plurality of pieces of target point data, registering the first point data and the target point data to obtain a plurality of pieces of second point data, selecting a plurality of pieces of third point data from the second point data according to a first default distance, calculating a plurality of matching scores of the third point data relative to the target point data, obtaining a plurality of step vectors corresponding to the third point data, respectively, when said registering converges, and obtaining a plurality of effective values according to directions of the step vectors, and outputting a localization fault detection result based on an intersection of the matching scores and the effective values.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A normal incident guided-mode-resonance biosensor and procalcitonin detection method using the same are provided and include a light source, a first lens, a polarizer, a beam splitter, a ¼? wave plate, a second lens, a detection unit, and a processing unit. The light source provides a light beam. The first lens converts the light beam into a parallel light. The polarizer filters and removes a transverse electric field mode light wave in the parallel light. The beam splitter selectively forms a transverse magnetic field mode light wave in the parallel light. The ¼? wave plate rotates the transverse magnetic field mode light wave in the parallel light by 45°. The second lens focuses the transverse magnetic field mode light wave to the bio-sensing chip. The detection unit receives an emitted light of the bio-sensing chip and generates a sensing signal.

Abstract: A planar waveguide-based optofluidic sensor and use thereof are provided, wherein the optofluidic sensor includes a substrate, an adhesive layer, a waveguide plate, and a microfluidic module layer. The adhesive layer is disposed on both sides of the substrate, the waveguide plate s disposed on the adhesive layer to be bonded with the substrate, and a hollow gap is formed between the substrate and the waveguide plate by the adhesive layer, and the microfluidic module layer is disposed on the waveguide plate and has a microfluidic channel, a fluid sample injection port, and an output port. The optofluidic sensor may detect the refractive index of the fluid sample with high sensitivity.