Patents by Inventor Chia Lim

Chia Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulated external stiffener for flip chip package
    Publication number: 20070152326
    Abstract: The present invention relates to an external stiffener featuring reinforcing bars and a polymer and a method to make the same. In an embodiment, the stiffener may be used to decrease warpage in the package substrate caused by high temperature processing. In an embodiment, the reinforced bars are disposed over the die attach side of the package substrate. In an embodiment, the polymer may encapsulate a semiconductor die coupled to a package substrate.
    Type: Application
    Filed: December 29, 2005
    Publication date: July 5, 2007
    Inventors: Chia Lim, Chun See, Tze Hin