Patents by Inventor Chia-Le WU

Chia-Le WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite structure
    Patent number: 10723893
    Abstract: A composite structure is provided, which includes a support, an active layer wrapping the support, a dendrimer grafted to the active layer through covalent bondings, and a plurality of anti-fouling groups, wherein each of the anti-fouling groups is grafted to terminals of the dendrimer through covalent bondings. The terminals of the dendrimer include amino group, hydroxyl group, or thiol group.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: July 28, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jen-You Chu, Chia-Le Wu, Feng-Sheng Kao, Chin-Ping Huang, Yi-Chun Chen
  • COMPOSITE STRUCTURE
    Publication number: 20180258295
    Abstract: A composite structure is provided, which includes a support, an active layer wrapping the support, a dendrimer grafted to the active layer through covalent bondings, and a plurality of anti-fouling groups, wherein each of the anti-fouling groups is grafted to terminals of the dendrimer through covalent bondings. The terminals of the dendrimer include amino group, hydroxyl group, or thiol group.
    Type: Application
    Filed: March 7, 2018
    Publication date: September 13, 2018
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jen-You CHU, Chia-Le WU, Feng-Sheng KAO, Chin-Ping HUANG, Yi-Chun CHEN