Patents by Inventor Chia-Wei JUI

Chia-Wei JUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10197255
    Abstract: A rail-type organic light emitting diode lamp assembly is provided. The lamp assembly includes a lamp module, an annular member, a connector, a conductive member, and a rail module. The annular member includes a protrusion portion having a pair of indentations. The connector is connected to the annular member, and includes a through hole, a first end provided with a pair of ears and a second end provided with a pair of hooks. The conductive member is provided in the through hole and has a first end in contact with the annular conductive coil. The rail module is connected with the connector and includes a conductor in contact with a second end of the conductive member. The connector can be slidably hooked to the rail module through the hooks, and after the ears are inserted into the indentations, the annular member can be rotatable with respect to the connector.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: February 5, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Heng-Chieh Chien, Yu-Lin Chao, Wen-Fu Hsu, Chih-Ming Shen, Chia-Wei Jui, Yao-Shun Chen
  • Publication number: 20180128468
    Abstract: A rail-type organic light emitting diode lamp assembly is provided. The lamp assembly includes a lamp module, an annular member, a connector, a conductive member, and a rail module. The annular member includes a protrusion portion having a pair of indentations. The connector is connected to the annular member, and includes a through hole, a first end provided with a pair of ears and a second end provided with a pair of hooks. The conductive member is provided in the through hole and has a first end in contact with the annular conductive coil. The rail module is connected with the connector and includes a conductor in contact with a second end of the conductive member. The connector can be slidably hooked to the rail module through the hooks, and after the ears are inserted into the indentations, the annular member can be rotatable with respect to the connector.
    Type: Application
    Filed: April 5, 2017
    Publication date: May 10, 2018
    Inventors: Heng-Chieh Chien, Yu-Lin Chao, Wen-Fu Hsu, Chih-Ming Shen, Chia-Wei Jui, Yao-Shun Chen
  • Publication number: 20180129763
    Abstract: A method of manufacturing a foot auxiliary equipment includes the following steps. Firstly, a foot appearance of a foot and a foot muscle of the foot are scanned for obtaining a foot appearance data model and a foot muscle data s model respectively. Then, the foot appearance data model and the foot muscle data model are synthesized into a foot data model. Then, a dynamic state analysis and a static state analysis are performed on the foot data model. Then, a foot auxiliary equipment data model is generated according to result of the dynamic state analysis and result of the static state analysis. Then, a foot auxiliary equipment is printed by using three-dimensional printing technique according to the foot auxiliary equipment data model.
    Type: Application
    Filed: December 9, 2016
    Publication date: May 10, 2018
    Inventors: Ming-Kan LIANG, Wei LI, Chih-Ming SHEN, Ming-Ji DAI, Chia-Wei JUI
  • Publication number: 20160043239
    Abstract: Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability.
    Type: Application
    Filed: October 22, 2015
    Publication date: February 11, 2016
    Inventors: Hsiang-Hung Chang, Wen-Chih Chen, Chia-Wei Jui, Zhi-Cheng Hsiao, Cheng-Ta Ko, Rong-Shen Lee, Sheng-Shu Yang
  • Publication number: 20150097259
    Abstract: Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability.
    Type: Application
    Filed: December 15, 2014
    Publication date: April 9, 2015
    Applicant: Industrial Technology Research Institute
    Inventors: Hsiang-Hung CHANG, Wen-Chih CHEN, Chia-Wei JUI, Zhi-Cheng HSIAO, Cheng-Ta KO, Rong-Shen LEE, Sheng-Shu YANG