Patents by Inventor Chia-Nan Ching
Chia-Nan Ching has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130177183Abstract: A vibration speaker includes a top cover, a bottom cover, at least one transducer plate and at least one conductive connector. The top cover and the bottom cover define a space to accommodate the transducer plate and the conductive connector. Each transducer plate includes a conductive plate, a first smart material layer coated on a first surface of the conductive plate, and a first electrode layer formed on the first smart material layer. The conductive connector presses on the transducer plate, wherein an insulating layer is coated on an area between the first surface and the conductive connector but excluding the first electrode layer, such that the conductive connector electrically contacts the first electrode layer but is insulated from the conductive plate.Type: ApplicationFiled: March 7, 2012Publication date: July 11, 2013Applicant: CHIEF LAND Electronic Co., Ltd.Inventors: Chien-Chang Chen, Chia-Nan Ching
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Publication number: 20130177182Abstract: A vibration speaker includes a top cover, a bottom cover, at least one transducer plate and at least one conductive connector. The top cover and the bottom cover define a space to accommodate the transducer plate and the conductive connector. Each transducer plate includes a conductive plate, a first smart material layer coated on a first surface of the conductive plate, and a first electrode layer formed on the first smart material layer. The conductive connector presses on the transducer plate, wherein an insulating layer is coated on an area between the first surface and the conductive connector but excluding the first electrode layer, such that the conductive connector electrically contacts the first electrode layer but is insulated from the conductive plate.Type: ApplicationFiled: March 7, 2012Publication date: July 11, 2013Applicant: CHIEF LAND ELECTRONIC CO., LTD.Inventors: Chia-Nan Ching, Chien-Chang Chen, CHIEN-HSUAN YEN
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Publication number: 20130099907Abstract: The present invention is directed to a method of generating three dimensional (3D) haptic feedback and an associated handheld electronic device. A first, a second and a third directional actuator groups are disposed on an inner surface of a housing. The vibration inertial forces generated by the first, the second, and the third directional actuator groups are parallel with the first, the second and the third axial directions respectively. The first, the second, and the third directional actuator groups are individually or in combination driven, thereby generating haptic feedback.Type: ApplicationFiled: November 30, 2011Publication date: April 25, 2013Applicant: CHIEF LAND ELECTRONIC CO., LTD.Inventors: Chia-Nan Ching, Tsi-Yu Chuang, Wen Chung Wang
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Publication number: 20130100046Abstract: The present invention is directed to a haptic feedback module, which includes a vibration plate, and at least one first actuator that is disposed along a lateral surface of the circumference of the vibration plate. The vibration plate contacts with a top plate member. When the first actuator presses the vibration plate, the vibration energy of the vibration plate is transferred to the top plate member to result in haptic feedback.Type: ApplicationFiled: November 30, 2011Publication date: April 25, 2013Applicant: CHIEF LAND ELECTRONIC CO., LTD.Inventors: Tsi-Yu Chuang, Chia-Nan Ching
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Publication number: 20130069483Abstract: Transducers and transducer modules having the transducers are disclosed. An embodiment discloses a transducer that includes a conductive layer having a U-shaped slit toward its swing end. The slit is configured to enhance a haptic feedback or an acoustic propagation, or adjust a resonant mode.Type: ApplicationFiled: September 23, 2011Publication date: March 21, 2013Applicant: CHIEF LAND ELECTRONIC CO., LTD.Inventors: Chia-Nan Ching, Tsi-Yu Chuang
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Publication number: 20130064401Abstract: The present invention is directed to a transducer module, which includes an actuator that is directly or indirectly coupled to a vibration plate. The transducer module includes a plastic damper that elastically secures the vibration plate to a frame.Type: ApplicationFiled: September 23, 2011Publication date: March 14, 2013Applicant: CHIEF LAND ELECTRONIC CO., LTD.Inventors: Wen Chung Wang, Chia-Nan Ching
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Publication number: 20130033967Abstract: The present invention is directed to a transducer module including a first transducer and a second transducer. The second transducer is disposed between the first transducer and a first plate.Type: ApplicationFiled: September 16, 2011Publication date: February 7, 2013Applicant: CHIEF LAND ELECTRONIC CO., LTD.Inventors: Tsi-Yu Chuang, Chia-Nan Ching, Bao-Zheng Liu
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Publication number: 20130034252Abstract: The present invention is directed to a transducer module including a first transducer and a second transducer. The first transducer is directly or indirectly disposed on a first plate with a first point, and the second transducer is disposed at a second point of the first transducer. In an embodiment, an inertial mass is further disposed on the second transducer.Type: ApplicationFiled: August 29, 2011Publication date: February 7, 2013Applicant: CHIEF LAND ELECTRONIC CO., LTD.Inventors: Tsi-Yu Chuang, Chia-Nan Ching, Bao-Zheng Liu
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Publication number: 20120321824Abstract: The present invention is directed to a transducer module including a first transducer, a support member and a block member. The support member rests or is fixed on a first plate with a first end, and rests or is fixed on the central section of the first transducer with a second end. The block member rests or is fixed on the central section of the first transducer with a first end, and rests or is fixed on a second plate with a second end.Type: ApplicationFiled: August 16, 2011Publication date: December 20, 2012Applicant: CHIEF LAND ELECTRONIC CO., LTD.Inventors: Tsi-Yu Chuang, Chia-Nan Ching, Bao-Zheng Liu