Patents by Inventor Chia-Lang CHANG

Chia-Lang CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power and Ground Ring Layout
    Publication number: 20080029893
    Abstract: An integrated circuit layout on a semiconductor substrate includes a plurality of circuit modules and power rails. One of the power rails is a positive voltage supply rail, and another one is a negative voltage supply rail or a ground rail. The positive voltage supply rail is located on a first layer of the semiconductor substrate. The negative voltage supply rail is located on a second layer of the semiconductor substrate. The second layer is located below the first layer. In this way, the integrated circuit layout area is reduced as negative voltage supply rail is moved to another layer.
    Type: Application
    Filed: July 20, 2007
    Publication date: February 7, 2008
    Applicant: Broadcom Corporation
    Inventor: Chia-Lang CHANG