Patents by Inventor Chia-Te Hsu

Chia-Te Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968840
    Abstract: A thin film transistor includes an active layer located over a substrate, a first gate stack including a stack of a first gate dielectric and a first gate electrode and located on a first surface of the active layer, a pair of first contact electrodes contacting peripheral portions of the first surface of the active layer and laterally spaced from each other along a first horizontal direction by the first gate electrode, a second contact electrode contacting a second surface of the active layer that is vertically spaced from the first surface of the active layer, and a pair of second gate stacks including a respective stack of a second gate dielectric and a second gate electrode and located on a respective peripheral portion of a second surface of the active layer.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yong-Jie Wu, Yen-Chung Ho, Hui-Hsien Wei, Chia-Jung Yu, Pin-Cheng Hsu, Feng-Cheng Yang, Chung-Te Lin
  • Patent number: 10070221
    Abstract: A signal processing system and a method thereof are disclosed, using a differential amplifier to extract sensed signals associated with headphone wear status generated by the diaphragm of a headphone and transmitted to a sense ADC for digitization. To exclude residual music signal in the extracted sensed signals for subsequent processing, a temporary memory is provided to match and synchronize a round-trip delay in the signal processing system. The round-trip delay is computed to adjust the depth and clock speed of a buffer/FIFO of the temporary memory to eliminate residual music signal in order to separate the sensed signal of the headphone unit diaphragm displacement and use the extracted sensed signal as a reference source for subsequent analysis and auto-control and/or signal compensation.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: September 4, 2018
    Assignee: LYRA SEMICONDUCTOR INCORPORATED
    Inventors: Hung-Chang Tsao, Chia-Te Hsu
  • Patent number: 9924268
    Abstract: A signal processing system and a method thereof are disclosed, using a differential amplifier to extract the sensed signals associated with the headphones wear status generated by the diaphragm of the headphone and push back to the sense ADC for digitization. Because the differential amplifier is non-ideal, certain residual music signal will exist. To exclude residual music signal for subsequent processing, a temporary memory is provided to match and synchronize the original playback signal retainment and the round-trip delay of external signal. The round-trip delay is computed to adjust the depth and clock speed of the buffer/FIFO of the temporary memory to, after synchronized with the total external propagation delay, eliminate residual music signal in a function block in order to separate the sense signal of the headphone driver unit diaphragm displacement and use the extracted sense signal for subsequent analysis and auto-control and/or signal compensation reference source.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: March 20, 2018
    Assignee: LYRA SEMICONDUCTOR INCORPORATED
    Inventors: Hung-Chang Tsao, Chia-Te Hsu