Abstract: A semiconductor device includes a plurality of nanostructures extending in a first direction above a semiconductor substrate and arranged in a second direction substantially perpendicular to the first direction and a gate structure extending in a third direction perpendicular to both the first and second directions, the gate structure surrounding each of the plurality of nanostructures. Each of the plurality of nanostructures has an outer region having a composition different from a composition of an inner region of each of the plurality of the nanostructures. The gate structure includes a plurality of high-k gate dielectric layers respectively surrounding the plurality of nanostructures, a work function layer surrounding each of the plurality of high-k gate dielectric layers and a fill metal layer surrounding the work function layer.

Abstract: In an embodiment, a pattern transfer processing chamber includes a pattern transfer processing chamber and a loading area external to the pattern transfer processing chamber. The loading area is configured to transfer a wafer to or from the pattern transfer processing chamber. The loading area comprises a first region including a loadport, a second region including a load-lock between the first region and the pattern transfer processing chamber, and an embedded baking chamber configured to heat a patterned photoresist on the wafer.

Abstract: A method for fabricating semiconductor device includes: forming a first semiconductor layer and an insulating layer on a substrate; removing the insulating layer and the first semiconductor layer to form openings; forming a second semiconductor layer in the openings; and patterning the second semiconductor layer, the insulating layer, and the first semiconductor layer to form fin-shaped structures.

Abstract: A method for fabricating a semiconductor device is provided. The method includes coating a photoresist film over a target layer over a semiconductor substrate; performing a lithography process to pattern the photoresist film into a photoresist layer; performing a directional ion bombardment process to the photoresist layer along a direction tilted with respect to a normal direction of the semiconductor substrate, such that a carbon atomic concentration in the photoresist layer is increased; and etching the target layer using the photoresist layer as an etch mask.

Abstract: The present disclosure generally relates to managing one or more displays. In particular, methods for moving an indicator between displays, moving an indicator based on body movement, and managing display operations are discussed herein.

Abstract: A semiconductor device includes a substrate having a high-voltage (HV) region, a medium-voltage (MV) region, and a low-voltage (LV) region, a HV device on the HV region, and a LV device on the LV region. Preferably, the HV device includes a first base on the substrate, a first gate dielectric layer on the first base, and a first gate electrode on the first gate dielectric layer. The LV device includes a fin-shaped structure on the substrate and a second gate electrode on the fin-shaped structure, in which a top surface of the first gate dielectric layer is lower than a top surface of the fin-shaped structure.

Abstract: A method for fabricating semiconductor device includes: forming a first semiconductor layer and an insulating layer on a substrate; removing the insulating layer and the first semiconductor layer to form openings; forming a second semiconductor layer in the openings; and patterning the second semiconductor layer, the insulating layer, and the first semiconductor layer to form fin-shaped structures.

Abstract: A damper device and an electronic apparatus are provided. The damper device includes a first holder, a first damper component and a first gel. The first damper component includes a first protrusion part and a first bar part. The first protrusion part includes a first surface. The first bar part includes a first free end and a first fixed end. The first protrusion part is fixed on the first free end, the first fixed end is fixed on the first holder and the first surface protrudes outward from the first free end. The first free end and the first protrusion part are inserted into the first gel, and the first gel moves along the radial direction of the first bar part relative to the first bar part.

Abstract: A semiconductor device includes a plurality of nanostructures extending in a first direction above a semiconductor substrate and arranged in a second direction substantially perpendicular to the first direction and a gate structure extending in a third direction perpendicular to both the first and second directions, the gate structure surrounding each of the plurality of nano structures. Each of the plurality of nanostructures has an outer region having a composition different from a composition of an inner region of each of the plurality of the nanostructures. The gate structure includes a plurality of high-k gate dielectric layers respectively surrounding the plurality of nanostructures, a work function layer surrounding each of the plurality of high-k gate dielectric layers and a fill metal layer surrounding the work function layer.

Abstract: A method for fabricating a semiconductor device includes first providing a substrate having a high-voltage (HV) region, a medium-voltage (MV) region, and a low-voltage (LV) region, forming a HV device on the HV region, and forming a LV device on the LV region. Preferably, the HV device includes a first base on the substrate, a first gate dielectric layer on the first base, and a first gate electrode on the first gate dielectric layer. The LV device includes a fin-shaped structure on the substrate, and a second gate electrode on the fin-shaped structure, in which a top surface of the first gate dielectric layer is lower than a top surface of the fin-shaped structure.

Abstract: The present disclosure relates to a system, a method and a computer-readable medium for data accessing. The method includes receiving a request, receiving a status parameter of an endpoint corresponding to the request, receiving a number of times of receiving the request in a period of time, and determining a delay time length for transmitting the request according to the status parameter of the endpoint or the number of times of receiving the request in the period of time. The present disclosure can achieve more efficient resource allocation and can prevent server outage.

Abstract: The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a gate structure over the substrate, a layer of dielectric material over the gate structure, a source/drain (S/D) contact layer formed through and adjacent to the gate structure, and a trench conductor layer over and in contact with the S/D contact layer. The S/D contact layer can include a layer of platinum-group metallic material and a silicide layer formed between the substrate and the layer of platinum-group metallic material. A top width of a top portion of the layer of platinum-group metallic material can be greater than or substantially equal to a bottom width of a bottom portion of the layer of platinum-group metallic material.

Abstract: In an embodiment, a method includes: placing a wafer on an implanter platen, the wafer including alignment marks; measuring a position of the wafer by measuring positions of the alignment marks with one or more cameras; determining an angular displacement between the position of the wafer and a reference position of the wafer; and rotating the implanter platen by the angular displacement.

Abstract: A multi-use monitoring system is disclosed, which comprises an electronic device, multiple sensor devices, multiple cameras, at least one wireless interface, and a remote electronic device. According to the present invention, the sensor devices are adopted for detecting multiple environmental parameters such as gas level, humidity and temperature, and the multiple cameras are controlled to acquire images from the poultry bred in a breeding environment. Therefore, after receiving the images and the environmental parameters from the electronic device, the remote electronic device can extract at least one poultry characteristic from the images, and then correlate the environmental parameters to the poultry characteristic(s). As a result, the remote electronic device can subsequently calculate an evaluation score according to the growth and/or health state of the poultry, such that the breeder can plan how to distribute the breeding resources for the poultry.

Abstract: A thermal compensation system for machine tools includes a thermal compensation-monitoring device and a cloud processing device. The thermal compensation-monitoring device receives a plurality of temperature signals of a workpiece and corresponding processing tolerance data to build or update a thermal compensation database. The cloud processing device provides a thermal compensation model, and applies the model with the characterized temperature signals and the tolerance data to generate a compensation value so as to decide whether or not to modify the model or to run a compensation is necessary.

Abstract: A method for identifying an object, an optical sensing apparatus and a system are provided. A controller of the system drives multiple light sources of the optical sensing apparatus to emit the multiple light beams with different beam angles, controls a light sensor to sense the lights reflected by the object, and performs the method for identifying the object. In the method, the light sensor is used to sense a first light emitted by a first light source with a first beam angle reflected by the object, and sense an intensity of the reflected first light. The light sensor is also used to sense a second light emitted by a second light source with a second beam angle reflected by the object and sense another intensity of the reflected second light. Therefore, the object can be identified by integrating information of the intensities obtained by the light sensor.

Abstract: A stretchable pixel array substrate includes a base, pixel structures and a gate driving circuit electrically connected to the pixel structures. The base has an active area and a peripheral area outside the active area. The peripheral area has openings to define first islands, second islands and first bridges of the peripheral area. An area of each of the first islands is greater than an area of each of the second islands. At least a part of the first bridges is connected between the first islands and the second islands. The pixel structures are disposed on the active area of the base. The gate driving circuit includes first parts disposed on the first islands and second parts disposed on the second islands and electrically connected to the first parts.

Abstract: A method for identifying an object, an optical sensing apparatus and a system are provided. A controller of the system drives multiple light sources of the optical sensing apparatus to emit the multiple light beams with different beam angles, controls a light sensor to sense the lights reflected by the object, and performs the method for identifying the object. In the method, the light sensor is used to sense a first light emitted by a first light source with a first beam angle reflected by the object, and sense an intensity of the reflected first light. The light sensor is also used to sense a second light emitted by a second light source with a second beam angle reflected by the object and sense another intensity of the reflected second light. Therefore, the object can be identified by integrating information of the intensities obtained by the light sensor.

Abstract: A distance determining system comprising: a light source, configured to emit light; a first light sensing region, away from the light source for a first distance, comprising at least one first light sensing device; a second light sensing region, away from the light source for a second distance larger than the first distance, comprising at least one second light sensing device; and a processing circuit, configured to compute distance information of an object which reflects the light to the first light sensing region and the second light sensing region, according to a first relation between a first light intensity sensed by the first light sensing region and a second light intensity sensed by the second light sensing region.

Abstract: A method for identifying an object, an optical sensing apparatus and a system are provided. A controller of the system drives multiple light sources of the optical sensing apparatus to emit the multiple light beams with different beam angles, controls a light sensor to sense the lights reflected by the object, and performs the method for identifying the object. In the method, the light sensor is used to sense a first light emitted by a first light source with a first beam angle reflected by the object, and sense an intensity of the reflected first light. The light sensor is also used to sense a second light emitted by a second light source with a second beam angle reflected by the object and sense another intensity of the reflected second light. Therefore, the object can be identified by integrating information of the intensities obtained by the light sensor.