Patents by Inventor Chia-Tin Chung
Chia-Tin Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170263594Abstract: A light-mixing multichip package structure includes a circuit substrate, a first light-emitting module, a first package body, a second light-emitting module and a second package body. The first light-emitting module includes a plurality of first light-emitting elements disposed on the circuit substrate and electrically connected to the circuit substrate. The first package body is disposed on the circuit substrate to enclose the first light-emitting elements. The second light-emitting module includes a plurality of second light-emitting elements disposed on the circuit substrate and electrically connected to the circuit substrate, and the first light-emitting module and the first package body are surrounded by the second light-emitting elements. The second package body is disposed on the circuit substrate to enclose the first light-emitting module, the second light-emitting module and the first package body.Type: ApplicationFiled: May 10, 2016Publication date: September 14, 2017Inventors: CHIA-TIN CHUNG, SHIH-NENG TAI
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Patent number: 9698133Abstract: A method of manufacturing a multichip package structure includes providing a substrate body; placing a plurality of light-emitting chips on the substrate body, the light-emitting chips being electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, the semidrying surrounding light-reflecting frame having a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, the semidrying surrounding light-reflecting frame contacting and surrounding the package colloid body.Type: GrantFiled: July 31, 2015Date of Patent: July 4, 2017Assignee: PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTDInventors: Chia-Tin Chung, Fang-Kuei Wu
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Publication number: 20170122501Abstract: A LED illumination device includes a carrier structure, a suspension structure, and a light-emitting structure. The carrier structure includes a carrier body and a first heat-conducting body fixedly disposed inside the carrier body. The carrier body has an outer thread structure disposed on an outer perimeter surface. The first heat-conducting body has a bottom contacting surface exposed from a bottom side of the carrier body. The suspension structure includes a first suspension element detachably disposed on a top side of the carrier body. The light-emitting structure includes a circuit substrate and a light-emitting unit. The circuit substrate is detachably disposed on the bottom side of the carrier body to contact the bottom contacting surface of the first heat-conducting body, and the light-emitting unit is disposed on the circuit substrate. Therefore, heat generated by the light-emitting unit is guided to the first heat-conducting body through the circuit substrate.Type: ApplicationFiled: November 3, 2015Publication date: May 4, 2017Inventors: CHIA-TIN CHUNG, SHEN-TA YANG, SHIOU-LIANG YEH
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Publication number: 20170038009Abstract: An AC LED lamp structure includes a light-emitting module and a protection module. The light-emitting module includes a circuit substrate positioned on a carrier body and a light-emitting unit disposed on the circuit substrate. The protection module includes a transparent element disposed under the light-emitting unit and separated from the light-emitting unit and a plurality of connection components connected between the transparent element and the carrier body for positioning the transparent element under the circuit substrate by a predetermined distance. Therefore, the flammability class of the AC LED lamp structure is increased by using the transparent element. The predetermined distance from the transparent element to the circuit substrate is smaller than a finger of a user in order to prevent the finger of the user from touching the circuit substrate through a gap between the transparent element and the circuit substrate, and avoid electric shock.Type: ApplicationFiled: October 7, 2015Publication date: February 9, 2017Inventors: CHIA-TIN CHUNG, SHEN-TA YANG, SHIOU LIANG YEH
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Patent number: 9544957Abstract: An illumination device including a voltage transformer module, a switching unit, a control module, a sensor module, a first illumination module and a second illumination module. The switching unit is coupled to the rectifier module and the voltage transformer module. The control module is coupled to the switching unit and the voltage transformer module. The sensor module is electrically connected to the control module. The sensor module senses an invading object within an induction area. The first illumination module is electrically connected to the switching unit. The second illumination module is electrically connected to the sensor module. The sensor module supplies electricity to the second illumination module to emit light. The sensor module outputs a sensing signal to the control module when the sensor module senses the invading object. The control module controls the switching unit to be turned on so that the first illumination module emits light.Type: GrantFiled: December 2, 2015Date of Patent: January 10, 2017Assignee: PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.Inventors: Chia-Tin Chung, Shih-Neng Tai
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Patent number: 9451662Abstract: Disclosed is an AC light emitting device. The AC light emitting device is electrically connected to an AC power, and the AC power is rectified by a rectification module and inputs an input voltage. The AC light emitting device comprises a buck module, a switching unit, a control module and an AC lighting emitting module. The buck module is electrically connected to the rectification module. The switching unit is electrically connected to the rectification module and the buck module. The control module is electrically connected to the switching unit and the buck module. The AC lighting emitting module is electrically connected to the switching unit. The control module outputs a pulse waveform signal to the switching unit according to the input voltage and a dimming signal, and the switching unit turns on or off the AC lighting emitting module according to the pulse waveform signal.Type: GrantFiled: September 28, 2015Date of Patent: September 20, 2016Assignee: PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.Inventors: Chia-Tin Chung, Shih-Neng Tai
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Patent number: 9433103Abstract: A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried colloid outer layer totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.Type: GrantFiled: July 20, 2015Date of Patent: August 30, 2016Assignee: PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.Inventors: Chia-Tin Chung, Chao-Chin Wu, Fang-Kuei Wu
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Publication number: 20160109071Abstract: A circuit substrate for carrying at least one light-emitting diode and a light-emitting structure for providing illumination are disclosed. The circuit substrate includes an insulation base layer, a conductive heat-dissipating layer, an insulation covering layer, a conductive circuit structure and a conductive through structure. The conductive heat-dissipating layer is disposed on the insulation base layer. The insulation covering layer is disposed on the conductive heat-dissipating layer. The conductive circuit structure includes a first electrode conductive layer and a second electrode conductive layer that are disposed on the insulation covering layer. The conductive through structure passes through the insulation covering layer and is connected between the conductive heat-dissipating layer and one of the first electrode conductive layer and the second electrode conductive layer.Type: ApplicationFiled: January 26, 2015Publication date: April 21, 2016Inventor: CHIA-TIN CHUNG
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Publication number: 20150340352Abstract: A method of manufacturing a multichip package structure includes providing a substrate body; placing a plurality of light-emitting chips on the substrate body, the light-emitting chips being electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, the semidrying surrounding light-reflecting frame having a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, the semidrying surrounding light-reflecting frame contacting and surrounding the package colloid body.Type: ApplicationFiled: July 31, 2015Publication date: November 26, 2015Inventors: Chia-Tin Chung, Fang-Kuei Wu
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Publication number: 20150327373Abstract: A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried colloid outer layer totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.Type: ApplicationFiled: July 20, 2015Publication date: November 12, 2015Inventors: CHIA-TIN CHUNG, CHAO-CHIN WU, FANG-KUEI WU
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Patent number: 9125328Abstract: A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.Type: GrantFiled: March 21, 2012Date of Patent: September 1, 2015Assignee: PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.Inventors: Chia-Tin Chung, Chao-Chin Wu, Fang-Kuei Wu
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Patent number: 9078312Abstract: A multichip package structure includes a substrate unit, a light-emitting unit, a control module, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The control module includes at least one current-limiting unit and the rectifier unit electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting unit and the rectifier unit. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting unit and the rectifier unit.Type: GrantFiled: December 9, 2010Date of Patent: July 7, 2015Assignee: PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.Inventors: Shih-Neng Dai, Chia-Tin Chung
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Patent number: 9029883Abstract: An LED package structure with concave area for positioning heat-conducting substance includes a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a concave space formed on the substrate body, and a plurality of positive and negative pads exposed on the substrate body. The heat-conducting adhesive unit has a heat-conducting adhesive layer positioned in the concave space. The light-emitting unit has a plurality of LED chips disposed on the heat-conducting adhesive layer and received in the concave space. The conductive unit has a plurality of wires. Each LED chip is electrically connected between each positive pad and each negative pad. The package unit has a translucent package resin body disposed on the substrate body in order to cover the LED chips and the wires.Type: GrantFiled: July 11, 2011Date of Patent: May 12, 2015Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.Inventor: Chia-Tin Chung
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Patent number: 9018662Abstract: A multichip package structure includes a metal substrate, a circuit substrate and a light-emitting module. The metal substrate has a first mirror plane area and a second mirror plane area. The circuit substrate is disposed on the metal substrate. The circuit substrate includes a plurality of first conductive pads, a plurality of second conductive pads, a first passing opening for exposing the first mirror plane area, and a second passing opening for exposing the second mirror plane area. The light-emitting module includes a plurality of light-emitting units disposed on the first mirror plane area. Each light-emitting unit includes a plurality of LED chips disposed on the first mirror plane area. The LED chips of each light-emitting unit are electrically connected between the first conductive pad and the second conductive pad in series. Thus, the heat-dissipating efficiency and the light-emitting effect of the multichip package structure can be increased.Type: GrantFiled: November 11, 2013Date of Patent: April 28, 2015Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.Inventors: Chia-Tin Chung, Shih-Neng Tai
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Publication number: 20150061513Abstract: A multichip package structure includes a metal substrate, a circuit substrate and a light-emitting module. The metal substrate has a first mirror plane area and a second mirror plane area. The circuit substrate is disposed on the metal substrate. The circuit substrate includes a plurality of first conductive pads, a plurality of second conductive pads, a first passing opening for exposing the first mirror plane area, and a second passing opening for exposing the second mirror plane area. The light-emitting module includes a plurality of light-emitting units disposed on the first mirror plane area. Each light-emitting unit includes a plurality of LED chips disposed on the first mirror plane area. The LED chips of each light-emitting unit are electrically connected between the first conductive pad and the second conductive pad in series. Thus, the heat-dissipating efficiency and the light-emitting effect of the multichip package structure can be increased.Type: ApplicationFiled: November 11, 2013Publication date: March 5, 2015Applicant: PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.Inventors: CHIA-TIN CHUNG, SHIH-NENG TAI
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Patent number: 8899789Abstract: A lamp module includes a cover structure, a circuit board structure and a multichip package structure, and the circuit board structure and the multichip package structure are sequentially assembled on the bottom side of the cover structure. The cover structure includes a cover body, a plurality of positioning elements disposed on the bottom side of the cover body, and a plurality of retaining elements disposed on the bottom side of the cover body. The cover body has a through opening and a surrounding light-reflecting surface formed on the inner surface of the through opening. The circuit board structure is disposed on the bottom side of the cover body and includes a plurality of conductive pins disposed on the bottom side of the circuit board structure. The multichip package structure is disposed on the bottom side of the cover body and electrically connected to the circuit board structure.Type: GrantFiled: August 16, 2012Date of Patent: December 2, 2014Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.Inventors: Chia-Tin Chung, Shih-Neng Tai
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Patent number: 8876334Abstract: A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a package unit, and a frame unit. The substrate unit includes a substrate body. The light-emitting unit includes a plurality of first and second light-emitting groups. The first and the second light-emitting groups are disposed on the substrate body and electrically connected to the substrate body in series. Each first light-emitting group includes a plurality of first parallel connection units electrically connected in parallel, and each first parallel connection unit includes at least one blue LED chip, and each second light-emitting group includes at least one red LED chip. The package unit includes a phosphor resin body disposed on the substrate body to cover the first and the second light-emitting groups. The frame unit includes a surrounding light-reflecting frame surrounding the first and the second light-emitting groups and the phosphor resin body.Type: GrantFiled: January 16, 2012Date of Patent: November 4, 2014Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.Inventors: Chia-Tin Chung, Shih-Neng Tai
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Patent number: 8779660Abstract: An illumination device for enhancing plant growth includes a substrate unit, a light-emitting unit, a current-limiting unit, and a control unit. The substrate unit includes a substrate body. The light-emitting unit, the current-limiting unit, and the control unit are disposed on the substrate body. The light-emitting unit includes a first light-emitting module, a second light-emitting module, and a third light-emitting module. The current-limiting unit includes a first current-limiting chip electrically connected to the first light-emitting module, a second current-limiting chip electrically connected to the second light-emitting module, and a third current-limiting chip electrically connected to the third light-emitting module.Type: GrantFiled: September 22, 2011Date of Patent: July 15, 2014Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.Inventors: Chia-Tin Chung, Shih-Neng Tai
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Patent number: 8749164Abstract: An illuminating apparatus is disclosed. The illuminating apparatus includes a detecting unit, an illuminating unit, and a control unit. The illuminating unit includes multiple illuminating sets and a switching unit for adjusting a connection relationship among the illuminating sets. The detecting unit is for detecting an inputted power supply received by the illuminating unit while the control unit is coupled to the detecting unit and the switching unit. The control unit based on a detected inputted power supply controls the switching unit according to a predetermined setting parameter, so as to ensure a conducting voltage of the illuminating unit to vary according to a variation in the inputted power supply.Type: GrantFiled: September 23, 2011Date of Patent: June 10, 2014Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.Inventors: Chia-Tin Chung, Shih-Neng Tai
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Patent number: 8742696Abstract: An illuminating apparatus adapted to receive an input power which is a pulse DC includes a lighting unit, a detecting unit and a controlling unit. The lighting unit includes a plurality of lighting sets and a switching unit. The switching unit may be used to cause the lighting sets interconnected in a serial fashion and/or in a parallel manner. The detecting unit detects a state of the input power. The control unit couples the detecting unit and the lighting unit, and controls the switching unit according to the detecting unit detecting the state of the input power. As such, the turn-on voltages of the lighting unit may adjust at different stages of the input power.Type: GrantFiled: July 13, 2011Date of Patent: June 3, 2014Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.Inventors: Shih-Neng Tai, Chia-Tin Chung