Patents by Inventor Chia-Pin SUN

Chia-Pin SUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10566256
    Abstract: A testing method for testing wafer level chip scale packages formed on a wafer including a wafer substrate and spaced-apart contact electrodes disposed on the wafer substrate, includes: providing a test device including a probe card formed with a plurality of parallel probe holes having a uniform cross-sectional dimension, and a plurality of probes respectively received in the probe holes and extending respectively in the probe holes along axes of the probe holes; and electrically connecting the contact electrodes to the probes. A distance between the axes of two adjacent ones of the probe holes is equal to a smallest spacing between two adjacent ones of the contact electrodes and is not greater than 0.5 mm.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: February 18, 2020
    Assignee: WINWAY TECHNOLOGY CO., LTD.
    Inventors: Kuan-Chung Chen, Cheng-Hui Lin, Chia-Pin Sun
  • Patent number: 10466299
    Abstract: An electronic test apparatus is adapted for testing an electronic component which includes a circuit substrate and a plurality of contact electrodes disposed on the circuit substrate. The electronic test apparatus includes a test seat and a plurality of spring probes. The test seat includes a metallic main body that has a first side adapted to be in contact with the circuit substrate and a second side opposite to the first side, and that is formed with a plurality of spaced-apart probe holes extending through the first and second sides, and a temperature sensor disposed in the metallic main body. The spring probes are adapted to be electrically connected to the contact electrodes and each is positioned in a respective one of the probe holes.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: November 5, 2019
    Assignee: WINWAY TECHNOLOGY CO., LTD.
    Inventors: Kuan-Chung Chen, Cheng-Hui Lin, Chia-Pin Sun
  • Publication number: 20190206750
    Abstract: A testing method for testing wafer level chip scale packages formed on a wafer including a wafer substrate and spaced-apart contact electrodes disposed on the wafer substrate, includes: providing a test device including a probe card formed with a plurality of parallel probe holes having a uniform cross-sectional dimension, and a plurality of probes respectively received in the probe holes and extending respectively in the probe holes along axes of the probe holes; and electrically connecting the contact electrodes to the probes. A distance between the axes of two adjacent ones of the probe holes is equal to a smallest spacing between two adjacent ones of the contact electrodes and is not greater than 0.5 mm.
    Type: Application
    Filed: January 4, 2018
    Publication date: July 4, 2019
    Inventors: Kuan-Chung CHEN, Cheng-Hui LIN, Chia-Pin SUN
  • Publication number: 20190204379
    Abstract: An electronic test apparatus is adapted for testing an electronic component which includes a circuit substrate and a plurality of contact electrodes disposed on the circuit substrate. The electronic test apparatus includes a test seat and a plurality of spring probes. The test seat includes a metallic main body that has a first side adapted to be in contact with the circuit substrate and a second side opposite to the first side, and that is formed with a plurality of spaced-apart probe holes extending through the first and second sides, and a temperature sensor disposed in the metallic main body. The spring probes are adapted to be electrically connected to the contact electrodes and each is positioned in a respective one of the probe holes.
    Type: Application
    Filed: January 4, 2018
    Publication date: July 4, 2019
    Inventors: Kuan-Chung CHEN, Cheng-Hui LIN, Chia-Pin SUN
  • Patent number: 10228391
    Abstract: A two-piece spring probe in electrical contact with a piece of testing equipment is used for probing an object to be tested. The two-piece spring probe includes a coiled compression spring and a conductive element. The coiled compression spring has a non-uniform outer diameter and is used to electrically contact the object. The conductive element is directly connected to the coiled compression spring and in electrical contact with the testing equipment.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: March 12, 2019
    Assignee: WINWAY TECH. CO., LTD.
    Inventors: Chyi-Lang Lai, Po-Hong Chen, Chun-Kiu Tan, Chia-Pin Sun
  • Patent number: 9845979
    Abstract: An evaporator includes a casing and a plurality of circulation units disposed on the casing. Each of the circulation units includes a flow path formed in the casing, an inlet formed in the casing for entry of one of refrigerants into the casing and fluidly communicating with the flow path, and an outlet formed in the casing spaced apart from the inlet for exit of the one of the refrigerants out the casing and fluidly communicating with the flow path. The circulation units are independent from each other and do not fluidly communicate with each other.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: December 19, 2017
    Assignee: WINWAY TECH. CO., LTD.
    Inventors: Ying-Chi Tsai, Yu-Pin Hsu, Chia-Pin Sun
  • Patent number: 9845973
    Abstract: A cascade refrigeration system includes first and second cooling devices. The first cooling device includes a first compressor, a condenser, an expansion device, an evaporator having first and second passages independent from and not communicating with each other, and a first conduit interconnecting the first compressor, the condenser, the expansion device and the first passage. The second cooling device includes a second compressor, a heat exchanger, and a second conduit interconnecting the second compressor, the second passage and the heat exchanger. A circulation switching device includes a switching mechanism connected to the first conduit downstream of the condenser and upstream of the expansion device.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: December 19, 2017
    Assignee: WINWAY TECH. CO., LTD.
    Inventors: Ying-Chi Tsai, Yu-Pin Hsu, Chia-PIn Sun
  • Publication number: 20170199224
    Abstract: A two-piece spring probe in electrical contact with a piece of testing equipment is used for probing an object to be tested. The two-piece spring probe includes a coiled compression spring and a conductive element. The coiled compression spring has a non-uniform outer diameter and is used to electrically contact the object. The conductive element is directly connected to the coiled compression spring and in electrical contact with the testing equipment.
    Type: Application
    Filed: January 12, 2016
    Publication date: July 13, 2017
    Inventors: Chyi-Lang LAI, Po-Hong CHEN, Chun-Kiu TAN, Chia-Pin SUN
  • Publication number: 20170167758
    Abstract: A cascade refrigeration system includes first and second cooling devices. The first cooling device includes a first compressor, a condenser, an expansion device, an evaporator having first and second passages independent from and not communicating with each other, and a first conduit interconnecting the first compressor, the condenser, the expansion device and the first passage. The second cooling device includes a second compressor, a heat exchanger, and a second conduit interconnecting the second compressor, the second passage and the heat exchanger. A circulation switching device includes a switching mechanism connected to the first conduit downstream of the condenser and upstream of the expansion device.
    Type: Application
    Filed: December 15, 2015
    Publication date: June 15, 2017
    Inventors: Ying-Chi TSAI, Yu-Pin HSU, Chia-Pin SUN
  • Publication number: 20170167765
    Abstract: An evaporator includes a casing and a plurality of circulation units disposed on the casing. Each of the circulation units includes a flow path formed in the casing, an inlet formed in the casing for entry of one of refrigerants into the casing and fluidly communicating with the flow path, and an outlet formed in the casing spaced apart from the inlet for exit of the one of the refrigerants out the casing and fluidly communicating with the flow path. The circulation units are independent from each other and do not fluidly communicate with each other.
    Type: Application
    Filed: December 15, 2015
    Publication date: June 15, 2017
    Inventors: Ying-Chi TSAI, Yu-Pin HSU, Chia-Pin SUN
  • Publication number: 20170146568
    Abstract: An electronic test equipment is adapted to test an electronic component. The electronic component has a circuit body and a plurality of connectors that are electrically connected to the circuit body. The electronic test equipment includes a metallic test seat and a plurality of spring probes. The metallic test seat is adapted to support the circuit body thereon, and is formed with a plurality of spaced-apart probe holes extending therethrough and possessing diameters that are substantially the same. Each of the probe holes is adapted to receive a corresponding one of the connectors. The spring probes are respectively and entirely positioned within the probe holes, and are adapted to electrically contact the connectors.
    Type: Application
    Filed: November 19, 2015
    Publication date: May 25, 2017
    Inventors: Jun-Xian LIU, Cheng-Hui LIN, Chia-Pin SUN, Hsin-Chieh LU