Abstract: An electronic package is provided, in which electronic elements and at least one packaging module including a semiconductor chip and a shielding structure covering the semiconductor chip are disposed on a carrier structure, an encapsulation layer encapsulates the electronic elements and the packaging module, and a shielding layer is formed on the encapsulation layer and in contact with the shielding structure. Therefore, the packaging module includes the semiconductor chip and the shielding structure and has a chip function and a shielding wall function simultaneously.

Abstract: In a file sharing system, a key manager unit realizes a correspondence between the first user identifier and the first public key in response to a registration request of the first user, generates a first key material for encrypting the first file into a first encrypted file, and generates a first credential according to the first user identifier, the first file identifier, the first public key and the first key material after receiving an access-right claim request to the first file from the first user. A file storage unit stores the first encrypted file and the first credential. The first user uses the first user identifier, the first file identifier and the first private key to retrieve the first key material out of the first credential, and uses the first key material to decrypt the first encrypted file into the first file.

Abstract: An integrated circuit includes an upper threshold circuit configured to set a logic level of a first enabling signal, a lower threshold circuit configured to set a logic level of a second enabling signal, and a control circuit configured to change an output voltage signal in response to a condition that the logic level of the first enabling signal and the logic level of the second enabling signal are changed consecutively. In the control circuit, a first switch is electrically connected to a second switch at a buffer output node. The control circuit includes a regenerative circuit configured to maintain the output voltage signal at the buffer output node while each of the first switch and the second switch is at a disconnected state.

Abstract: An optical water-quality detection apparatus includes a detection device, a biofilm-inhibition light source, a detection light source and a sensor. The detection device includes a detection chamber. The biofilm-inhibition light source is disposed outside the detection chamber and configured to emit biofilm-inhibition light. The detection light source is disposed outside the detection chamber and configured to emit detection light. The sensor is configured to sense the detection light penetrating the detection chamber. A beam of the detection light and a beam of the inhibition light overlaps as penetrating the detection chamber.

Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.

Abstract: A tiered locking mechanism secures a component card to a printed circuit board and includes a base, a top slider structure, and a biasing element. The base includes a first-tier side wall and a coupling structure configured to engage the PCB. The top slider structure includes a second-tier side wall along with protrusions having a beveled edge. The top slider structure is slidable between locked and unlocked positions. The unlocked position includes the protrusions being displaced away from a component card engagement side relative to the locked position. A bottom one of the protrusions and the first-tier side wall form a first receiving slot in the locked position. Atop one of the plurality of protrusions and the second-tier wall form a second receiving slot. The biasing element is configured to urge the top slider structure toward the locked position and to compress as the top slider structure moves away from the component card engagement side.

Abstract: A semiconductor device includes a substrate, a buffer layer disposed on the substrate, a barrier layer disposed on the buffer layer, a source, a drain, and a gate stack. The source, the drain, and the gate stack are disposed on the barrier layer. The gate stack includes a first epitaxial layer on the barrier layer, a second epitaxial layer on the first epitaxial layer, and a third epitaxial layer on the second epitaxial layer. The semiconductor device further includes a gate disposed on the gate stack.

Abstract: A tiered locking mechanism secures a component card to a printed circuit board and includes a base, a top slider structure, and a biasing element. The base includes a first-tier side wall and a coupling structure configured to engage the PCB. The top slider structure includes a second-tier side wall along with protrusions having a beveled edge. The top slider structure is slidable between locked and unlocked positions. The unlocked position includes the protrusions being displaced away from a component card engagement side relative to the locked position. A bottom one of the protrusions and the first-tier side wall form a first receiving slot in the locked position. Atop one of the plurality of protrusions and the second-tier wall form a second receiving slot. The biasing element is configured to urge the top slider structure toward the locked position and to compress as the top slider structure moves away from the component card engagement side.

Abstract: An air baffle for optimizing thermal performance of memory components provided in a chassis is disclosed. The air baffle has a body and one or more venting units provided on the body. The body is configured to be removably coupled to the chassis. The body covers the memory components when coupled to the chassis. The one or more venting units direct air flowing through the chassis. Each of the venting units includes vent openings and a corresponding number of adjustable venting plates. The vent openings are each aligned with the memory components when the body is coupled to the chassis. Each of the adjustable venting plates have an open position or a closed position. A respective venting plate of the adjustable venting plates in the open position allows airflow through a respective vent opening of the vent openings. The respective venting plate of the adjustable venting plates in the closed position blocks airflow through the respective vent opening of the vent openings.

Abstract: The present invention provides an inpatient unit of modular design, built of recycled materials and environmentally friendly materials, allowing reconfiguration, redeployment and quick assembly, preventing indoor air from leaking, applicable to epidemic prevention and treating special patients, with high structural strength, lower cost and good environmental benefit.

Abstract: An air baffle for optimizing thermal performance of memory components provided in a chassis is disclosed. The air baffle has a body and one or more venting units provided on the body. The body is configured to be removably coupled to the chassis. The body covers the memory components when coupled to the chassis. The one or more venting units direct air flowing through the chassis. Each of the venting units includes vent openings and a corresponding number of adjustable venting plates. The vent openings are each aligned with the memory components when the body is coupled to the chassis. Each of the adjustable venting plates have an open position or a closed position. A respective venting plate of the adjustable venting plates in the open position allows airflow through a respective vent opening of the vent openings. The respective venting plate of the adjustable venting plates in the closed position blocks airflow through the respective vent opening of the vent openings.

Abstract: Disclosed are an anti-off device and a protective hat having the anti-off device. The protective hat includes a hat body, protective goggles, a binding strap and an anti-off device. The hat body has a slot; the protective goggles and the binding strap are bundled altogether with the hat body; the anti-off device includes an anti-off body and snap arm. The anti-off body has a passage; a snap arm integrally coupled to the anti-off body, and the snap arm is inserted into the slot and the snap body is detachably engaged with the hat body, and the binding strap is disposed in the passage, such that when the protective goggles are moved upward or downward, the binding strap is still limited by passage to achieve the anti-off effect.

Abstract: A personalization skin care product system includes a measuring device and a processor. The measuring device measures a user's skin information; the processor executing a computer program product provides a personalization suggestion message according to the user's skin information; wherein, the personalization suggestion message corresponds to a user controllable interface of an adjustable skin care product device, wherein the adjustable skin care product device provides a personalization skin care product with different volume proportion of the ingredients according to the different instructions from the user controllable interface.

Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.

Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.

Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.

Abstract: A personalization skin care product system includes a measuring device and a processor. The measuring device measures a user's skin information; the processor executing a computer program product provides a personalization suggestion message according to the user's skin information; wherein, the personalization suggestion message corresponds to a user controllable interface of an adjustable skin care product device, wherein the adjustable skin care product device provides a personalization skin care product with different volume proportion of the ingredients according to the different instructions from the user controllable interface.

Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, an LED chip, and an adhesive layer. The circuit board comprises a chip-attachment area, the conductive layer being disposed on the chip-attachment area, the LED chip being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the LED chip to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the LED chip after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.

Abstract: The present invention relates to a process for producing organic carboxylic acid amides by nitrile hydrolysis of a nitrile compound at certain temperature and pressure in the presence of a catalyst to produce an organic carboxylic acid amide.

Abstract: The present invention relates to a process for producing carboxylic acid anhydrides by the carbonylation reaction of a carboxylic acid ester, derived from an alcohol and a carboxylic acid, with carbon monoxide containing a small amount of hydrogen in a liquid reaction medium in the presence of a Group VIII B catalyst to produce a carboxylic acid anhydride. The liquid reaction medium comprises the Group VIII B catalyst, an organic halide, the carboxylic acid ester, an alkali metal salt, the carboxylic acid anhydride, the carboxylic acid, N-acetylimidazole as a protecting agent, and ethylidene diacetate (EDA) as an organic promoter. By making use of the protecting agent of N-acetylimidazole, metal ions in the reactor can be prevented from reacting with EDA so as to reduce the formation of hardly-soluble tars during the reaction. Also, the EDA organic promoter is kept at a certain content in the system to promote the overall carbonylation reaction rate.