Abstract: A chip package structure includes a substrate, a chip, a light-permeable element, and an adhesive element. The chip is disposed on the substrate. The light-permeable element is disposed above the chip. The adhesive element is connected between the chip and the light-permeable element. The adhesive element surrounds the chip for formation of an accommodating space, and the chip is located in the accommodating space. The adhesive element includes two material layers having complementary visible light absorption spectra, such that the adhesive element is capable of being used to absorb full visible spectrum light.

Abstract: The present disclosure provides a method for treating and/or preventing coccidiosis, including administering to a subject in need thereof a composition including an effective amount of a Bacillus spp.-fermented product. The Bacillus spp.-fermented product has the potential for development as feed additives and use as a possible solution to treat and/or prevent coccidiosis in the poultry industry.

Abstract: A light-emitting diode (LED) module includes a substrate, an LED, a first encapsulation element and a second light-pervious encapsulation element. The substrate has a first surface, a second surface, a circuit layer and an opening, wherein the opening penetrates through the first surface and the second surface, and the circuit layer includes at least one first conductive contact disposed on the first surface. The LED is disposed in the opening and is electrically connected to the first conductive contact. The first encapsulation element and the second light-pervious encapsulation element are respectively disposed on the first surface and the second surface, for encapsulating the LED and the first conductive contact. The aforementioned LED module may output light from the back of the LED, thereby improving the light output efficiency of the LED module. A manufacturing method of the aforementioned LED module is also herein disclosed.

Abstract: A light-emitting diode (LED) module includes a substrate, an LED, a first encapsulation element and a second light-pervious encapsulation element. The substrate has a first surface, a second surface, a circuit layer and an opening, wherein the opening penetrates through the first surface and the second surface, and the circuit layer includes at least one first conductive contact disposed on the first surface. The LED is disposed in the opening and is electrically connected to the first conductive contact. The first encapsulation element and the second light-pervious encapsulation element are respectively disposed on the first surface and the second surface, for encapsulating the LED and the first conductive contact. The aforementioned LED module may output light from the back of the LED, thereby improving the light output efficiency of the LED module. A manufacturing method of the aforementioned LED module is also herein disclosed.

Abstract: A brake device for a scooter includes a brake pedal having a stepping portion, at least one fender portion extending from at lease one side of the stepping portion, and at least one tubular member extending downward from the stepping portion. The fender portion is located above a wheel of the scooter. An elastic element mounted in the tubular member. A coupling seat is supported by a frame of the scooter and includes at least one coupling member on a top thereof. The coupling member is received in the tubular member and slidable along a vertical direction. The elastic element has a lower end abutting against a top face of the coupling member for biasing the fender portion away from the wheel. The stepping portion is pressable to move the fender portion downward to press against the wheel for braking purposes.