Patents by Inventor Chia Ling Wen

Chia Ling Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220204682
    Abstract: A bio-polyol composition, a foam composition, and a foam material are provided. The bio-polyol composition includes 25-70 parts by weight of lignin; 30-75 parts by weight of non-amine-based polyol; and, 2-17 parts by weight of amine-based polyether polyol. In particular, the sum of the weight of the lignin and the non-amine-based polyol is 100 parts by weight.
    Type: Application
    Filed: December 28, 2020
    Publication date: June 30, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Pin CHUANG, Yi-Che SU, Chia-Ling WEN
  • Patent number: 8123918
    Abstract: A method for fabricating semiconductor wafers using physical vapor deposition. The method includes maintaining a substrate on a susceptor in a chamber. The substrate has a face positioned within a vicinity of a target material, which is within the chamber. The target member comprises a first side and a second side. Preferably, the first side is positioned toward the face of the substrate. The method includes operating a magnet device fixed about a rotating member, which is coupled to the chamber and is coupled to a drive motor, which is coupled to a driver. A magnet device is positioned from a center region of the rotating member by a predetermined dimension. The method includes moving the magnet device in an annular manner about the center region using the rotating member. The magnet device is rotated at a velocity v and influences a spatial region, which is positioned overlying the second side of the target.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: February 28, 2012
    Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventor: Chia-Ling Wen
  • Publication number: 20080142360
    Abstract: A method for fabricating semiconductor wafers using physical vapor deposition. The method includes maintaining a substrate on a susceptor in a chamber. The substrate has a face positioned within a vicinity of a target material, which is within the chamber. The target member comprises a first side and a second side. Preferably, the first side is positioned toward the face of the substrate. The method includes operating a magnet device fixed about a rotating member, which is coupled to the chamber and is coupled to a drive motor, which is coupled to a driver. A magnet device is positioned from a center region of the rotating member by a predetermined dimension. The method includes moving the magnet device in an annular manner about the center region using the rotating member. The magnet device is rotated at a velocity v and influences a spatial region, which is positioned overlying the second side of the target.
    Type: Application
    Filed: February 6, 2008
    Publication date: June 19, 2008
    Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventor: CHIA-LING WEN
  • Patent number: 7351596
    Abstract: A method for fabricating semiconductor wafers using physical vapor deposition. The method includes maintaining a substrate on a susceptor in a chamber. The substrate has a face positioned within a vicinity of a target material, which is within the chamber. The target member comprises a first side and a second side. Preferably, the first side is positioned toward the face of the substrate. The method includes operating a magnet device fixed about a rotating member, which is coupled to the chamber and is coupled to a drive motor, which is coupled to a driver. A magnet device is positioned from a center region of the rotating member by a predetermined dimension. The method includes moving the magnet device in an annular manner about the center region using the rotating member. The magnet device is rotated at a velocity v and influences a spatial region, which is positioned overlying the second side of the target.
    Type: Grant
    Filed: October 7, 2005
    Date of Patent: April 1, 2008
    Assignee: Seminconductor Manufacturing International (Shanghai) Corporation
    Inventor: Chia Ling Wen