Abstract: A production schedule estimation method and a production schedule estimation system are provided. The production schedule estimation method includes the following steps. Current-day work-in-process data, machine group cycle time data of a machine group, and productivity data of the machine group are obtained. The current-day work-in-process data, the cycle time data of the machine group, and the productivity data of the machine group are inputted into a prediction model. Current-day cycle time data and a current-day move volume for each of multiple stations in the machine group are calculated through the prediction model. And, current-day move data is calculated according to the current-day cycle time data and the current-day move volume for each of the multiple stations in the machine group.

Abstract: Disclosed herein is a lead frame assembly including a frame and lead frame units each including a chip holder having first and second electrode pads; and a pin unit having a first pin, a second pin and third pins each extending from the chip holder. The pin unit extending from one of the lead frame units is connected to the pin unit of the adjacent one of the lead frame units. For the lead frame units disposed adjacent to the frame, the pin units extending towards the frame are connected to the frame such that the lead frame units are fixedly positioned within the frame. A chip packaging device including a lead frame body and a packaging structure is also disclosed.

Abstract: A lead frame assembly includes a lead frame body, an encapsulant unit, and dicing positioning units. The lead frame body includes lead frame units, an outer frame portion extending around the lead frame units, and through holes formed on the outer frame portion. The encapsulant unit includes a lower encapsulating portion, and an upper encapsulating portion formed on the lower encapsulating portion. The dicing positioning units are respectively located at the through holes, and each includes an adhesive layer which partially fills a corresponding one of the through holes and which is formed with at least one dicing positioning hole. The dicing positioning units define at least one first dicing positioning line and at least one second dicing positioning line.

Abstract: A lead frame assembly includes a lead frame body, an encapsulant unit, and dicing positioning units. The lead frame body includes lead frame units, an outer frame portion extending around the lead frame units, and through holes formed on the outer frame portion. The encapsulant unit includes a lower encapsulating portion, and an upper encapsulating portion formed on the lower encapsulating portion. The dicing positioning units are respectively located at the through holes, and each includes an adhesive layer which partially fills a corresponding one of the through holes and which is formed with at least one dicing positioning hole. The dicing positioning units define at least one first dicing positioning line and at least one second dicing positioning line.

Abstract: Disclosed herein is a lead frame assembly including a frame and lead frame units each including a chip holder having first and second electrode pads; and a pin unit having a first pin, a second pin and third pins each extending from the chip holder. The pin unit extending from one of the lead frame units is connected to the pin unit of the adjacent one of the lead frame units. For the lead frame units disposed adjacent to the frame, the pin units extending towards the frame are connected to the frame such that the lead frame units are fixedly positioned within the frame. A chip packaging device including a lead frame body and a packaging structure is also disclosed.

Abstract: A lead frame is made of conductive material, and includes an interconnecting web portion and a plurality of unit lead frames. Each unit lead frame includes a die pad and a plurality of leads. The die pad has a die-attach section disposed below an upper surface of the interconnecting web portion, and a plurality of extension sections bent at an angle from a periphery of the die-attach section and projecting to the interconnecting web portion. The die pad is formed with a plurality of grooves formed at an underside of junctions of the die-attach section and the extension sections. The leads extend from the interconnecting web portion toward and are spaced apart from the die pad.

Abstract: A composite lead frame for mounting a light-emitting diode chip thereon includes a chip mounting seat having at least two electrodes spaced apart from each other by a gap and configured to electrically connect with the LED chip. Each electrode is formed with at least one through hole. A plurality of fillers made of polymer materials are filled in the gap and the through hole. A reflector cup is disposed on and cooperates with the electrodes to define a receiving space for receiving the LED chip. The reflector cup is composed of a silicon-based polymer material and a white inorganic filling material, and is connected to the electrodes and the fillers. A LED package structure including the composite lead frame is also disclosed.

Abstract: A lead frame is made of conductive material, and includes an interconnecting web portion and a plurality of unit lead frames. Each unit lead frame includes a die pad and a plurality of leads. The die pad has a die-attach section disposed below an upper surface of the interconnecting web portion, and a plurality of extension sections bent at an angle from a periphery of the die-attach section and projecting to the interconnecting web portion. The die pad is formed with a plurality of grooves formed at an underside of junctions of the die-attach section and the extension sections. The leads extend from the interconnecting web portion toward and are spaced apart from the die pad.

Abstract: A semiconductor package includes a lead frame, a chip unit, and an encapsulation layer. The lead frame includes a die pad and a plurality of package leads. Each of the package leads has a proximate segment and a distal segment relative to the die pad. Each of the package leads has an outer end surface which. interconnects bottom and top surface regions of the distal segment, and a cavity which is formed the bottom surface region of the distal segment, and which extends inwardly from the outer end surface. The chip unit includes a chip and a plurality of wire bonds. The encapsulation layer encapsulates the lead frame and the chip unit such that the distal segment of each of the package leads is exposed from the encapsulation layer.

Abstract: A preformed lead frame includes multiple lead frame units, a connecting member connecting the lead frame units, a molding layer molded over the lead frame units and the connecting member, and a solder layer. The molding layer has opposite upper and lower surfaces, a plurality of side surfaces each extending therebetween, and a plurality of spaced-apart elongated grooves indented from the lower surface towards the upper surface. Each of the lead frame units includes a row of spaced-apart leads each having a grooved surface and a grooved soldering surface indented from the grooved surface towards the upper surface. The solder unit includes multiple solder layers for filling the elongated grooves. A lead frame package formed from the preformed lead frame is also disclosed.

Abstract: A preformed lead frame includes multiple lead frame units, a connecting member connecting the lead frame units, a molding layer molded over the lead frame units and the connecting member, and a solder layer. The molding layer has opposite upper and lower surfaces, a plurality of side surfaces each extending therebetween, and a plurality of spaced-apart elongated grooves indented from the lower surface towards the upper surface. Each of the lead frame units includes a row of spaced-apart leads each having a grooved surface and a grooved soldering surface indented from the grooved surface towards the upper surface. The solder unit includes multiple solder layers for filling the elongated grooves. A lead frame package formed from the preformed lead frame is also disclosed.

Abstract: A semiconductor device package includes a metallic leadframe unit including a supporting base and a plurality of leads, a molding layer the leadframe unit, a plurality of solder grooves, and a semiconductor device disposed on the supporting base. The solder grooves are located under the leads such that lead bottom surfaces are uncovered by the molding layer. Each of the solder grooves has an end opening at a molding-layer side surface. The molding-layer side surface has a plurality of surface sections connected with each other, and any two adjacent ones of the surface sections define a joint portion. The leads are correspondingly exposed from the surface sections. The metallic leadframe unit is unexposed from the joint portions.

Abstract: A preformed lead frame device includes multiple spaced-apart longitudinal sections, multiple spaced-apart transverse sections intersecting the longitudinal sections, and multiple preformed lead frame units each surrounded by two adjacent ones of the longitudinal sections and two adjacent ones of the transverse sections. Each of the preformed lead frame units includes a die pad sub-unit including a die pad portion, multiple pillar portions, and a first gap formed among the die pad portion and the pillar portions, a lead sub-unit including leads and a second gap formed among the die pad sub-unit and the leads, an adhesion-strengthening layer disposed in the first and second gaps, and a molding layer filling the first and second gaps to cover the adhesion-strengthening layer.

Abstract: A leadframe includes first and second surfaces, a plurality of leads, and a hole-defining wall unit including a plurality of first-hole defining walls each defining a first through hole and a plurality of second-hole defining walls each defining a second through hole. Each of the first and second through holes is formed between two adjacent ones of the leads. Each of the first hole-defining walls has top and bottom edges respectively forming arcuate and burr regions with the first and surfaces at junctions therebetween. Each of the second hole-defining walls has top and bottom edges respectively forming burr and arcuate regions with the first and second surfaces at junctions therebetween.

Abstract: A leadframe includes first and second surfaces, a plurality of leads, and a hole-defining wall unit including a plurality of first-hole defining walls each defining a first through hole and a plurality of second-hole defining walls each defining a second through hole. Each of the first and second through holes is formed between two adjacent ones of the leads. Each of the first hole-defining walls has top and bottom edges respectively forming arcuate and burr regions with the first and surfaces at junctions therebetween. Each of the second hole-defining walls has top and bottom edges respectively forming burr and arcuate regions with the first and second surfaces at junctions therebetween.

Abstract: A preformed lead frame device includes a molding layer and a plurality of spaced-apart lead frame units. The molding layer is made of a polymer material, and includes a plurality of framed portions, and a plurality of longitudinal and transverse frame sections intersecting each other to frame the framed portions. The lead frame units are arranged in an array and made of metal. Each of the lead frame units is embedded in a respective one of the framed portions and includes a plurality of spaced-apart leads.

Abstract: A preformed lead frame includes multiple lead frame units, a connection bar connecting the lead frame units and extending along a singulation line, and a molding layer molded over the lead frame units and the connection bar. The molding layer has a lower surface and a plurality of spaced apart elongate grooves indented upwardly from the lower surface. Each of the lead frame units includes a row of spaced-apart leads, each of which has a grooved surface exposed from the lower surface of the molding layer and a grooved soldering surface indented upwardly from the grooved surface and exposed in one of the elongate groove. A lead frame package formed from the preformed lead frame is also disclosed.

Abstract: Alight emitting device package includes a leadframe unit, a molding layer, and a light emitting device. The leadframe unit has opposite leadframe top and bottom surfaces. The molding layer encloses the leadframe unit, and has a molding-layer bottom surface, a molding-layer surrounding surface extending upward from the molding-layer bottom surface to surround the leadframe unit, and a plurality of solder grooves indented from the molding-layer bottom surface. Each of the solder grooves has one end meeting the leadframe unit and another end opening at the molding-layer surrounding surface. The light emitting device is disposed on the leadframe top surface of the leadframe unit.

Abstract: A pre-molded leadframe device includes a leadframe and a first molding layer. The leadframe includes a plurality of leadframe units spaced apart from one another, a framing portion surrounding and spaced apart from all of the leadframe units, and a gap interposed among the leadframe units and the framing portion. Each of the leadframe units has a leadframe top surface and a leadframe bottom surface. The first molding layer fills the gap and has a molding-layer bottom surface that is coplanar with the leadframe bottom surfaces. The first molding layer is further formed with a plurality of solder grooves, each of which extends across the gap and having at least one end connected to one of the leadframe units.

Abstract: A preformed lead frame includes a metallic substrate, a plurality of spaced-apart conductive lead frame units and intersecting trenches, a molding layer, and a plurality of conductive pads. The lead frame units and the molding layer are formed on the substrate. Each of the lead frame units includes a die supporting portion, a plurality of lead portions surrounding and spaced apart from the die supporting portion, and a gap formed among the die supporting portion and the lead portions. The trenches are formed among the conductive lead frame units. The molding layer fills the gaps and the trenches. Each of the conductive pads is formed on a top surface of the die supporting portion of a respective one of the lead frame units.