Abstract: A photo resist layer is used to protect a dielectric layer and conductive elements embedded in the dielectric layer when patterning an etch stop layer underlying the dielectric layer. The photo resist layer may further be used to etch another dielectric layer underlying the etch stop layer, where etching the next dielectric layer exposes a contact, such as a gate contact. The bottom layer can be used to protect the conductive elements embedded in the dielectric layer from a wet etchant used to etch the etch stop layer.

Abstract: A semiconductor device is disclosed. The semiconductor device includes a semiconductor fin. The semiconductor device includes first spacers over the semiconductor fin. The semiconductor device includes a metal gate structure, over the semiconductor fin, that is sandwiched at least by the first spacers. The semiconductor device includes a gate electrode contacting the metal gate structure. An interface between the metal gate structure and the gate electrode has its side portions extending toward the semiconductor fin with a first distance and a central portion extending toward the semiconductor fin with a second distance, the first distance being substantially less than the second distance.

Abstract: A method for cleaning a substrate is provided. The method includes following operations. A substrate is received. The substrate includes a first layer over a surface of the substrate and a second layer over the first layer. A plurality of particles are disposed over the surface of the first layer. A first mega sonic agitation is performed on the substrate with applying a first mixture. A second mega sonic agitation is performed on the substrate with applying a second mixture. A frequency of the first mega sonic agitation is greater than 3 MHz, and a frequency of the second mega sonic agitation is greater than 3 MHz. A flow rate of the first mixture is between approximately 1000 ml/min and approximately 5000 ml/min. A flow rate of the second mixture is between 1000 ml/min and approximately 3000 ml/min.

Abstract: A method for cleaning a substrate is provided. The method includes following operations. A substrate is received. The substrate has a plurality of conductive nanoparticles disposed over a surface of the substrate. A first mixture is applied to remove the conductive nanoparticles. The first mixture includes an SCl solution, DI water and O3. A second mixture is applied to the photomask substrate. The second mixture includes DI wafer and H2. A temperature of the second mixture is between approximately 20° C. and 40° C. The applying of the second mixture further includes a mega sonic agitation, and a frequency of the mega sonic agitation is greater than 3 MHz. A flow rate of the first mixture is between approximately 1000 ml/min and approximately 5000 ml/min. A flow rate of the second mixture is between 1000 ml/min and approximately 3000 ml/min.

Abstract: A method for cleaning a substrate is provided. The method includes following operations. A substrate is received. The substrate has a plurality of conductive nanoparticles disposed over a surface of the substrate. A first mixture is applied to remove the conductive nanoparticles. The first mixture includes an SC1 solution, DI water and O3. A second mixture is applied to the photomask substrate. The second mixture includes DI wafer and H2. A temperature of the second mixture is between approximately 20° C. and 40° C. The applying of the second mixture further includes a mega sonic agitation, and a frequency of the mega sonic agitation is greater than 3 MHz. A flow rate of the first mixture is between approximately 1000 ml/min and approximately 5000 ml/min. A flow rate of the second mixture is between 1000 ml/min and approximately 3000 ml/min.

Abstract: A photomask includes a substrate, a multilayer stack disposed over the substrate and configured to reflect a radiation, a capping layer over the multilayer stack, and an anti-reflective layer over the capping layer. The anti-reflective layer comprises a first pattern, wherein the first pattern exposes the capping layer and is configured as a printable feature. The photomask also includes an absorber spaced apart from the printable feature from a top-view perspective.

Abstract: A method for cleaning a substrate includes receiving a photomask substrate comprising a multilayered reflective structure disposed over a surface of the photomask substrate, a capping layer disposed on the multilayered reflective structure and an absorber, wherein the photomask substrate has a plurality of conductive nanoparticles disposed over the surface; applying a first mixture comprising a SC1 solution, a DI water and O3 to the photomask substrate to remove the conductive nanoparticles; and applying a DI water to rinse the photomask substrate. A removal rate of the conductive nanoparticles is greater than approximately 90%.

Abstract: A method for cleaning a substrate includes receiving a photomask substrate comprising a multilayered reflective structure disposed over a surface of the photomask substrate, a capping layer disposed on the multilayered reflective structure and an absorber, wherein the photomask substrate has a plurality of conductive nanoparticles disposed over the surface; applying a first mixture comprising a SC1 solution, a DI water and O3 to the photomask substrate to remove the conductive nanoparticles; and applying a DI water to rinse the photomask substrate. A removal rate of the conductive nanoparticles is greater than approximately 90%.

Abstract: A photomask includes a substrate, a multilayer stack disposed over the substrate and configured to reflect a radiation, a capping layer over the multilayer stack, and an anti-reflective layer over the capping layer. The anti-reflective layer comprises a first pattern, wherein the first pattern exposes the capping layer and is configured as a printable feature. The photomask also includes an absorber spaced apart from the printable feature from a top-view perspective.

Abstract: A camera module with non-mechanical blocking and non-blocking functions in relation to external light includes a lens, a light sensing element, and a housing. The lens includes interconnected first and second cavity regions, there being gas and/or colored liquid in the first cavity region or the second cavity region. The colored liquid exists in the first cavity region during a first state and, by the application of fingertip heat, in the second cavity region only during the second state, or the reverse. The light sensing element can receive or not receive external light representing images according to user choice. The housing receives the lens and the light sensing element.

Abstract: A camera module with non-mechanical blocking and non-blocking functions in relation to external light includes a lens, a light sensing element, and a housing. The lens includes interconnected first and second cavity regions, there being gas and/or colored liquid in the first cavity region or the second cavity region. The colored liquid exists in the first cavity region during a first state and, by the application of fingertip heat, in the second cavity region only during the second state, or the reverse. The light sensing element can receive or not receive external light representing images according to user choice. The housing receives the lens and the light sensing element.

Abstract: A camera module with non-mechanical blocking and non-blocking functions in relation to external light includes a lens, a light sensing element, and a housing. The lens includes interconnected first and second cavity regions, there being gas and/or colored liquid in the first cavity region or the second cavity region. The colored liquid exists in the first cavity region during a first state and, by the application of fingertip heat, in the second cavity region only during the second state, or the reverse. The light sensing element can receive or not receive external light representing images according to user choice. The housing receives the lens and the light sensing element.

Abstract: A camera module with non-mechanical blocking and non-blocking functions in relation to external light includes a lens, a light sensing element, and a housing. The lens includes interconnected first and second cavity regions, there being gas and/or colored liquid in the first cavity region or the second cavity region. The colored liquid exists in the first cavity region during a first state and, by the application of fingertip heat, in the second cavity region only during the second state, or the reverse. The light sensing element can receive or not receive external light representing images according to user choice. The housing receives the lens and the light sensing element.

Abstract: A method of preparing a tungsten metal material with high purity, comprising the steps of (A) providing a tungsten metal powder to mix with a metal nitrate to form a mixed powder slurry; (B) ball-grinding the mixed powder slurry to obtain a uniformly mixed powder; (C) sintering the uniformly mixed powder to obtain the tungsten metal material with high purity. Accordingly, the tungsten metal material with purity more than 99.9% can be prepared, so as to prepare the tungsten metal target.

Abstract: A support device is configured to receive an electronic device. The support device includes a base, a holder rotatably mounted to the base, a semi-gear engaged with the holder, an eccentric gear including an shaft inserted into the holder, a wheel module selectively to drive one of the semi-gear and the eccentric gear to rotate, and a rotating module fixed to the wheel module; when the rotating module is rotated in a first direction, the wheel module drives the semi-gear to rotate, so as to make the holder to move up and down with respect to the base; when the rotating module is rotated in a second direction reversed to the first direction, the wheel module drive the eccentric gear to rotate, so as to drive the holder to rotate with respect to the base to adjust an angle between the holder and the base.

Abstract: A bismuth ferrite thin-film solar cell and a method of manufacturing the same control the quantity of Fe2+ defected in the bismuth ferrite thin-film by doping with zinc. Reduction of the quantity of Fe2+ defects in the bismuth ferrite thin-film is conducive to the increase of closed-circuit current density and enhancement of photoelectric conversion efficiency.

Abstract: Electronic device and fastening anti-theft device, for preventing theft of the electronic device and includes a lock, a screw, a bracket, and a body having a locking plate extending from a side. The locking plate includes a slot, a locking hole and a shielding piece bent and protruding from a surface of the locking plate opposite to the body of the bracket, the shielding piece crosses over the slot. The screw is fastened to the electronic device and slides along the slot, the shielding piece is used in shielding the screw, and the lock passes through the locking hole and locks the electronic device.

Abstract: Fixing apparatus includes a pressing cover, a base facing to the pressing cover, a movable arm coupled between the pressing cover and the base, a chassis, an elastic element located between the pressing cover and the base, and a positioning shaft extending through the chassis, the base, and the elastic element to insert to the pressing cover. The positioning shaft forms a supporting portion away from the pressing cover. The chassis defines a first slot. When the chassis moves towards the pressing cover, the movable arm is pressed to open outwardly, the elastic element is compressed to press the chassis away from the pressing cover, the positioning portion moves towards the first slot until locks in the first slot. The fixing apparatus can press the device to the plank to fix the device on the plank.

Abstract: An electronic device dock for supporting an electronic device includes a dock body with a receiving space, a rotating gear, a switch, and a transmission member. The rotating head is received in the receiving space and rotatably connected to the dock body. The rotating gear is rotatably connected to the dock body and drives the rotating head to rotate relative to the dock body, to adjust a view angle of the electronic device. The switch is located in the dock body and is electrically connected to the electronic device when the electronic device is inserted into the rotating head. The transmission member is movably located in the dock body and is connected to the rotating gear. The transmission member being driven to move toward the switch and trigger the switch to control the electronic device when the rotating gear is rotated.

Abstract: A bismuth ferrite thin-film solar cell and a method of manufacturing the same control the quantity of Fe2+ defected in the bismuth ferrite thin-film by doping with zinc. Reduction of the quantity of Fe2+ defects in the bismuth ferrite thin-film is conducive to the increase of closed-circuit current density and enhancement of photoelectric conversion efficiency.