Patents by Inventor Chia-Wei Fan

Chia-Wei Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200013721
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a conductive casing, a semiconductor die, a conductive connector, an insulating encapsulant, a redistribution structure, and a first conductive terminal. The conductive casing has a cavity. The semiconductor die is disposed in the cavity of the conductive casing. The conductive connector is disposed on a periphery of the conductive casing. The insulating encapsulant encapsulates the conductive connector, the semiconductor die and the cavity. The redistribution structure is formed on the insulating encapsulant and is electrically connected to the conductive connector and the semiconductor die. The first conductive terminal is disposed in openings of the redistribution structure and is physically in contact with a portion of the conductive casing.
    Type: Application
    Filed: July 9, 2018
    Publication date: January 9, 2020
    Applicant: Powertech Technology Inc.
    Inventors: Chia-Wei Chiang, Li-Chih Fang, Wen-Jeng Fan
  • Publication number: 20200006274
    Abstract: A semiconductor package includes a semiconductor die, a first redistribution structure, a conductive structure, and an insulating encapsulant. The first redistribution structure includes a dielectric protrusion. The first redistribution structure includes a die attach region and a peripheral region surrounding the die attach region. The semiconductor die is disposed on the first redistribution structure within the die attach region. The dielectric protrusion is disposed in the peripheral region and extends in a thickness direction of the semiconductor die. The conductive structure is disposed on the first redistribution structure within the in the peripheral region and encapsulates the semiconductor dielectric protrusion. The conductive structure is electrically coupled to the first redistribution structure and the semiconductor die. The insulator is disposed on the first redistribution structure and encapsulates the semiconductor die and the conductive structure.
    Type: Application
    Filed: June 29, 2018
    Publication date: January 2, 2020
    Applicant: Powertech Technology Inc.
    Inventors: Chia-Wei Chiang, Li-Chih Fang, Wen-Jeng Fan
  • Patent number: 10496164
    Abstract: An electronic device may have a display. Input-output circuitry in the electronic device may be used to gather input from a viewer of the display. The input-output circuitry may include a gaze tracking system that gathers point-of-gaze information, vergence information, and head position information, may be a biometric sensor, may be an input device such as a button or touch sensor, may capture hand gestures, and/or may gather other information. The display may include a pixel array for producing images. An adjustable reflectance and transmittance layer may overlap the pixel array. Control circuitry in the electronic device may individually adjust different areas of the adjustable reflectance and transmittance layer. The control circuitry may place each area in a reflective mirror more or in a content-displaying mode and may move the areas in response to the information.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: December 3, 2019
    Assignee: Apple Inc.
    Inventors: Paul V. Johnson, Yuan Chen, Bryan W. Posner, Cheng Chen, Chia Hsuan Tai, Jiaying Wu, Robert Y. Cao, Shih-Chyuan Fan Jiang, Shih-Wei Chang, Xiaokai Li, Zhibing Ge, Dinesh C. Mathew
  • Patent number: 10431549
    Abstract: A semiconductor package including a stacked-die structure, a second encapsulant laterally encapsulating the stacked-die structure and a redistribution layer disposed on the second encapsulant and the staked-die structure is provided. The stacked-die structure includes a first semiconductor die including a first active surface, a circuit layer disposed on the first active surface, a second semiconductor die including a second active surface facing towards the first active surface, a plurality of conductive features distributed at the circuit layer and electrically connected to the first and second semiconductor die and a first encapsulant encapsulating the second semiconductor die and the conductive features. A portion of the conductive features surrounds the second semiconductor die. The redistribution layer is electrically connected to the staked-die structure. A manufacturing method of a semiconductor package is also provided.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: October 1, 2019
    Assignee: Powertech Technology Inc.
    Inventors: Chien-Wen Huang, Chia-Wei Chiang, Wen-Jeng Fan, Li-Chih Fang
  • Publication number: 20190214347
    Abstract: A semiconductor package including a stacked-die structure, a second encapsulant laterally encapsulating the stacked-die structure and a redistribution layer disposed on the second encapsulant and the staked-die structure is provided. The stacked-die structure includes a first semiconductor die including a first active surface, a circuit layer disposed on the first active surface, a second semiconductor die including a second active surface facing towards the first active surface, a plurality of conductive features distributed at the circuit layer and electrically connected to the first and second semiconductor die and a first encapsulant encapsulating the second semiconductor die and the conductive features. A portion of the conductive features surrounds the second semiconductor die. The redistribution layer is electrically connected to the staked-die structure. A manufacturing method of a semiconductor package is also provided.
    Type: Application
    Filed: January 10, 2018
    Publication date: July 11, 2019
    Applicant: Powertech Technology Inc.
    Inventors: Chien-Wen Huang, Chia-Wei Chiang, Wen-Jeng Fan, Li-Chih Fang
  • Patent number: 8508930
    Abstract: The invention discloses a hard disk carrying apparatus comprising a main body, a plurality of slide racks, and a plurality of valves. In the main body, an accommodating space is concavely disposed at a front side of the main body; a plurality of primary slide rails that are adjacent and parallel to each other are disposed on a bottom wall in the accommodating space; a plurality of secondary slide rails is disposed on a top wall in the accommodating space. Each of the plurality of slide racks is a long rack. Each of the plurality of valves is a long door plate member. An end of each valve is a pivot end that is pivotally installed at a bottom edge of the front side of the main body; the other end of the valve is a latch end that includes a locking element disposed thereon.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: August 13, 2013
    Assignee: Promise Technology, Inc.
    Inventors: Cheng-Tzu Peng, Char T. Vijay, Hsiang-Chien Liu, Chuan-Yi Yeh, Chia-Wei Fan
  • Patent number: 8439709
    Abstract: An electrical connector, adapted for electrically connecting an integrated circuit package, comprises a plurality of contacts, a plurality of solder balls disposed on tails of the contacts and an insulative housing. The insulative housing defines a plurality of passageways receiving the contacts. Each contact has a retaining portion, an elastic arm and a soldering portion. The contacts positioned in two adjacent rows of passageways are arranged staggered in a back to back manner. Such arrangement of the contacts of the electrical connector allows much more contacts to be put in the insulative housing.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: May 14, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chia-Wei Fan
  • Patent number: 8419446
    Abstract: An electrical connector includes an insulative housing with a plurality of passageways arranged in a matrix. A contact includes a base for securing the contact in the passageway, a spring portion and a soldering portion extending from the base. The soldering portions of the contacts laid in a row of the passageways are alternately arranged toward two opposite sides of the base to form two rows. Such array of soldering portions of the contact can improve contact density.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: April 16, 2013
    Assignee: Hon Hai Precision Ind. Co., Ltd
    Inventor: Chia-Wei Fan
  • Patent number: 8358507
    Abstract: A hard drive carrying device and its hard drive box can fasten a plurality of hard drive boxes in a containing slot of the supporting stand by utilizing simplified mechanism so that a user can rapidly open the locking of the hard drive box by pressing a pressing member to quickly take the hard drive box out from the supporting stand. A hard drive carrying device comprises a supporting stand with a plurality of containing slots, a plurality of hard drive boxes, wherein each hard drive box comprises a main frame, an engaging member and a lock protection member, wherein the lock protection member further comprises a sliding piece, a fastening elastic piece, a pressing member and an elastic member. The device uses the structural design to exactly thin the opening mechanism for the hard drive box to effectively reduce the occupied space so as to increase the actual application.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: January 22, 2013
    Assignee: Promise Technology, Inc.
    Inventors: Cheng-Tzu Peng, Hsiang-Chien Liu, Chuan-Yi Yeh, Chia-Wei Fan
  • Patent number: 8255178
    Abstract: An apparatus for detecting an operational status of a semiconductor equipment includes an audio frequency signal receiving unit and an analysis and determination unit. The audio frequency signal receiving unit is used for receiving an audio frequency signal from the semiconductor equipment while the semiconductor equipment is working. The analysis and determination unit is used for analyzing the audio frequency signal to determine statuses of components of the semiconductor equipment.
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: August 28, 2012
    Assignee: Inotera Memories, Inc.
    Inventors: Yu-Chang Huang, Chia-Wei Fan
  • Publication number: 20120113583
    Abstract: The invention discloses a hard disk carrying apparatus comprising a main body, a plurality of slide racks, and a plurality of valves. In the main body, an accommodating space is concavely disposed at a front side of the main body; a plurality of primary slide rails that are adjacent and parallel to each other are disposed on a bottom wall in the accommodating space; a plurality of secondary slide rails is disposed on a top wall in the accommodating space. Each of the plurality of slide racks is a long rack. Each of the plurality of valves is a long door plate member. An end of each valve is a pivot end that is pivotally installed at a bottom edge of the front side of the main body; the other end of the valve is a latch end that includes a locking element disposed thereon.
    Type: Application
    Filed: March 25, 2011
    Publication date: May 10, 2012
    Applicant: Promise Technology, Inc.
    Inventors: Cheng-Tzu Peng, Char T. Vijay, Hsiang-Chien Liu, Chuan-Yi Yeh, Chia-Wei Fan
  • Patent number: 8172598
    Abstract: An electrical connector includes a base, a cover, a protecting mechanism, and a cam. The base has a contacting area with a plurality of passageways and a first end besides the contacting area with an opening in a first end thereof. The cover is slidably mounted upon the base. The cover defines a plurality of through holes in alignment with the corresponding passageways, respectively, and another opening is defined in a second end thereof and in vertical alignment with the corresponding opening of the base. The protecting mechanism includes a metallic base plate mounted upon the base and defining a stepping hole which includes a larger first hole and a smaller second hole via a drawing process, disposed in the opening of the base. The cam extends axially and vertically in the opening of the cover and the stepping hole of the base, and is riveted on a bottom surface of the base plate.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: May 8, 2012
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Chia-Wei Fan
  • Publication number: 20120104916
    Abstract: A hard drive carrying device and its hard drive box can fasten a plurality of hard drive boxes in a containing slot of the supporting stand by utilizing simplified mechanism so that a user can rapidly open the locking of the hard drive box by pressing a pressing member to quickly take the hard drive box out from the supporting stand. A hard drive carrying device comprises a supporting stand with a plurality of containing slots, a plurality of hard drive boxes, wherein each hard drive box comprises a main frame, an engaging member and a lock protection member, wherein the lock protection member further comprises a sliding piece, a fastening elastic piece, a pressing member and an elastic member. The device uses the structural design to exactly thin the opening mechanism for the hard drive box to effectively reduce the occupied space so as to increase the actual application.
    Type: Application
    Filed: January 18, 2011
    Publication date: May 3, 2012
    Inventors: Cheng-Tzu PENG, Hsiang-Chien Liu, Chuan-Yi Yeh, Chia-Wei Fan
  • Patent number: 8142201
    Abstract: A pick-up cap includes a main portion having a planar top surface with a first end and a second end opposite to the first end. Four latches are positioned at the two ends of the main portion and extend from the main portion, respectively. Each latch has a hook extending downwardly. And a supporting portion extending downwardly and being adjacent to the hook. The supporting portion is lower than the hook in a vertical direction to engage with an insulative housing to protect the hook during the pick-up cap is disassembled from the insulative housing.
    Type: Grant
    Filed: July 30, 2009
    Date of Patent: March 27, 2012
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Chia-Wei Fan
  • Publication number: 20120064774
    Abstract: An electrical connector, adapted for electrically connecting an integrated circuit package, comprises a plurality of contacts, a plurality of solder balls disposed on tails of the contacts and an insulative housing. The insulative housing defines a plurality of passageways receiving the contacts. Each contact has a retaining portion, an elastic arm and a soldering portion. The contacts positioned in two adjacent rows of passageways are arranged staggered in a back to back manner. Such arrangement of the contacts of the electrical connector allows much more contacts to be put in the insulative housing.
    Type: Application
    Filed: September 8, 2011
    Publication date: March 15, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHIA-WEI FAN
  • Patent number: 8070495
    Abstract: An electrical connector assembly (1) mounted on a printed circuit board (4) includes at least two electrical connectors (2) located on one side of the printed circuit board (4) and a back plate arrangement (3) located on the other side of the printed circuit board (4) opposite to the electrical connectors (2). The back plate arrangement (3) secures the electrical connectors (2) onto the printed circuit board (4), and includes at least two back plates (30) and at least one connecting bridge (31) interconnecting the at lest two back plates (30).
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: December 6, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chia-Wei Fan, Nan-Hung Lin
  • Patent number: 8052439
    Abstract: A pick-up cap includes a main portion with a planar top surface and having a first end and a second end opposite to each other. At least two latches extend downwardly from the first and the second ends of the main portion, respectively. Each latch has a hook extending laterally from the latch, and the latch on the second end has a supporting portion extending downwardly and connecting with the hook for facilitative assembling and disassembling the pick-up cap from an insulative housing.
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: November 8, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chia-Wei Fan, Hao-Yun Ma
  • Patent number: 7972153
    Abstract: An electrical connector assembly (100) comprises an insulative housing (3), a plurality of contacts (2) received in the insulative housing (3) and a pick-up cap (1) assembled to the insulative housing (3), the contact (2) comprises a base portion (20), a contacting portion (21) extending upwardly from the base portion (20) and a rear portion (23) extending downwardly from the base portion (20), the pick-up cap (1) comprises a flat body portion (10), the body portion (10) comprises an upper surface (101) and a lower surface (102) opposite to each other, the lower surface (102) is supported by the insulative housing (3), a receiving space (1020) recesses from the lower surface (102), and the contacting portions (21) of said contacts (2) project beyond the lower surface (102) into the receiving space (1020).
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: July 5, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Andrew Cheng, Chih-Pi Cheng, Chia-Wei Fan
  • Patent number: 7950932
    Abstract: An electrical connector includes a base plate, a plurality of contacts, and a plurality of solder portions. The base plate has a plurality of through holes extending from a top surface and a bottom surface therebetween. The contacts is assembled in through holes, and each contact comprises a spring portion disposed upon the top surface, a soldering portion passing through the through hole and with a tail extending beyond the bottom surface, and a stopping portion connecting the spring portion and the soldering portion and abutting against the top surface. The solder portions are attached to the tails of the soldering portions for fixing the contacts to the base plate.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: May 31, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Chia-Wei Fan
  • Patent number: 7938665
    Abstract: A socket, for electrically connecting an IC package with gaps on two sides thereof and a printed circuit board, comprises an insulative housing, a plurality of contacts received in the insulative housing and a pair of engaging clumps. The insulative housing has a bottom wall and a plurality of sidewalls upwardly extending from the bottom wall, the sidewalls and the bottom wall together define a space for the IC package, two opposed sidewall further have engaging slots. The engaging clump is received in the engaging slot, and has a post entering into the space to engaging with the gap of the IC package and a transverse arm abutting against and position the IC package.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: May 10, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chia-Wei Fan, Nan-Hung Lin, Fu-Pin Hsieh