Patents by Inventor Chia-Tai Kuo
Chia-Tai Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8803166Abstract: An arrangement of light emitting diodes including a first micro-die, a second micro-die, a first bridge, a second bridge and a substrate supporting the first micro-die and the second micro die. The first micro-die includes a first edge having a first end and a second end, a second edge opposite and not parallel to the first edge, a first connecting portion near the first end, and a second connecting portion near the second end.Type: GrantFiled: August 23, 2010Date of Patent: August 12, 2014Assignee: Epistar CorporationInventors: Ming-Te Lin, Fei-Chang Hwang, Chia-Tai Kuo
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Patent number: 8368099Abstract: A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light.Type: GrantFiled: July 30, 2008Date of Patent: February 5, 2013Assignee: Industrial Technology Research InstituteInventors: Chien-Chun Lu, Chia-Tai Kuo, Chen-Peng Hsu, Hung-Lieh Hu, Chien-Jen Sun
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Patent number: 8053791Abstract: A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.Type: GrantFiled: April 15, 2009Date of Patent: November 8, 2011Assignee: Industrial Technology Research InstituteInventors: Ming-Te Lin, Fei-Chang Hwang, Chia-Tai Kuo
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Publication number: 20110012137Abstract: A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.Type: ApplicationFiled: August 23, 2010Publication date: January 20, 2011Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, EPISTAR CORPORATIONInventors: Ming-Te LIN, Fei-Chang Hwang, Chia-Tai Kuo
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Patent number: 7598533Abstract: A high power LED has at least a porous material layer, a thermal conductive layer and a chip. The thermal conductive layer is disposed on the surface of the porous material layer and the chip is disposed on the thermal conductive layer. Heat generated by the chip is conducted from the thermal conductive layer to the porous material layer, and convected outside via the porous material layer. Thereby, surface area in contact with the air is increased and high thermal conductivity and high heat convection are also achieved.Type: GrantFiled: May 2, 2006Date of Patent: October 6, 2009Assignee: Industrial Technology Research InstituteInventors: Chun Chieh Yang, Hong-Xi Cao, Chia-Tai Kuo, Chih-Li Chen, Cheng-Fa Chen, Ji-Bin Horng
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Patent number: 7589354Abstract: A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.Type: GrantFiled: August 2, 2005Date of Patent: September 15, 2009Assignee: Industrial Technology Research InstituteInventors: Ming-Te Lin, Sheng-Pan Huang, Chia-Tai Kuo, Chiu-Ling Chen, Ya-Hui Chiang, Ming-Yao Lin
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Publication number: 20090218580Abstract: A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.Type: ApplicationFiled: April 15, 2009Publication date: September 3, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INTSITUTEInventors: Ming-Te LIN, Fei-Chang Hwang, Chia-Tai Kuo
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Patent number: 7531843Abstract: A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.Type: GrantFiled: November 23, 2004Date of Patent: May 12, 2009Assignee: Industrial Technology Research InstituteInventors: Ming-Te Lin, Fei-Chang Hwang, Chia-Tai Kuo
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Publication number: 20090115313Abstract: A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light.Type: ApplicationFiled: July 30, 2008Publication date: May 7, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chien-Chun LU, Chia-Tai Kuo, Chen-Peng Hsu, Hung-Lieh Hu, Chien-Jen Sun
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Publication number: 20080218093Abstract: A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.Type: ApplicationFiled: May 9, 2008Publication date: September 11, 2008Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ming-Te Lin, Fei-Chang Hwang, Chia-Tai Kuo
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Publication number: 20060243997Abstract: A high power LED has at least a porous material layer, a thermal conductive layer and a chip. The thermal conductive layer is disposed on the surface of the porous material layer and the chip is disposed on the thermal conductive layer. Heat generated by the chip is conducted from the thermal conductive layer to the porous material layer, and convected outside via the porous material layer. Thereby, surface area in contact with the air is increased and high thermal conductivity and high heat convection are also achieved.Type: ApplicationFiled: May 2, 2006Publication date: November 2, 2006Inventors: Chun Yang, Hong-Xi Cao, Chia-Tai Kuo, Chih-Li Chen, Cheng-Fa Chen, Ji-Bin Horng
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Publication number: 20060145173Abstract: A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.Type: ApplicationFiled: August 2, 2005Publication date: July 6, 2006Inventors: Ming-Te Lin, Sheng-Pan Huang, Chia-Tai Kuo, Chiu-Ling Chen, Ya-Hui Chiang, Ming-Yao Lin
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Publication number: 20060044864Abstract: A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.Type: ApplicationFiled: November 23, 2004Publication date: March 2, 2006Inventors: Ming-Te Lin, Fei-Chang Hwang, Chia-Tai Kuo