Patents by Inventor Chia-Li Lin

Chia-Li Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250216463
    Abstract: The present invention provides a battery quality detection method, comprising the following steps: selecting a plurality of test data with a data concentration greater than a first threshold; determining an upper limit curve and a lower limit curve for the selected test data; setting a standard detection range between the upper limit curve and the lower limit curve; obtaining a battery characteristic waveform of a battery; and comparing the battery characteristic waveform with the standard detection range to evaluate the battery's quality.
    Type: Application
    Filed: December 23, 2024
    Publication date: July 3, 2025
    Inventors: Jih-Hsing LEE, Chia-Li LIN, Hui-Shan LIU
  • Patent number: 12300644
    Abstract: In an embodiment, a device includes: a dielectric layer over an active surface of a semiconductor substrate; a conductive via in the dielectric layer, the conductive via including a first copper layer having a non-uniform grain orientation; and a bonding pad over the conductive via and in the dielectric layer, the bonding pad including a second copper layer having a uniform grain orientation, a top surface of the bonding pad being coplanar with a top surface of the dielectric layer.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: May 13, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Hsiung Lu, Ming-Da Cheng, Chia-Li Lin, Yu-Chih Huang, Chen-Shien Chen
  • Publication number: 20230307392
    Abstract: In an embodiment, a device includes: a dielectric layer over an active surface of a semiconductor substrate; a conductive via in the dielectric layer, the conductive via including a first copper layer having a non-uniform grain orientation; and a bonding pad over the conductive via and in the dielectric layer, the bonding pad including a second copper layer having a uniform grain orientation, a top surface of the bonding pad being coplanar with a top surface of the dielectric layer.
    Type: Application
    Filed: June 15, 2022
    Publication date: September 28, 2023
    Inventors: Wen-Hsiung Lu, Ming-Da Cheng, Chia-Li Lin, Yu-Chih Huang, Chen-Shien Chen
  • Publication number: 20070210981
    Abstract: An automatic address dispatch method for control of a plurality of light emitting units includes the following steps, Step 1: installing a server having a network float address protocol; Step 2: providing a light emitting device with the same network float address protocol as that of the server; Step 3: the server being connected to one or a plurality of the light emitting device via a network; Step 4: the server automatically dispatching a unique address to each light emitting device on the network according to the network float address protocol; Step 5: the server relatively controlling the response of each light emitting device on network by the unique address.
    Type: Application
    Filed: March 8, 2006
    Publication date: September 13, 2007
    Inventors: Chien-wen Chung, Chia-Li Lin
  • Publication number: 20070127230
    Abstract: A molding light box and assembly includes a lighting source in each box. The lighting source comprises an input terminal and an output terminal to connect the boxes together and to transmit power supply and signal. A control unit is connected to control the light sources in all of the boxes to turn them on/off, blinking and the strength of the illumination, etc.
    Type: Application
    Filed: December 5, 2005
    Publication date: June 7, 2007
    Inventors: Chien-Wen Chung, Chia-Li Lin