Abstract: A sensing system is disclosed. The sensing system includes a sensor cartridge and a readout device. The sensor cartridge includes a sensing device and a micro-channel-structure. The sensing device includes a chip member and an electrode member arranged projectively offset from each other.

Abstract: A server device with a storage array module is provided. The server device includes a chassis, a motherboard module, and a storage array module. The motherboard module and the storage array module are disposed in the chassis. The storage array module includes a first tray removably disposed in the chassis, a hard disk back panel fixed to a bottom of the first tray, and several hard disks hot-pluggably disposed in the first tray. The hard disk back panel is electrically connected to the motherboard module, and the hard disks are electrically connected to the hard disk back panel and driven to move into/out the chassis with the first tray.

Abstract: A server device with a storage array module is provided. The server device includes a chassis, a motherboard module, and a storage array module. The motherboard module and the storage array module are disposed in the chassis. The storage array module includes a first tray removably disposed in the chassis, a hard disk back panel fixed to a bottom of the first tray, and several hard disks hot-pluggably disposed in the first tray. The hard disk back panel is electrically connected to the motherboard module, and the hard disks are electrically connected to the hard disk back panel and driven to move into/out the chassis with the first tray.

Abstract: A sever including a chassis, at least one first tray, at least one second tray, a power supply module, multiple input/output interface circuit boards, and multiple mother boards is provided. The first and second trays are slidably disposed in the chassis, and the first and second trays can be drawn out of the chassis in opposite directions. The power supply module is disposed on a bottom plate of the chassis. The input/output interface circuit boards are disposed on the first tray, respectively. The power supply module is located between two input/output interface circuit boards. Each input/output interface circuit board has multiple input/output interfaces. The mother boards are disposed on the second trays, respectively. The input/output interface circuit boards and the power supply module are correspondingly electrically connected to the mother boards.

Abstract: A sever including a chassis, at least one first tray, at least one second tray, a power supply module, multiple input/output interface circuit boards, and multiple mother boards is provided. The first and second trays are slidably disposed in the chassis, and the first and second trays can be drawn out of the chassis in opposite directions. The power supply module is disposed on a bottom plate of the chassis. The input/output interface circuit boards are disposed on the first tray, respectively. The power supply module is located between two input/output interface circuit boards. Each input/output interface circuit board has multiple input/output interfaces. The mother boards are disposed on the second trays, respectively. The input/output interface circuit boards and the power supply module are correspondingly electrically connected to the mother boards.

Abstract: A valveless micro impedance pump including a bottom layer, a middle layer, a top layer and a piezoelectric element. The middle layer and the top layer are sealed to form the water inlets/outlets, flow way, upper and lower vibration membranes and boss of the micropump. The piezoelectric element is fixed on the boss and the fixing seat. By means of the electric field effect, the upper and lower vibration membranes are pushed by the piezoelectric element through the boss. The medium within the flow way is squeezed to flow toward the water inlets/outlets on two sides. The upper and lower vibration membranes have different structures. Also, the hardness of the fixing seat is different from the hardness of the bottom layer. This leads to difference in impedance. Therefore, the wave of the medium can be transmitted.