Abstract: A heat-dissipating structure is assembled on a Central Processing Unit, and has a water-cooling device, a fan and a support device. The support device is assembled between the water-cooling device and the fan to form an accommodating space. Hence, the heat-dissipating device can efficiently dissipate the heat from the Central Processing Unit and another electronic element that is disposed in the vicinity of the Central Processing Unit. Furthermore, the air-guiding device can guide the air from the fan to the correct place for cooling the Central Processing Unit or another electronic element.

Abstract: A heat-dissipating structure is assembled on a CUP, and has a water-cooling device, a fan and a support device. The support device is assembled between the water-cooling device and the fan to form an accommodating space. Hence the heat-dissipating device can dissipate efficiently the heat from the CPU and another electronic element that disposes around the CPU. Furthermore, the wind-guiding device can guide the wind from the fan to correct place for cooling the CPU or another electronic element. Hence the present invention can provide a comprehensive heat-dissipating effect on the CPU.

Abstract: A heat-dissipating device is provided. The heat-dissipating device is capable of cooperating a cross-flow type fan, mainly comprising a heat-conductive base plate attached with at least one heat-conductive pipe, and fixedly provided with a plurality of fins on the heat-conductive pipe. An air-outlet gap is naturally formed between any two of the adjacent fins, and an accommodating opening is disposed at an identical location on each of said fins. Within the accommodating opening, a cross-flow type fan is further presented. When fan blades of the cross-flow type fan rotating, an airflow thus generated is allowed for uniformly contacting with each of said fins and discharged through said air-outlet gaps. Thereby, not only the significantly raised effect of heat-dissipation of the heat-conductive base plate, but also the effectively reduced working noise due to a parallel path of the airflow with respect to the fins may be obtained.

Abstract: A heat-dissipating device is provided. The heat-dissipating device is capable of cooperating a cross-flow type fan, mainly comprising a heat-conductive base plate attached with at least one heat-conductive pipe, and fixedly provided with a plurality of fins on the heat-conductive pipe. An air-outlet gap is naturally formed between any two of the adjacent fins, and an accommodating opening is disposed at an identical location on each of said fins. Within the accommodating opening, a cross-flow type fan is further presented. When fan blades of the cross-flow type fan rotating, an airflow thus generated is allowed for uniformly contacting with each of said fins and discharged through said air-outlet gaps. Thereby, not only the significantly raised effect of heat-dissipation of the heat-conductive base plate, but also the effectively reduced working noise due to a parallel path of the airflow with respect to the fins may be obtained.

Abstract: The present invention provides a thermoelectric cooling apparatus for cooling an electronic device such as a CPU, or a computer chip. The apparatus cools the electronic device by two stages. In the first stage, a heat absorbing block collects the heat produced by the electronic device and the apparatus pre-cools the electronic device by dissipating a portion of the collected heat in a distant location through a front heat conductive device and a front radiator. Thereby the heat of the electronic device is reduced to a degree that a TEC can efficiently handle. In the second stage, a TEC of the apparatus dissipate the residual of the heat produced by the electronic device through at least a back heat pipe and a back radiator.

Abstract: A heat sink structure, having a heat sink and a thermal conductive block. The heat sink has a receiving slot recessed from a central portion of a bottom thereof. The thermal conductive block has a plurality of uneven surfaces thereon and a plurality of conical through holes therein. The thermal conductive block is pressed into the receiving slot while the heat sink is softened by heating, and the heat sink has a thermal expansion coefficient larger than the thermal conductive block, such that a wall of the receiving slot is partly extruded into or through the conical through holes, and the wall outside of the conical through holes is partly contracted into the conical holes in a cooling process after the thermal conductive block is pressed into the receiving slot. The conical through holes also provides the function of expelling gas, such that the thermal conductive block is firmly attached to the heat sink, and the heat dissipation effect is further enhanced.

Abstract: The present invention provides a wind cover locking element structure of heat radiator comprising a locking element, a heat radiator, a wind cover, and a socket. Projective sheet bodies are disposed at both sides of openings on two sideboards of the wind cover. The sheet bodies have abutting and positioning functions. When the locking element and the socket are locked together, the sheet bodies can abut against the locking portions of the locking element so as to be positioned, thereby reducing the shift between the locking element and the heat radiator. The heat radiator can thus be accurately stuck on a CPU.