Abstract: Provided are structures and methods for forming structures with sloping surfaces of a desired profile. An exemplary method includes performing a first etch process to differentially etch a gate material to a recessed surface, wherein the recessed surface includes a first horn at a first edge, a second horn at a second edge, and a valley located between the first horn and the second horn; depositing an etch-retarding layer over the recessed surface, wherein the etch-retarding layer has a central region over the valley and has edge regions over the horns, and wherein the central region of the etch-retarding layer is thicker than the edge regions of the etch-retarding layer; and performing a second etch process to recess the horns to establish the gate material with a desired profile.

Abstract: A semiconductor structure includes a semiconductor substrate, first to third isolation structures, and a conductive feature. The first to third isolation structures are over the semiconductor substrate and spaced apart from each other. The semiconductor substrate comprises a region surrounded by a sidewall of the first isolation structure and a first sidewall of the second isolation structure. The conductive feature extends vertically in the semiconductor substrate and between the between the second and third isolation structures, wherein the conductive feature has a rounded corner adjoining a second sidewall of the second isolation structure opposite the first sidewall of the second isolation structure.

Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.

Abstract: A semiconductor device is disclosed. The semiconductor device includes a semiconductor fin. The semiconductor device includes first spacers over the semiconductor fin. The semiconductor device includes a metal gate structure, over the semiconductor fin, that is sandwiched at least by the first spacers. The semiconductor device includes a gate electrode contacting the metal gate structure. An interface between the metal gate structure and the gate electrode has its side portions extending toward the semiconductor fin with a first distance and a central portion extending toward the semiconductor fin with a second distance, the first distance being substantially less than the second distance.

Abstract: A touch display panel comprises a display module and a sensing electrode layer. The sensing electrode layer is disposed on the substrate of the display module and includes first sensing electrodes, second sensing electrode and wires. The first sensing electrodes are arranged along a longitudinal direction. The second sensing electrode is extended along the longitudinal direction and disposed beside the first sensing electrodes. The wires are electrically connected with the first sensing electrodes and include a plurality of wire segments which are extended alternately along a first extending direction and a second extending direction. The first sensing electrode includes a plurality of first slits, the first slits are extended along the first extending direction, the second extending direction or the combination thereof.

Abstract: A touch display panel comprises a display module and a sensing electrode layer. The sensing electrode layer is disposed on the substrate of the display module and includes first sensing electrodes, second sensing electrode and wires. The first sensing electrodes are arranged along a longitudinal direction. The second sensing electrode is extended along the longitudinal direction and disposed beside the first sensing electrodes. The wires are electrically connected with the first sensing electrodes and include a plurality of wire segments which are extended alternately along a first extending direction and a second extending direction. The first sensing electrode includes a plurality of first slits, the first slits are extended along the first extending direction, the second extending direction or the combination thereof.

Abstract: An embodiment of the invention provides a method performed by a de-multiplexer that is coupled to a front-end stream buffer and a plurality of back-end video buffers. The front-end stream buffer is configured to buffer a plurality of video data units of a video stream. The video stream includes a plurality of subordinate video streams interleaved therein. Each of the back-end video buffers is configured to buffer the video information contained in a corresponding one of the subordinate video streams. First, the de-multiplexer determines whether it is blocked from fetching the video information of a first video data unit buffered in the front-end stream buffer. Then, if being blocked, the de-multiplexer skips accessing the first video data unit and instead fetches the video information of a second video data unit buffered in the front-end stream buffer.

Abstract: An embodiment of the invention provides a method performed by a de-multiplexer that is coupled to a front-end stream buffer and a plurality of back-end video buffers. The front-end stream buffer is configured to buffer a plurality of video data units of a video stream. The video stream includes a plurality of subordinate video streams interleaved therein. Each of the back-end video buffers is configured to buffer the video information contained in a corresponding one of the subordinate video streams. First, the de-multiplexer determines whether it is blocked from fetching the video information of a first video data unit buffered in the front-end stream buffer. Then, if being blocked, the de-multiplexer skips accessing the first video data unit and instead fetches the video information of a second video data unit buffered in the front-end stream buffer.

Abstract: Methods for generating and playing a multimedia file and a recording medium storing the multimedia file are provided. In the generating method, multimedia data to be written in the multimedia file is generated, and then a media chunk for storing the multimedia data is generated. Next, a metadata chunk including metadata that describes the characteristics of the media chunk and the multimedia data is generated by analyzing the characteristics of the media chunk. Afterwards, the metadata chunk and the media chunk are written into the multimedia data file. When all the media chunks have been written, the multimedia file is scanned and the metadata chunks therein are read, such that an index table recording the relations among the multimedia data is generated in the multimedia file. Therefore, the procedure for generating the multimedia file is simplified and the time for preparing the play of the multimedia file is reduced.

Abstract: A method of multimedia file playback for an optical storage medium adapted for playing a multimedia file stored in the optical storage medium is disclosed. The multimedia file includes a playback information and a media data. The method includes the steps as follows: first, sorting the playback information to obtain a sorted playback information table; compressing the sorted playback information table into a plurality of compressed partitions; establishing a time index table used for recording the starting playback time of each compressed partition; and finally, decompressing the compressed partitions sequentially to read the media data according to the time index table, so as to play the multimedia file.