Abstract: A mobile device includes a housing, a first radiation element, a second radiation element, a third radiation element, a first switch element, and a second switch element. The first radiation element has a first feeding point. The second radiation element has a second feeding point. The first radiation element, the second radiation element, and the third radiation element are distributed over the housing. The first switch element is closed or open, so as to selectively couple the first radiation element to the third radiation element. The second switch element is closed or open, so as to selectively couple the second radiation element to the third radiation element. An antenna structure is formed by the first radiation element, the second radiation element, and the third radiation element.

Abstract: A polarizer substrate includes a substrate, a reflective layer, and a metal pattern layer. The reflective layer is located on the substrate and has a transmission area and a reflective area. The metal pattern layer is located on the reflective layer and the substrate. The metal pattern layer includes a polarizer structure and a microstructure. The polarizer structure includes a plurality of grid lines overlapping the transmission area. A thickness of each of the grid lines is 200 nm to 500 nm, a width of each of the grid lines is 30 nm to 70 nm, and a distance between each adjacent two of the grid lines is 30 nm to 70 nm. The microstructure overlaps the reflective area, and a thickness of the microstructure is 20 nm to 500 nm.

Abstract: An active device substrate including a substrate, first metal grid wires, a first transparent conductive layer, a gate insulating layer, a semiconductor layer, a source, and a drain is provided. The first metal grid wires are located on the substrate. The first transparent conductive layer includes a scan line and a gate connected to the scan line. The scan line and/or the gate is directly connected to at least a part of the first metal grid wires. The gate insulating layer is located on the first transparent conductive layer. The semiconductor layer is located on the gate insulating layer and overlapped with the gate. The source and the drain are electrically connected to the semiconductor layer.

Abstract: A polarizer substrate includes a substrate, a reflective layer, and a metal pattern layer. The reflective layer is located on the substrate and has a transmission area and a reflective area. The metal pattern layer is located on the reflective layer and the substrate. The metal pattern layer includes a polarizer structure and a microstructure. The polarizer structure includes a plurality of grid lines overlapping the transmission area. A thickness of each of the grid lines is 200 nm to 500 nm, a width of each of the grid lines is 30 nm to 70 nm, and a distance between each adjacent two of the grid lines is 30 nm to 70 nm. The microstructure overlaps the reflective area, and a thickness of the microstructure is 20 nm to 500 nm.

Abstract: A photosensitive device includes a display panel, a photosensitive element substrate, and a first quarter wave plate. The photosensitive element substrate is located on the back of the display panel. The photosensitive element substrate includes a first substrate, a plurality of first light emitting diodes, a plurality of photosensitive elements, and a first polarizer structure. The first light emitting diodes and the photosensitive elements are located on the first substrate. The first polarizer structure is located on the first light emitting diodes and the photosensitive elements. The first quarter wave plate is located between the first polarizer structure and the display panel.

Abstract: An active device substrate including a substrate, first metal grid wires, a first transparent conductive layer, a gate insulating layer, a semiconductor layer, a source, and a drain is provided. The first metal grid wires are located on the substrate. The first transparent conductive layer includes a scan line and a gate connected to the scan line. The scan line and/or the gate is directly connected to at least a part of the first metal grid wires. The gate insulating layer is located on the first transparent conductive layer. The semiconductor layer is located on the gate insulating layer and overlapped with the gate. The source and the drain are electrically connected to the semiconductor layer.

Abstract: A substrate including a memory cell region and a peripheral circuit region is provided. A first dielectric layer, a first conductive layer and a mask layer are formed on the substrate. Isolation structures are formed, and the isolation structures in the memory cell region are denser than that in the peripheral circuit region. A protective layer is formed on the substrate in the second region. The mask layer in the first region is removed. A second conductive layer is formed on the substrate, wherein the protective layer has an etching selectivity the same to that of the second conductive layer. Portion of the second conductive layer and the protective layer are removed by using the isolation structures as stop layer. Portion of the isolation structures and the mask layer in the peripheral circuit region are removed. A second dielectric layer and a third conductive layer are formed on the substrate.

Abstract: An apparatus accesses and processes reflection images detected from microarray biochips with sidewalls. The apparatus uses a movable system to carry an optical module and a microtiter plate to achieve relative movement in different directions, so that pattern images of all wells in the microtiter plate can be retrieved during a single scanning process. Scanned image data are further compared with pre-defined patterns by a computer program for analysis.

Abstract: An apparatus accesses and processes reflection images detected from microarray biochips with sidewalls. The apparatus uses a movable system to carry an optical module and a microtitre plate to achieve relative movement in different directions, so that pattern images of all wells in the microtitre plate can be retrieved during a single scanning process. Scanned image data are further compared with pre-defined patterns by a computer program for analysis.