Patents by Inventor Chia-Pang Liu

Chia-Pang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967570
    Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: April 23, 2024
    Assignee: MediaTek Inc.
    Inventors: Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen, Chung-Fa Lee
  • Publication number: 20150267045
    Abstract: A polymeric composite material includes a plurality of polymer bases, at least one of which is a rubber base, and a filler. The filler is blended with the rubber base, which in turn is blended with other of the polymer bases. As a result, the rubber base is a medium to let the filler uniformly distributed in the polymer bases.
    Type: Application
    Filed: March 20, 2014
    Publication date: September 24, 2015
    Applicant: SUNKO INK CO., LTD.
    Inventors: YI-JUNG HUANG, TING-KAI HUANG, HSIN-HUNG LIN, CHIA-PANG LIU, I-CHI CHEN, CHOU-POU HSIEH
  • Publication number: 20150257473
    Abstract: An integrated shoe comprises a first part and a second part directly attached to the first part. A method of making the integrated shoe comprises steps of injecting a first thermoplastic polymer mixture into a mold to obtain a first semi-molding part; injecting a second thermoplastic polymer mixture into the mold to obtain a second semi-molding part directly attached to a side surface of the first semi-molding part; and aging the first semi-molding part and the second semi-molding part to form a first part and a second part directly attached to the first part and obtain the integrated shoe. By omitting an adhesive layer, fabrication costs of the integrated shoe are lowered; in addition, yield of the method of making the integrated shoe is raised.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 17, 2015
    Applicant: SUNKO INK CO., LTD.
    Inventors: Chia-Pang Liu, Ting-Kai Huang, Yi-Jung Huang
  • Publication number: 20150252187
    Abstract: A multifunctional environmentally protective polyurethane composite material comprises a thermoplastic polyurethane; an environmentally protective additive including recycled polymer, plant fiber, mineral, or metal powder; and a thickening dispersant including natural rubber or synthetic rubber. By the thickening dispersant, the environmentally protective additive is uniformly added into the thermoplastic polyurethane to form the multifunctional environmentally protective polyurethane composite material. The environmentally protective additive can reduce the existing amount of waste or suppress increase of waste. With the use of the thickening dispersant and the environmentally protective additive, the multifunctional environmentally protective polyurethane composite material has advantages of light weight, good flowability, slip resistance, abrasion resistance, formability and low cost.
    Type: Application
    Filed: March 7, 2014
    Publication date: September 10, 2015
    Applicant: SUNKO INK CO., LTD.
    Inventors: Chia-Pang Liu, Chien-Chia Chu, Chien-Yuan Chiu, Ming-Yu Chen, Ting-Kai Huang, Yi-Jung HUANG