Abstract: A high-capacity common-mode inductor processing circuit for network signal is disclosed. Each of high-capacity common-mode inductors is disposed between two adjacent circuit channels to perform signal coupling, and each high-capacity common-mode inductor has parasitic capacitance between primary and secondary sides thereof, each of autotransformers is disposed on a side of corresponding one of the high-capacity common-mode inductors, and center tap lines of the autotransformers are grounded. The high-capacity common-mode inductor includes an iron core post and an iron core cover, the iron core post includes a winding part to be wound by conductive wires, and the conductive wires are wound on the winding part by a preset number of turns, and upwardly stacked and wound on the winding part by a preset layer number. The high-capacity common-mode inductors and the parasitic capacitances can eliminate noise on the circuit channels and perform signal coupling.

Abstract: A high-capacity common-mode inductor processing circuit for network signal is disclosed. Each of high-capacity common-mode inductors is disposed between two adjacent circuit channels to perform signal coupling, and each high-capacity common-mode inductor has parasitic capacitance between primary and secondary sides thereof, each of autotransformers is disposed on a side of corresponding one of the high-capacity common-mode inductors, and center tap lines of the autotransformers are grounded. The high-capacity common-mode inductor includes an iron core post and an iron core cover, the iron core post includes a winding part to be wound by conductive wires, and the conductive wires are wound on the winding part by a preset number of turns, and upwardly stacked and wound on the winding part by a preset layer number. The high-capacity common-mode inductors and the parasitic capacitances can eliminate noise on the circuit channels and perform signal coupling.

Abstract: An electronic device wire conductor formation method includes the steps of using a plastic injection molding machine to create an insulative plastic block, operating a top mold of a transfer-printing equipment to reciprocate an adhesive-applying portion along a transfer-printing portion of a bottom mold for causing the adhesive-applying portion to coat a molten conductive adhesive evenly on the transfer-printing portion, inverting the insulative plastic block to attach molding units thereof onto the transfer-printing portion of the bottom mold for enabling the molten conductive adhesive to be transfer-printed onto U-shaped plates of the molding units, and finally removing the insulative plastic block from the bottom mold and then curing the coated conductive adhesive to form individual conductors on the respective U-shaped plate of molding units.

Abstract: A magnetic inductor coil printing method includes the step of printing at least one first coil winding on a core base, the step of printing a first insulating layer on the core base over the first coil winding, the step of printing at least one second coil winding on the core base over the first insulating layer, and the step of printing a second insulating layer on the core base over the second coil winding.

Abstract: An inductor includes an insulative plastic block having a block base with a recessed open chamber, a positioning unit including odd-numbered rows of U-shaped plates and even-numbered rows of U-shaped plates arranged in a staggered manner in the recessed open chamber of the block base of the insulative plastic block, and a plurality of conductors respectively formed on the U-shaped plates and spaced from one another, each conductor having two opposite ends thereof respectively terminating in a lead outside the block base.

Abstract: An inductor includes an insulative plastic block having a block base with a recessed open chamber, a positioning unit including rows of U-shaped plates in the recessed open chamber, and conductors respectively formed on the U-shaped plates by metallization and spaced from one another, each conductor having two opposite leads disposed outside the block base, a magnetic conductive component having a magnetic core with slots cut through opposing top and bottom sides mounted in the recessed open chamber that the U-shaped plates are inserted into the slots of the magnetic core, and a connection carrier including a substrate and a wire array located on the substrate and electrically bonded with the leads; there is a width between each two adjacent U-shaped plates, enabling the conductors to be spaced from one another, the direction and the conductors can be precisely controlled, achieving the effects of high production efficiency and cost effectiveness.

Abstract: A magnetic device fabrication method includes the step of using molds to respectively process a first substrate and a second substrate into respective predetermined shapes, the step of forming conductors in shaped protruding blocks of the first substrate and conducting contacts in the second substrate, the step of attaching one or more magnetic cores to the first plate member to couple one or more positioning slots to the protruding blocks of the first plate member respectively and the step of bonding one or multiple magnetic cores between the first and second substrate to provide a continuous winding type induction coil effect, saving much manufacturing labor and time.

Abstract: An inductor with coil conductor formed by conductive material includes an insulative plastic block including a block base, a positioning unit with U-shaped plates mounted in the block base and conductors respectively formed of an electroplated conductive adhesive on the U-shaped plates using laser direct structuring (LDS) and isolated from one another, magnetic conductive components each including a magnetic core mounted in the base and defining therein slots for the passing of the U-shaped plates, and a connection carrier including a substrate and a wire array located on the substrate and electrically bonded with leads of the conductors to create with the magnetic cores a magnetic coil loop capable of providing a magnetic induction effect. Thus, the inductor of the invention has the advantages of simple structure, high production efficiency and cost effectiveness.

Abstract: A magnetic device includes two substrates arranged in parallel with one substrate providing one or multiple protruding block and a plurality of conductors in each protruding block and the other substrate providing a plurality of conducting contacts respectively disposed in contact with the conductors, and one or multiple magnetic cores mounted between the two substrates and coupled to the one or multiple protruding blocks, each magnetic core having one or multiple positioning slots respectively configured for receiving one respective protruding block so that the conductors and the conducting contacts are electrically connected to create with the one or multiple magnetic cores multiple induction areas for providing a continuous winding type induction coil effect.

Abstract: A magnetic device fabrication method includes the step of using molds to respectively process a first substrate and a second substrate into respective predetermined shapes, the step of forming conductors in shaped protruding blocks of the first substrate and conducting contacts in the second substrate, the step of attaching one or more magnetic cores to the first plate member to couple one or more positioning slots to the protruding blocks of the first plate member respectively and the step of bonding one or multiple magnetic cores between the first and second substrate to provide a continuous winding type induction coil effect, saving much manufacturing labor and time.

Abstract: An inductor with conductive adhesive coil conductor includes an insulative plastic block including a block base, a positioning unit with U-shaped plates mounted in the block base and conductors respectively formed of a conductive adhesive on the U-shaped plates by transfer printing and isolated from one another, magnetic conductive components each including a magnetic core mounted in the base and defining therein slots for the passing of the U-shaped plates, and a connection carrier including a substrate and a wire array located on the substrate and electrically bonded with leads of the conductors to create with the magnetic cores a magnetic coil loop capable of providing a magnetic induction effect.

Abstract: An electronic device wire conductor formation method includes the steps of using a plastic injection molding machine to create an insulative plastic block, operating a top mold of a transfer-printing equipment to reciprocate an adhesive-applying portion along a transfer-printing portion of a bottom mold for causing the adhesive-applying portion to coat a molten conductive adhesive evenly on the transfer-printing portion, inverting the insulative plastic block to attach molding units thereof onto the transfer-printing portion of the bottom mold for enabling the molten conductive adhesive to be transfer-printed onto U-shaped plates of the molding units, and finally removing the insulative plastic block from the bottom mold and then curing the coated conductive adhesive to form individual conductors on the respective U-shaped plate of molding units.

Abstract: An inductor with conductive adhesive coil conductor includes an insulative plastic block including a block base, a positioning unit with U-shaped plates mounted in the block base and conductors respectively formed of a conductive adhesive on the U-shaped plates by transfer printing and isolated from one another, magnetic conductive components each including a magnetic core mounted in the base and defining therein slots for the passing of the U-shaped plates, and a connection carrier including a substrate and a wire array located on the substrate and electrically bonded with leads of the conductors to create with the magnetic cores a magnetic coil loop capable of providing a magnetic induction effect.

Abstract: A surge protective network signal processing circuit assembly includes a network chip, a network connector and a processing circuit including a plurality of two-wire channels electrically connected in parallel between the network chip and the network connector and a plurality of signal coupling capacitors respectively mounted in the two-wire channels and electrically connected in parallel and grounded for discharging instantaneous high voltage surges.

Abstract: A network signal coupling circuit installed in a circuit board and coupled between a network-on-chip and a network connector is disclosed to include a coupling module including a first capacitor connected in series to each wire of one respective two-wire channel of the signal coupling circuit thereof for coupling network signals and removing noises. Subject to the capacitance reactance characteristic that the signal attenuation is reduced when the frequency rises and the capacitive coupling characteristic that the signal coupling performance is enhanced when the frequency rises, the network signal coupling circuit assembly is practical for high frequency network applications to enhance signal coupling and transmission performance.

Abstract: An impedance matching device-integrated network signal processing circuit includes a first connection terminal electrically connected to the network chip, a second connection terminal electrically connected to the network connector, a plurality of circuit paths electrically connected between the first connection terminal and the second connection terminal, a coupling circuit including a plurality of capacitors respectively connected in series to the circuit paths and a plurality of inductors respectively connected in parallel between each two adjacent circuit paths, and a plurality of impedance matching devices respectively electrically connected in series to each two adjacent circuit paths, each impedance matching device including two microstrip coils respectively electrically connected in series to each two adjacent circuit paths between the first connection terminal and respective the inductors to keep the impedance at the motherboard of the computer in balance with the impedance at the network cable, avoi

Abstract: A network signal enhancement circuit assembly includes a processing circuit installed in a circuit board and having opposing first and second connection ends thereof respectively coupled to a network connector and a voltage-mode network-on-chip. The processing circuit includes coupling modules for coupling network signals, EMI protection modules for removing noises from coupled network signals, and a signal enhancement module including a voltage source and a plurality of pull-up resistors and adapted to compensate for an attenuation of the network signal due to long distance signal transmission, assuring a high level of signal transmission stability.

Abstract: A network signal coupling and EMI protection circuit assembly includes a processing circuit installed in a circuit board and coupled between a voltage-mode network-on-chip at the circuit board and a network connector and drivable by a driving voltage outputted by the voltage-mode network-on-chip to process network signals. The processing circuit includes opposing first connection end and second connection end, two-wire channels electrically connected between the first connection end and the second connection end, a coupling module and an EMI protection module installed in each two-wire channel for coupling network signals and removing noises.

Abstract: A network signal coupling and EMI protection circuit assembly includes a processing circuit installed in a circuit board and coupled between a voltage-mode network-on-chip at the circuit board and a network connector and drivable by a driving voltage from the voltage-mode network-on-chip to process network signals. The processing circuit includes opposing first connection end and second connection end, two-wire channels electrically connected between the first connection end and the second connection end, a coupling module and an EMI protection module installed in each two-wire channel for coupling network signals and removing noises.

Abstract: A surge protective network signal processing circuit assembly includes a network chip, a network connector and a processing circuit including a plurality of two-wire channels electrically connected in parallel between the network chip and the network connector and a plurality of signal coupling capacitors respectively mounted in the two-wire channels and electrically connected in parallel and grounded for discharging instantaneous high voltage surges.