Patents by Inventor Chia-Jung Kuo

Chia-Jung Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure having at least one die with a plurality of taper-shaped die connectors
    Patent number: 11990383
    Abstract: A conductive structure, includes: a plurality of conductive layers; a plurality of conductive pillars being formed on the plurality of conductive layers, respectively; and a molding compound laterally coating the plurality of conductive pillars. Each of the plurality of conductive pillars is a taper-shaped conductive pillar, and is tapered from the conductive layers.
    Type: Grant
    Filed: November 2, 2022
    Date of Patent: May 21, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Jui Kuo, Hui-Jung Tsai, Tai-Min Chang, Chia-Wei Wang
  • Isolation Regions For Isolating Transistors and the Methods Forming the Same
    Publication number: 20240120236
    Abstract: A method includes etching a gate stack in a wafer to form a trench, depositing a silicon nitride liner extending into the trench, and depositing a silicon oxide layer. The process of depositing the silicon oxide layer includes performing a treatment process on the wafer using a process gas including nitrogen and hydrogen, and performing a soaking process on the wafer using a silicon precursor.
    Type: Application
    Filed: April 25, 2023
    Publication date: April 11, 2024
    Inventors: Tai-Jung Kuo, Po-Cheng Shih, Wan Chen Hsieh, Zhen-Cheng Wu, Chia-Hui Lin, Tze-Liang Lee
  • ELECTRONIC DEVICE
    Publication number: 20160238433
    Abstract: An electronic device includes a housing, a touch panel, a processor and one or more conductive rubbers. The touch panel has a contact surface. The processor is disposed inside the housing and coupled to the touch panel. When the one or more conductive rubbers contact the contact surface of the touch panel and the one or more conductive rubbers are compressed by a gravity provided by an object, the processor detects a first value on touch panel and obtains a weight of the object according to the first value.
    Type: Application
    Filed: February 3, 2016
    Publication date: August 18, 2016
    Inventors: Chia-Jung Kuo, Ming-Feng Liu, Kai-Ti Chang, Hsiu-Ching Cho