Patents by Inventor Chia-Ling Wang
Chia-Ling Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Patent number: 11931187Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.Type: GrantFiled: March 16, 2018Date of Patent: March 19, 2024Assignees: Chang Gung Medical Foundation Chang Gung Memorial Hospital at Keelung, Chang Gung Memorial Hospital, Linkou, Chang Gung UniversityInventors: Jiun-Jie Wang, Yi-Hsin Weng, Shu-Hang Ng, Jur-Shan Cheng, Yi-Ming Wu, Yao-Liang Chen, Wey-Yil Lin, Chin-Song Lu, Wen-Chuin Hsu, Chia-Ling Chen, Yi-Chun Chen, Sung-Han Lin, Chih-Chien Tsai
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Patent number: 11916314Abstract: A mobile device includes a housing, a first radiation element, a second radiation element, a third radiation element, a first switch element, and a second switch element. The first radiation element has a first feeding point. The second radiation element has a second feeding point. The first radiation element, the second radiation element, and the third radiation element are distributed over the housing. The first switch element is closed or open, so as to selectively couple the first radiation element to the third radiation element. The second switch element is closed or open, so as to selectively couple the second radiation element to the third radiation element. An antenna structure is formed by the first radiation element, the second radiation element, and the third radiation element.Type: GrantFiled: May 12, 2022Date of Patent: February 27, 2024Assignee: HTC CorporationInventors: Cheng-Hung Lin, Szu-Po Wang, Chia-Te Chien, Chun-Chieh Wang, Kang-Ling Li, Chun-Hsien Lee, Yu-Chieh Chiu
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Publication number: 20230231035Abstract: A manufacturing method of a semiconductor device includes the following steps. A first recess and a second recess are formed in a first region and a second region of a semiconductor substrate, respectively. A bottom surface of the first recess is lower than a bottom surface of the second recess in a vertical direction. A first gate oxide layer and a second gate oxide layer are formed concurrently. At least a portion of the first gate oxide layer is formed in the first recess, and at least a portion of the second gate oxide layer is formed in the second recess. A removing process is performed for removing a part of the second gate oxide layer. A thickness of the second gate oxide layer is less than a thickness of the first gate oxide layer after the removing process.Type: ApplicationFiled: February 17, 2022Publication date: July 20, 2023Applicant: UNITED MICROELECTRONICS CORP.Inventors: Wei-Lun Huang, Chia-Ling Wang, Chia-Wen Lu, Ta-Wei Chiu, Ping-Hung Chiang
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Publication number: 20230223306Abstract: Semiconductor device and method of fabricating the same, the semiconductor device includes a substrate, a first transistor, a second transistor, a third transistor, and a plurality of shallow trench isolations. The first transistor is disposed in a medium-voltage region and includes a first plane, a first gate dielectric layer, and a first gate electrode. The second transistor is disposed in a boundary region and includes a second plane, a second gate dielectric layer, and a second gate electrode. The third transistor is disposed in a lower-voltage region and includes a third plane, a third gate dielectric layer, and a third gate electrode. The shallow trench isolations are disposed in the substrate, wherein top surfaces of the shallow trench isolations in the medium-voltage region, the boundary region and the low-voltage region are coplanar with top surfaces of the first gate dielectric layer and the second gate dielectric layer.Type: ApplicationFiled: February 15, 2022Publication date: July 13, 2023Applicant: UNITED MICROELECTRONICS CORP.Inventors: Ta-Wei Chiu, Ping-Hung Chiang, Chia-Wen Lu, Chia-Ling Wang, Wei-Lun Huang
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Publication number: 20230207620Abstract: A semiconductor structure includes a substrate having a first device region and a second device region in proximity to the first device region. A trench isolation structure is disposed in the substrate between the first device region and the second device region. The trench isolation structure includes a first bottom surface within the first device region and a second bottom surface within the second device region. The first bottom surface is coplanar with the second bottom surface.Type: ApplicationFiled: January 18, 2022Publication date: June 29, 2023Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chia-Ling Wang, Ping-Hung Chiang, Wei-Lun Huang, Chia-Wen Lu, Ta-Wei Chiu
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Publication number: 20230080968Abstract: The invention provides a method for forming a semiconductor structure, which comprises providing a substrate, sequentially a first groove and a second groove are formed in the substrate, the depth of the first groove is different from the depth of the second groove, a first oxide layer is formed in the first groove, a second oxide layer is formed in the second groove, an etching step is performed to remove part of the first oxide layer, a first gate structure is formed on the first oxide layer, and a second gate structure is formed on the second oxide layer.Type: ApplicationFiled: October 6, 2021Publication date: March 16, 2023Applicant: UNITED MICROELECTRONICS CORP.Inventors: Wei-Lun Huang, Chia-Ling Wang, Chia-Wen Lu, Ping-Hung Chiang
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Patent number: 11436134Abstract: Various methods, apparatuses/systems, and media for integrating data are provided. A processor implements a data processing framework configured to run native on a big data platform and abstracts data processing constructs to a user friendly template, thereby eliminating necessity of user initiated tasks of instantiating language level objects. The processor also implements a core set of data pipeline configurations on the template configured to initiate a chain of user defined data transformations. A receiver operatively connected with the processor via a communication network receives input of the chain of the user defined data transformations. The processor tests each transformation independently of each other and outputs data integration solutions on the big data platform based on a positive test result.Type: GrantFiled: July 9, 2020Date of Patent: September 6, 2022Assignee: JPMORGAN CHASE BANK, N.A.Inventors: Vivek Mukherjee, Chia-Ling Wang, David Fu, Rajeswari Karuppasamy, Tara J Paider
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Publication number: 20220012170Abstract: Various methods, apparatuses/systems, and media for integrating data are provided. A processor implements a data processing framework configured to run native on a big data platform and abstracts data processing constructs to a user friendly template, thereby eliminating necessity of user initiated tasks of instantiating language level objects. The processor also implements a core set of data pipeline configurations on the template configured to initiate a chain of user defined data transformations. A receiver operatively connected with the processor via a communication network receives input of the chain of the user defined data transformations. The processor tests each transformation independently of each other and outputs data integration solutions on the big data platform based on a positive test result.Type: ApplicationFiled: July 9, 2020Publication date: January 13, 2022Applicant: JPMorgan Chase Bank, N.A.Inventors: Vivek MUKHERJEE, Chia-Ling WANG, David FU, Rajeswari KARUPPASAMY, Tara J PAIDER
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Patent number: 10475903Abstract: A transistor with dual spacers includes a gate, a first dual spacer and a second inner spacer. The gate is disposed on a substrate, wherein the gate includes a gate dielectric layer and a gate electrode, and the gate dielectric layer protrudes from the gate electrode and covers the substrate. The first dual spacer is disposed on the gate dielectric layer beside the gate, wherein the first dual spacer includes a first inner spacer and a first outer spacer. The second inner spacer having an L-shaped profile is disposed on the gate dielectric layer beside the first dual spacer. The present invention also provides a method of forming said transistor with dual spacers.Type: GrantFiled: January 28, 2019Date of Patent: November 12, 2019Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chia-Ling Wang, Ping-Hung Chiang, Chang-Po Hsiung, Chia-Wen Lu, Nien-Chung Li, Wen-Fang Lee, Chih-Chung Wang
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Patent number: 10453938Abstract: A transistor with dual spacers includes a gate, a first dual spacer and a second inner spacer. The gate is disposed on a substrate, wherein the gate includes a gate dielectric layer and a gate electrode, and the gate dielectric layer protrudes from the gate electrode and covers the substrate. The first dual spacer is disposed on the gate dielectric layer beside the gate, wherein the first dual spacer includes a first inner spacer and a first outer spacer. The second inner spacer having an L-shaped profile is disposed on the gate dielectric layer beside the first dual spacer. The present invention also provides a method of forming said transistor with dual spacers.Type: GrantFiled: December 18, 2017Date of Patent: October 22, 2019Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chia-Ling Wang, Ping-Hung Chiang, Chang-Po Hsiung, Chia-Wen Lu, Nien-Chung Li, Wen-Fang Lee, Chih-Chung Wang
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Publication number: 20190157421Abstract: A transistor with dual spacers includes a gate, a first dual spacer and a second inner spacer. The gate is disposed on a substrate, wherein the gate includes a gate dielectric layer and a gate electrode, and the gate dielectric layer protrudes from the gate electrode and covers the substrate. The first dual spacer is disposed on the gate dielectric layer beside the gate, wherein the first dual spacer includes a first inner spacer and a first outer spacer. The second inner spacer having an L-shaped profile is disposed on the gate dielectric layer beside the first dual spacer. The present invention also provides a method of forming said transistor with dual spacers.Type: ApplicationFiled: January 28, 2019Publication date: May 23, 2019Inventors: Chia-Ling Wang, Ping-Hung Chiang, Chang-Po Hsiung, Chia-Wen Lu, Nien-Chung Li, Wen-Fang Lee, Chih-Chung Wang
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Publication number: 20190157418Abstract: A transistor with dual spacers includes a gate, a first dual spacer and a second inner spacer. The gate is disposed on a substrate, wherein the gate includes a gate dielectric layer and a gate electrode, and the gate dielectric layer protrudes from the gate electrode and covers the substrate. The first dual spacer is disposed on the gate dielectric layer beside the gate, wherein the first dual spacer includes a first inner spacer and a first outer spacer. The second inner spacer having an L-shaped profile is disposed on the gate dielectric layer beside the first dual spacer. The present invention also provides a method of forming said transistor with dual spacers.Type: ApplicationFiled: December 18, 2017Publication date: May 23, 2019Inventors: Chia-Ling Wang, Ping-Hung Chiang, Chang-Po Hsiung, Chia-Wen Lu, Nien-Chung Li, Wen-Fang Lee, Chih-Chung Wang
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Patent number: 9168938Abstract: A folding ball trolley having a minimized volume has a frame, a bag and multiple resilient elements. The frame has four stand rods, four top seats, four sliding seats, four wheels, four connecting rod assemblies and four mounting rods. The bag connects to the mounting rods, and the mounting rods pivotally connect to the stand rods. Accordingly, the mounting rods can be rotated relative to the stand rods, such that the mounting rods do not protrude upward to occupy too much space when the ball trolley is folded. Besides, the frame is braced by the resilient elements so a user does not have to stretch his hands between the rods when folding the ball trolley, thereby preventing the hands from being clamped.Type: GrantFiled: May 7, 2013Date of Patent: October 27, 2015Inventor: Chia-Ling Wang
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Patent number: 8967658Abstract: A folding ball trolley has a frame and a bag. The frame has two main rod assemblies and two connecting rod assemblies. When the folding ball trolley is expanded, the main rods and the connecting rods lean outward under gravity until the main rods brace the bag. The bag holds the main rods at a specific angle, and the main rods hold the connecting rods at a specific angle. The main rod assemblies and the connecting rod assemblies are connected into a rectangle, such that the frame is expanded horizontally when the rods are leant outward. Thus, the folding ball trolley can achieve auto expansion without any resilient element, and therefore a user does not have to resist the resilient force when folding. Besides, the amount of the rods is reduced to eight (four main rods and four connecting rods), which reduces the manufacturing cost and facilitates ease of assembly.Type: GrantFiled: April 25, 2014Date of Patent: March 3, 2015Inventor: Chia-Ling Wang
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Publication number: 20140291969Abstract: A folding ball trolley having minimized volume has a frame, a bag and multiple resilient elements. The frame has four stand rods, four top seats, four sliding seats, four wheels, four connecting rod assemblies and four mounting rods. The bag connects to the mounting rods and the mounting rods pivotally connect to the stand rods. Accordingly, the mounting rods can be rotated relative to the stand rods such that the mounting rods do not protrude upward to occupy too much space when the ball trolley is folded. Besides, the frame is braced by the resilient elements so a user does not have to stretch his hands between the rods when folding the ball trolley, thereby preventing the hands from being clamped.Type: ApplicationFiled: May 7, 2013Publication date: October 2, 2014Inventor: Chia-Ling Wang