Patents by Inventor Chia-Jun CHIANG

Chia-Jun CHIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating additive and preparation method for the same
    Patent number: 9840784
    Abstract: The present invention provides a carboxyl sulfonate compound and preparation method thereof. The present carboxyl sulfonate compound has structure of formula (A): wherein M1 is hydrogen or an alkali metal; M2 is hydrogen, alkyl or an alkali metal; Y is hydrogen, alkyl; carboxyl, carboxyl salt; alkylcarboxyl, or alkylcarboxyl salt; n is an integer from 1 to 10; and m is an integer from 1 to 10. The carboxylic group and the sulfonic acid group in the structure of the present carboxyl sulfonate compound show excellent chelating ability to metal ions; therefore, the present carboxyl sulfonate compound is particularly for use in electroplating additive.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: December 12, 2017
    Assignee: TAIWAN HOPAX CHEMS. MFG. CO., LTD.
    Inventors: Kun-Hsin Lee, Ying-Jin Chen, Tzu-Hua Feng, Li-Jane Her, Chia-Jun Chiang
  • ELECTROPLATING ADDITIVE AND PREPARATION METHOD FOR THE SAME
    Publication number: 20170029970
    Abstract: The present invention provides a carboxyl sulfonate compound and preparation method thereof. The present carboxyl sulfonate compound has structure of formula (A): wherein M1 is hydrogen or an alkali metal; M2 is hydrogen, alkyl or an alkali metal; Y is hydrogen, alkyl; carboxyl, carboxyl salt; alkylcarboxyl, or alkylcarboxyl salt; n is an integer from 1 to 10; and m is an integer from 1 to 10. The carboxylic group and the sulfonic acid group in the structure of the present carboxyl sulfonate compound show excellent chelating ability to metal ions; therefore, the present carboxyl sulfonate compound is particularly for use in electroplating additive.
    Type: Application
    Filed: July 6, 2016
    Publication date: February 2, 2017
    Inventors: Kun-Hsin LEE, Ying-Jin CHEN, Tzu-Hua FENG, Li-Jane HER, Chia-Jun CHIANG