Patents by Inventor Chia-Ping Liu

Chia-Ping Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of automatically creating a semiconductor processing prober device file
    Patent number: 7271609
    Abstract: Described is a method for automatically generating a wafer prober file whereby testing parameters and die identities can be established for testing a complete semiconductor wafer and whereby acceptable or rejected dies can be identified and correlated later with where the good or bad dies are physically located on a wafer-under-test.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: September 18, 2007
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kevin Liao, Edward Chen, Win Hung, Jumbo Chuang, Chang-Chi Hsu, Chia-Ping Liu, Chun-Chieh Hsiao
  • Method of Automatically Creating a Semiconductor Processing Prober Device File
    Publication number: 20060255824
    Abstract: Described is a method for automatically generating a wafer prober file whereby testing parameters and die identities can be established for testing a complete semiconductor wafer and whereby acceptable or rejected dies can be identified and correlated later with where the good or bad dies are physically located on a wafer-under-test.
    Type: Application
    Filed: May 16, 2005
    Publication date: November 16, 2006
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kevin Liao, Edward Chen, Win Hung, Jumbo Chuang, Chang-Chi Hsu, Chia-Ping Liu, Chun-Chieh Hsiao
  • Inking apparatus with multi-positioning capability
    Patent number: 6702489
    Abstract: An inking apparatus including an inking head which is manually adjustable in the X, Y and Z directions to facilitate quick and easy positioning of an inking probe in proximity to a defective die on a semiconductor wafer to ink and mark the die for exclusion from further processing. A horizontal positioning plate is horizontally adjustably mounted on a base plate, and an angular adjustment arm is angularly adjustably mounted on the horizontal positioning plate. The inking head is vertically adjustably mounted on the end of the angular adjustment arm and carries an ink reservoir from which ink is dispensed through an inking probe to the dies on the wafer.
    Type: Grant
    Filed: July 3, 2002
    Date of Patent: March 9, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventor: Chia-Ping Liu
  • INKING APPARATUS WITH MULTI-POSITIONING CAPABILITY
    Publication number: 20040005181
    Abstract: An inking apparatus including an inking head which is manually adjustable in the X, Y and Z directions to facilitate quick and easy positioning of an inking probe in proximity to a defective die on a semiconductor wafer to ink and mark the die for exclusion from further processing. A horizontal positioning plate is horizontally adjustably mounted on a base plate, and an angular adjustment arm is angularly adjustably mounted on the horizontal positioning plate. The inking head is vertically adjustably mounted on the end of the angular adjustment arm and carries an ink reservoir from which ink is dispensed through an inking probe to the dies on the wafer.
    Type: Application
    Filed: July 3, 2002
    Publication date: January 8, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Chia-Ping Liu