Abstract: A high-insulation multilayer planar transformer (1) includes a pair of iron cores (20) and a circuit board integration (10a). The circuit board integration (10a) is stacked between the iron cores (20) and has a through hole (100a). The circuit board integration (10a) includes a first to a third insulating layers (11a, 12a, 14a) and a first to a second coil windings (13a, 15a). The first and third insulating layers (11a, 14a) include at least two insulating plates (111a, 141a) stacked with each other respectively. The second insulating layer (12a) includes at least one insulating plate (121a). The coil winding (13a, 15a) is disposed between the adjacent insulating layers and surrounds the through hole (100a) planarly. Therefore, the reinforced insulation requirement of safety regulations may be achieved.

Abstract: A method of assembling an inverter structure (1) includes: winding a coil set (12) around a bobbin (11), the bobbin (11) including a first side (11a) and a second side (11b) opposite to each other; inserting a first core pillar (21) of a first iron core (20) into a through hole (110) of the bobbin (11); sequentially placing a first insulation body (30), a middle iron core (40) and a second insulation body (50) into the through hole (110) from a second side (11b) of the bobbin (11); and inserting a second core pillar (61) of a second iron core (60) into the through hole (110) from the second side (11b) of the bobbin (11) and arranging the second core pillar (61) to be in contact with the second insulation body (50).

Abstract: A method of assembling an inverter structure (1) includes: winding a coil set (12) around a bobbin (11), the bobbin (11) including a first side (11a) and a second side (11b) opposite to each other; inserting a first core pillar (21) of a first iron core (20) into a through hole (110) of the bobbin (11); sequentially placing a first insulation body (30), a middle iron core (40) and a second insulation body (50) into the through hole (110) from a second side (11b) of the bobbin (11); and inserting a second core pillar (61) of a second iron core (60) into the through hole (110) from the second side (11b) of the bobbin (11) and arranging the second core pillar (61) to be in contact with the second insulation body (50).

Abstract: An electronic apparatus and an insulation structure thereof are provided. The electronic apparatus comprises a circuit board, an insulation structure and a transformer. The circuit board has a top surface, a bottom surface and an opening extending across the top surface and the bottom surface. The insulation structure has a first standing plate and a top plate. The first standing plate is connected with the top plate, and the first standing plate is disposed on the circuit board and inserted into the opening of the circuit board. A bottom surface of the top plate faces towards the top surface of the circuit board. The transformer is disposed on the top plate of the insulation structure and on the top surface of the top plate.