Patents by Inventor Chia Voon Tan

Chia Voon Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device, system and method to promote the integrity of signal communications
    Patent number: 11153968
    Abstract: Techniques and mechanisms for mitigating the effect of signal noise on communication via an interconnect. In an embodiment, a substrate includes an interconnect and a conductor which has a hole formed therein. Portions of the interconnect variously extend over a side of the conductor, wherein another recess portion of the interconnect extends from a plane which includes the side, and further extends at least partially into the hole. The configuration of the recess portion extending within the hole may contribute to an impedance which dampens a transmitter slew rate of the communication. In an embodiment, a total distance along a path formed by the interconnect is equal to or less than 5.5 inches.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: October 19, 2021
    Assignee: Intel Corporation
    Inventors: Jackson Chung Peng Kong, Bok Eng Cheah, Khang Choong Yong, Yun Ling, Chia Voon Tan
  • DEVICE, SYSTEM AND METHOD TO PROMOTE THE INTEGRITY OF SIGNAL COMMUNICATIONS
    Publication number: 20190045625
    Abstract: Techniques and mechanisms for mitigating the effect of signal noise on communication via an interconnect. In an embodiment, a substrate includes an interconnect and a conductor which has a hole formed therein. Portions of the interconnect variously extend over a side of the conductor, wherein another recess portion of the interconnect extends from a plane which includes the side, and further extends at least partially into the hole. The configuration of the recess portion extending within the hole may contribute to an impedance which dampens a transmitter slew rate of the communication. In an embodiment, a total distance along a path formed by the interconnect is equal to or less than 5.5 inches.
    Type: Application
    Filed: December 14, 2017
    Publication date: February 7, 2019
    Applicant: Intel Corporation
    Inventors: Jackson Chung Peng Kong, Bok Eng Cheah, Khang Choong Yong, Yun Ling, Chia Voon Tan