Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.

Abstract: An inductor circuit includes a receiver inductive circuit, a transmitter inductive circuit, and an antenna inductive circuit which are implemented on a single chip die; the receiver inductive circuit is disposed on a specific ring of a specific plane to form a ring shape; the transmitter inductive circuit and the antenna inductive circuit are disposed inside the specific ring and surrounded by the specific ring of the specific plane; and, a circuit area, occupied by the transmitter inductive circuit, inside the specific ring and on the specific plane, is larger than a circuit area occupied by the receiver inductive circuit and by the antenna inductive circuit.

Abstract: An inductor circuit includes a receiver inductive circuit, a transmitter inductive circuit, and an antenna inductive circuit which are implemented on a single chip die; the receiver inductive circuit is disposed on a specific ring of a specific plane to form a ring shape; the transmitter inductive circuit and the antenna inductive circuit are disposed inside the specific ring and surrounded by the specific ring of the specific plane; and, a circuit area, occupied by the transmitter inductive circuit, inside the specific ring and on the specific plane, is larger than a circuit area occupied by the receiver inductive circuit and by the antenna inductive circuit.

Abstract: An inductor circuit includes a receiver inductive circuit, a transmitter inductive circuit, and an antenna inductive circuit which are implemented on a single chip die; the receiver inductive circuit is disposed on a specific ring of a specific plane to form a ring shape; the transmitter inductive circuit and the antenna inductive circuit are disposed inside the specific ring and surrounded by the specific ring of the specific plane; and, a circuit area, occupied by the transmitter inductive circuit, inside the specific ring and on the specific plane, is larger than a circuit area occupied by the receiver inductive circuit and by the antenna inductive circuit.

Abstract: A manufacturing method for grinding tool includes following steps. Step 1 is providing a substrate. Step 2 is fixing diamond or abrasive grit in a predetermined position or base by DIAMAP (Diamond Implant Array Mapping & Arrangement Process). The last step is providing a second fixing layer onto the first fixing base and the exposed surface of the substrate. The first fixing base and the second fixing layer are used for fixing the abrasive grits on the substrate. Moreover, a grinding tool is provided in the present invention.

Abstract: A manufacturing method for a grinding tool includes: a substrate being provided. A mechanical process is used to form an uneven portion with a regular shape on a surface of the substrate. A coating method is used to uniformly attach a wear resistance layer on a surface of the uneven portion. A forming method is used to uniformly attach a protective layer on a surface of the wear resistance layer. A grinding tool includes a substrate, a wear resistance layer and a protective layer. A surface of the substrate has an uneven portion. The wear resistance layer is uniformly attached on a surface of the uneven portion and corresponds to the shape of the uneven portion. The protective layer is uniformly attached on a surface of the abrasive layer. Thereby, the grinding tool that is corrosion resistance, wear-resistance, heatproof, chemical-resistance and has a regular or irregular shape is formed.