Patents by Inventor Chia-Shang Cheng

Chia-Shang Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240039170
    Abstract: An antenna system includes an antenna array and a floating metal element. The antenna array includes a plurality of antenna units. The floating metal element is adjacent to the antenna array. A coupling distance is formed between the floating metal element and the antenna array. The floating metal element is configured to suppress the side lobe radiation of the antenna array.
    Type: Application
    Filed: May 19, 2023
    Publication date: February 1, 2024
    Inventor: Chia-Shang CHENG
  • Patent number: 10833418
    Abstract: An antenna structure includes a dipole antenna element and a floating metal element. The floating metal element is disposed adjacent to the dipole antenna element. The vertical projection of the dipole antenna element at least partially overlaps the floating metal element. The floating metal element is configured for fine-tuning the radiation pattern of the antenna structure and to increase the operation bandwidth of the antenna structure.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: November 10, 2020
    Assignee: WISTRON NEWEB CORP.
    Inventor: Chia-Shang Cheng
  • Publication number: 20200287288
    Abstract: An antenna structure includes a dipole antenna element and a floating metal element. The floating metal element is disposed adjacent to the dipole antenna element. The vertical projection of the dipole antenna element at least partially overlaps the floating metal element. The floating metal element is configured for fine-tuning the radiation pattern of the antenna structure and to increase the operation bandwidth of the antenna structure.
    Type: Application
    Filed: May 30, 2019
    Publication date: September 10, 2020
    Inventor: Chia-Shang CHENG
  • Patent number: 9786991
    Abstract: A method for assembling a cross-type transmission module is provided, which includes the following steps. First, a first circuit board and a second circuit board are provided, wherein the first circuit board includes a first antenna, and the second circuit board includes a first groove and a second antenna. Then, the first circuit board is inserted partially through the first groove along an insertion direction to connect the first circuit board to the second circuit board, wherein the first circuit board is on a first plane, the second circuit board is on a second plane, an included angle ? is formed between the insertion direction and the second plane, and the included angle is not zero. In this embodiment, the included angle is 90 degrees, and the second plane is perpendicular to the first plane.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: October 10, 2017
    Assignee: Wistron Neweb Corp.
    Inventors: Bing-Chun Chung, Chia-Shang Cheng
  • Patent number: 9257741
    Abstract: An antenna structure includes a dipole antenna element, a closed-loop conductor, and a reflection plane. The dipole antenna element is configured to transmit an electromagnetic signal. The closed-loop conductor is disposed adjacent to the dipole antenna element. The dipole antenna element is substantially between the closed-loop conductor and the reflection plane, or the closed-loop conductor is substantially between the dipole antenna element and the reflection plane. The reflection plane is configured to reflect the electromagnetic signal from the dipole antenna element so as to enhance the total gain of the antenna structure. The mutual coupling effect between the closed-loop conductor and the dipole antenna element effectively causes the distance between the dipole antenna element and the reflection plane to be shorter.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: February 9, 2016
    Assignee: Wistron NeWeb Corp.
    Inventor: Chia-Shang Cheng
  • Publication number: 20150061957
    Abstract: A method for assembling a cross-type transmission module is provided, which includes the following steps. First, a first circuit board and a second circuit board are provided, wherein the first circuit board includes a first antenna, and the second circuit board includes a first groove and a second antenna. Then, the first circuit board is inserted partially through the first groove along an insertion direction to connect the first circuit board to the second circuit board, wherein the first circuit board is on a first plane, the second circuit board is on a second plane, an included angle ? is formed between the insertion direction and the second plane, and the included angle is not zero. In this embodiment, the included angle is 90 degrees, and the second plane is perpendicular to the first plane.
    Type: Application
    Filed: March 27, 2014
    Publication date: March 5, 2015
    Applicant: Wistron NeWeb Corp.
    Inventors: Bing-Chun CHUNG, Chia-Shang CHENG
  • Publication number: 20150042533
    Abstract: An antenna structure includes a dipole antenna element, a closed-loop conductor, and a reflection plane. The dipole antenna element is configured to transmit an electromagnetic signal. The closed-loop conductor is disposed adjacent to the dipole antenna element. The dipole antenna element is substantially between the closed-loop conductor and the reflection plane, or the closed-loop conductor is substantially between the dipole antenna element and the reflection plane. The reflection plane is configured to reflect the electromagnetic signal from the dipole antenna element so as to enhance the total gain of the antenna structure. The mutual coupling effect between the closed-loop conductor and the dipole antenna element effectively causes the distance between the dipole antenna element and the reflection plane to be shorter.
    Type: Application
    Filed: March 4, 2014
    Publication date: February 12, 2015
    Applicant: Wistron NeWeb Corp.
    Inventor: Chia-Shang CHENG
  • Patent number: 8896491
    Abstract: A cross-type transmission module is provided, including a first circuit board, a second circuit board, a first positioning structure, a second positioning structure and a base. The first circuit board includes a first antenna. The second circuit board includes a second antenna. The second circuit board intersects the first circuit board. The first V-shaped groove and a second V-shaped groove are formed between the first circuit board and the second circuit board. The first V-shaped groove is opposite to the second V-shaped groove. The first positioning structure is disposed in the first V-shaped groove, and is connected to the first circuit board and the second circuit board. The second positioning structure is disposed in the second V-shaped groove, and is connected to the first circuit board and the second circuit board. The first positioning structure and the second positioning structure are secured to the base.
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: November 25, 2014
    Assignee: Wistron NeWeb Corp.
    Inventors: Bing-Chun Chung, Chia-Shang Cheng