Abstract: The present invention discloses a switching regulator, and a control circuit and method for controlling a switching regulator. The switching regulator includes a power stage driven by a driver voltage outputted from a driver circuit. The present invention detects an input current to generate an input current detection signal, and adjusts an operation voltage supplied to the driver circuit according to the input current detection signal.

Abstract: A per-phase quick response generation circuit generates a quick response signal to determine a quick response pulse to be inserted into a pulse width modulation signal of the corresponding phase. The quick response pulse will force the upper power switch of the corresponding phase on to increase the current supply ability during load transition. A multi-phase voltage regulator with the quick response generation circuit can have different quick response pulse widths for the interleaved phases, so as to decrease the current imbalance period of the voltage regulator after load transition.

Abstract: An electrical fuse and a process of programming the same are presented. An electrical fuse comprises a lower level silicide layer on a non-doped or lightly-doped polysilicon layer, an upper level conductive layer, and a tungsten contact coupled between the lower level silicide layer and the upper level conductive layer. The tungsten contact and a neck portion of the silicide layer are the programmable portion of the electrical fuse. High post-programming resistance is achieved by a first programming phase that depletes silicide in the silicide layer, followed by a second programming phase that depletes tungsten in the tungsten contact.

Abstract: A DCR sense scheme is provided to sense the inductor current of a COT power converter. The DCR sense is implemented by using the direct current resistance of the output inductor of the COT power converter, and thus eliminates the ESR limitations on the type of output capacitors for stability concern. A quick response mechanism is further incorporated in the COT power converter to speed up the transient response of the COT power converter.

Abstract: A multi-phase power converter with constant on-time control includes a plurality of channels to convert an input voltage into an output voltage, and each of the channels is driven by a control signal. When all channel currents of the channels are balanced, each of the control signals remains a constant on-time. When the channel currents are imbalanced, the on-times of the control signals are modulated according to the difference between each channel current and a target value for current balance between the channels.

Abstract: An electrical fuse and a process of programming the same are presented. An electrical fuse comprises a lower level silicide layer on a non-doped or lightly-doped polysilicon layer, an upper level conductive layer, and a tungsten contact coupled between the lower level silicide layer and the upper level conductive layer. The tungsten contact and a neck portion of the silicide layer are the programmable portion of the electrical fuse. High post-programming resistance is achieved by a first programming phase that depletes silicide in the silicide layer, followed by a second programming phase that depletes tungsten in the tungsten contact.

Abstract: A multi-chip module (MCM) for power supply circuitry integrates a controller, a driver and two power MOSFETs in a single chip to shorten the signal path between the controller and the driver. When applied to a voltage regulator, the MCM shortens the feedback paths between the current sensors and the controller, so as to reduce the loss of and interference with the feedback signals, thereby improving the efficiency of the voltage regulator and simplifying the PCB traces routing.

Abstract: An electrical fuse and a process of programming the same are presented. An electrical fuse comprises a lower level silicide layer on a non-doped or lightly-doped polysilicon layer, an upper level conductive layer, and a tungsten contact coupled between the lower level silicide layer and the upper level conductive layer. The tungsten contact and a neck portion of the silicide layer are the programmable portion of the electrical fuse. High post-programming resistance is achieved by a first programming phase that depletes silicide in the silicide layer, followed by a second programming phase that depletes tungsten in the tungsten contact.

Abstract: A per-phase quick response generation circuit generates a quick response signal to determine a quick response pulse to be inserted into a pulse width modulation signal of the corresponding phase. The quick response pulse will force the upper power switch of the corresponding phase on to increase the current supply ability during load transition. A multi-phase voltage regulator with the quick response generation circuit can have different quick response pulse widths for the interleaved phases, so as to decrease the current imbalance period of the voltage regulator after load transition.

Abstract: An image sensor module including a substrate, an image signal processor, a supporting board, an image sensor chip and a cover is provided. A concavity is located on a surface of the substrate. The image signal processor is disposed in the concavity e, and is electrically connected to the substrate. The supporting board is disposed on the surface of the substrate and covers the concavity. The image sensor chip is disposed on the supporting board and electrically connected to the substrate. The cover is disposed on the substrate, and covers the image sensor chip.

Abstract: An image sensor module including a substrate, an image signal processor, a supporting board, an image sensor chip and a cover is provided. A concave is located on a surface of the substrate. The image signal processor is disposed in the concave, and is electrically connected to the substrate. The supporting board is disposed on the surface of the substrate and covers the concave. The image sensor chip is disposed on the supporting board and electrically connected to the substrate. The cover is disposed on the substrate, and covers the image sensor chip.