Patents by Inventor Chia-Te Wu

Chia-Te Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968840
    Abstract: A thin film transistor includes an active layer located over a substrate, a first gate stack including a stack of a first gate dielectric and a first gate electrode and located on a first surface of the active layer, a pair of first contact electrodes contacting peripheral portions of the first surface of the active layer and laterally spaced from each other along a first horizontal direction by the first gate electrode, a second contact electrode contacting a second surface of the active layer that is vertically spaced from the first surface of the active layer, and a pair of second gate stacks including a respective stack of a second gate dielectric and a second gate electrode and located on a respective peripheral portion of a second surface of the active layer.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yong-Jie Wu, Yen-Chung Ho, Hui-Hsien Wei, Chia-Jung Yu, Pin-Cheng Hsu, Feng-Cheng Yang, Chung-Te Lin
  • Patent number: 11937932
    Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: March 26, 2024
    Assignees: TAICHUNG VETERANS GENERAL HOSPITAL, TUNGHAI UNIVERSITY
    Inventors: Chieh-Liang Wu, Chun-Te Huang, Cheng-Hsu Chen, Tsai-Jung Wang, Kai-Chih Pai, Chun-Ming Lai, Min-Shian Wang, Ruey-Kai Sheu, Lun-Chi Chen, Yan-Nan Lin, Chien-Lun Liao, Ta-Chun Hung, Chien-Chung Huang, Chia-Tien Hsu, Shang-Feng Tsai
  • Publication number: 20060156988
    Abstract: A pin set is provided for a reactor, and the pin set has a lift pin, a pin guide and a pin weight. The pin guide is configured in the reactor and has a guide hole for the lift pin to move through. A guide gap is positioned between the guide hole and the lift pin. The pin weight has a weight hole, and a first end of the lift pin passes through the weight hole and is fixed on the pin weight. A weight gap is positioned between the weight hole and the lift pin, and the weight gap is smaller than the guide gap.
    Type: Application
    Filed: March 21, 2005
    Publication date: July 20, 2006
    Inventors: Chia-Te Wu, Te-Tsai Cheng, Shen-You Yeh
  • Publication number: 20050145929
    Abstract: An EEPROM integrated circuit structure. The structure has a substrate that includes a surface region. Preferably, the surface region is provided within a first cell region. The structure also has a gate dielectric layer of first thickness overlying the surface of the substrate region and a select gate overlying a first portion of the gate dielectric layer. A floating gate is overlying a second portion of the gate dielectric layer and is coupled to the select gate. An insulating layer is overlying the floating gate. A control gate is overlying the insulating layer and is coupled to the floating gate. A tunnel window provided in a stripe configuration is formed within a portion of the gate dielectric layer. The portion of the gate dielectric layer is characterized by a second thickness, which is less than the first thickness.
    Type: Application
    Filed: February 6, 2004
    Publication date: July 7, 2005
    Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Chia-Te Wu, Jian-Xiang Cai
  • Patent number: 6344395
    Abstract: A method for fabricating a non-volatile memory on the semiconductor substrate is disclosed. First of all, a plurality of trench isolation regions are formed. Then, firstly implanting ions of a first conductivity type and second conductivity type are carried out. Secondly implanting ions of the first conductivity type and second conductivity type are carried out. Then, a first oxide layer is deposited and the first oxide layer is removed. A second oxide layer is deposited. A portion of second oxide is removed, thus, a portion of second oxide layer is remained. A third oxide layer is formed. A first polysilicon layer is formed. The first polysilicon layer is etched. A oxide-nitride-oxide layer is formed. Consequentially, the oxide-nitride-oxide layer are all etched. The second polysilicon on is formed. A portion of the second polysilicon layer, a portion of the first polysilicon layer, a portion of the third oxide layer and a portion of the second oxide layer are all etched. Thus, capacitor columns are formed.
    Type: Grant
    Filed: July 24, 2000
    Date of Patent: February 5, 2002
    Assignee: United Microelectronics Corp.
    Inventors: Chih-Jen Huang, Chia-Te Wu
  • Patent number: D1024460
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: April 23, 2024
    Assignee: PLANDDO CO., LTD.
    Inventors: Tsung-Te Sun, Chao-Shun Liang, Chia-Hsin Wu, Ping-Yun Su, Yu-Huai Yang