Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.

Abstract: A light action element module, a lighting device, and a lighting system are provided. The light action element module includes N×K light action elements, wherein adjacent light action elements are connected with each other. A detachable section is disposed between every two connecting light action elements. The light action elements are for separating into a plurality of combinations of the light action elements along at least a part of the detachable sections, or the light action elements are adapted to form a combination of the light action elements without separating, so as to produce different piecing-together manners, wherein N and K are positive integers, and N is greater than or equal to 2.