Abstract: A method of estimating greenhouse gas emission, performed by a processing device, includes: obtaining at least one time period of a number of working stations for a target manufacturing process of a product; obtaining a number of first power consumption data of the target manufacturing process, wherein the first power consumption data correspond to the working stations respectively; calculating a number of second power consumption data based on the at least one time period and the first power consumption data; searching for a number of target coefficients corresponding to the plurality of working stations respectively in coefficient database based on the target manufacturing process; and calculating greenhouse gas emission data of the target manufacturing process based on the second power consumption data and the target coefficients.

Abstract: A device a includes a substrate, two source/drain (S/D) features over the substrate, and semiconductor layers suspended over the substrate and connecting the two S/D features. The device further includes a dielectric layer disposed between two adjacent layers of the semiconductor layers and an air gap between the dielectric layer and one of the S/D features, where a ratio between a length of the air gap to a thickness of the first dielectric layer is in a range of 0.1 to 1.0.

Abstract: The present disclosure relates to a system, a method and a computer-readable medium for data accessing. The method includes receiving a request, receiving a status parameter of an endpoint corresponding to the request, receiving a number of times of receiving the request in a period of time, and determining a delay time length for transmitting the request according to the status parameter of the endpoint or the number of times of receiving the request in the period of time. The present disclosure can achieve more efficient resource allocation and can prevent server outage.

Abstract: An electronic device package includes an encapsulated electronic component, a substrate, a conductor and a buffer layer. The encapsulated electronic component includes a redistribution layer (RDL) and an encapsulation layer. The first surface is closer to the RDL than the second surface is. The encapsulation layer includes a first surface, and a second surface opposite to the first surface. The substrate is disposed on the second surface of the encapsulation layer. The conductor is disposed between the substrate and the encapsulated electronic component, and electrically connecting the substrate to the encapsulated electronic component. The buffer layer is disposed between the substrate and the encapsulated electronic component and around the conductor.

Abstract: An electronic device package and manufacturing method thereof are provided. The electronic device package includes an electronic component including an active surface, a patterned conductive layer disposed on the active surface, an encapsulation layer disposed over the patterned conductive layer, and a buffer layer disposed between the patterned conductive layer and the encapsulation layer. The buffer layer is shaped and sized to alleviate a stress generated due to an interaction between the patterned conductive layer and the encapsulation layer.

Abstract: A manufacturing method for manufacturing a package structure is provided. The manufacturing method includes: (a) providing a carrier having a top surface and a lateral side surface, wherein the top surface includes a main portion and a flat portion connecting the lateral side surface, and a first included angle between the main portion and the flat portion is less than a second included angle between the main portion and the lateral side surface; (b) forming an under layer on the carrier to at least partially expose the flat portion; and (c) forming a dielectric layer on the under layer and covering the exposed flat portion.

Abstract: An electronic device package includes an encapsulated electronic component, a substrate, a conductor and a buffer layer. The encapsulated electronic component includes a redistribution layer (RDL) and an encapsulation layer. The first surface is closer to the RDL than the second surface is. The encapsulation layer includes a first surface, and a second surface opposite to the first surface. The substrate is disposed on the second surface of the encapsulation layer. The conductor is disposed between the substrate and the encapsulated electronic component, and electrically connecting the substrate to the encapsulated electronic component. The buffer layer is disposed between the substrate and the encapsulated electronic component and around the conductor.

Abstract: The present disclosure provides a semiconductor package structure having a semiconductor die having an active surface, a conductive bump on the active surface, configured to electrically couple the semiconductor die to an external circuit, the conductive bump having a bump height, a dielectric encapsulating the semiconductor die and the conductive bump, and a plurality of fillers in the dielectric, each of the fillers comprising a diameter, wherein a maximum diameter of the fillers is smaller than the bump height.

Abstract: The present disclosure provides a semiconductor package structure having a semiconductor die having an active surface, a conductive bump on the active surface, configured to electrically couple the semiconductor die to an external circuit, the conductive bump having a bump height, a dielectric encapsulating the semiconductor die and the conductive bump, and a plurality of fillers in the dielectric, each of the fillers comprising a diameter, wherein a maximum diameter of the fillers is smaller than the bump height.

Abstract: The present disclosure provides a semiconductor package structure having a semiconductor die having an active surface, a conductive bump on the active surface, configured to electrically couple the semiconductor die to an external circuit, the conductive bump having a bump height, a dielectric encapsulating the semiconductor die and the conductive bump, and a plurality of fillers in the dielectric, each of the fillers comprising a diameter, wherein a maximum diameter of the fillers is smaller than the bump height.

Abstract: According to one exemplary embodiment, a light communication system comprises a transmitting apparatus and a receiving apparatus. The transmitting apparatus generates one or more patterns of light to decide at least one reference area, and transmits signals by emitting light in the at least one reference area decided by the one or more patterns. The receiving apparatus takes measurements fewer than a total amount of pixels over a sensed image to detect the one or more patterns of light, and decides at least one ROI according to one or more detected one or more patterns; then takes all signals of light in the at least one ROI for processing of the light communication, and takes measurements fewer than a total amount of pixels over at least one tracking area for tracking the one or more patterns of light emitted by the transmitting apparatus.

Abstract: In a light communication system, a data embedding unit arranged between a transmitter-side communication data processing unit and a light emitting device driver embeds a communication processed data at a spatial domain of an original image according to a modulation scheme, and gets multiple RGB values for a communication data embedded image. A receiving apparatus detects a transmitter-side communication data embedded image, generates a receiver-side communication data embedded image, compensate a deformation of the receiver-side communication data embedded image, outputs a warped communication data embedded image, and extracts a communication processed data from the warped communication data embedded image.

Abstract: In a light communication system, a data embedding unit arranged between a transmitter-side communication data processing unit and a light emitting device driver embeds a communication processed data at a spatial domain of an original image according to a modulation scheme, and gets multiple RGB values for a communication data embedded image. A receiving apparatus detects a transmitter-side communication data embedded image, generates a receiver-side communication data embedded image, compensate a deformation of the receiver-side communication data embedded image, outputs a warped communication data embedded image, and extracts a communication processed data from the warped communication data embedded image.

Abstract: According to one exemplary embodiment, a light communication system comprises a transmitting apparatus and a receiving apparatus. The transmitting apparatus generates one or more patterns of light to decide at least one reference area, and transmits signals by emitting light in the at least one reference area decided by the one or more patterns. The receiving apparatus takes measurements fewer than a total amount of pixels over a sensed image to detect the one or more patterns of light, and decides at least one ROI according to one or more detected one or more patterns; then takes all signals of light in the at least one ROI for processing of the light communication, and takes measurements fewer than a total amount of pixels over at least one tracking area for tracking the one or more patterns of light emitted by the transmitting apparatus.

Abstract: According to one exemplary embodiment of a universal modem system, multiple digital signal processors (DSPs) are configured to perform at least one streaming-based task, or at least one block-based task, or both of the tasks. At least one concatenate memory is configured to store data for the at least one streaming-based task At least one concatenate bus connects at least one concatenate memory and the plurality of DSPs serially for performing the at least one streaming-based task. At least one concatenate memory is configured to store the data for the at least one streaming-based task. At least one public bus connects the plurality of DSPs and the at least one shared memory for performing the at least one block-based tasks.

Abstract: A vehicular handlebar grip includes a central portion, a grip portion, and a support portion. The central portion includes a first end and a second end. The grip portion is located at one side of the central portion, extending toward a direction away from a long axis extending from the first end toward the second end. The support portion is located an opposite side of the central portion relative to the grip portion, extending toward a direction away from the long axis. Accordingly, when the vehicular handlebar grip is applied to a bicycle, the cyclist can adjust the contact area where the wrist lies against the support portion according to the cyclist's different riding postures to allow more space for movement of the palm for more comfortableness.

Abstract: A bicycle seat device includes a seat post having a passage formed through a seat supporting base, a lower clamp member disposed on the seat supporting base and having an oblong hole aligned with the passage of the seat supporting base, a saddle having a space formed by a casing, an upper clamp member engaged into the space of the saddle and having a pathway and one or more recesses for receiving a pole. A fastener may clamp the saddle between the clamp members. The lower clamp member includes a curved surface for rotating relative to the seat supporting base to selected angular positions.

Abstract: A bicycle shoe sole includes a bottom portion having a number of projections extended downwardly from an outer peripheral portion and having a middle portion having no projections, and having a stud extended downwardly from the middle portion. A coupling member is integrally formed on the stud, without fasteners, by such as molding or mold injection processes, to allow the coupling member to be solidly disposed and attached on the bicycle shoe sole, and to prevent the coupling member from being disengaged from the bicycle shoe sole. The coupling member includes a front protrusion and a rear protrusion for coupling the shoe sole to foot pedals of bicycles.

Abstract: A multi-functional retaining strap has two strap surfaces. Each strap surface is installed with attachable tapes. The multi-functional retaining strap comprises a short extending retaining strap having one end fixed to a middle section of the strap surface of the multi-functional retaining strap and another end which is not fixed; a surface of the short extending retaining strap being an attachable tape; an inner folded strap attached to one of the strap surfaces; at least one surface of the inner folded strap being an attachable tape; and an outer folded strap having two ends the inner folded strap; a gap being formed between the inner folded strap and the outer folded strap; at least one surface of the outer folded strap is an attachable tape; an auxiliary strap for prolonging the length of the short extending retaining strap.