Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes an array substrate, which includes a substrate, a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer. The substrate has a substrate surface. The first conductive layer is located on the substrate surface. The first insulating layer is located on the first conductive layer. The second conductive layer is located on the first insulating layer and includes a first sputtering layer, a second sputtering layer, and a third sputtering layer. The second insulating layer is located on the second conductive layer. The second sputtering layer is located between the first and third sputtering layers, and includes a first metal element. The first sputtering layer includes the first metal element and a second metal element. The third sputtering layer includes the first metal element and a third metal element.

Abstract: A display apparatus includes a driving backplane and a light-emitting element. The driving backplane includes a substrate, a pixel driving circuit disposed on the substrate and a pad electrically connected to the pixel driving circuit. The pad has a first metal layer, a first intermetallic layer and a first diffusion barrier layer, wherein the first metal layer, the first intermetallic layer and the first diffusion barrier layer are sequentially stacked along a direction away from the substrate. The light-emitting element includes an electrode and a conductive bump electrically connected to the electrode. The conductive bump has a second intermetallic layer, and the first diffusion barrier layer is located between the second intermetallic layer and the first intermetallic layer.

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes an array substrate, which includes a substrate, a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer. The substrate has a substrate surface. The first conductive layer is located on the substrate surface. The first insulating layer is located on the first conductive layer. The second conductive layer is located on the first insulating layer and includes a first sputtering layer, a second sputtering layer, and a third sputtering layer. The second insulating layer is located on the second conductive layer. The second sputtering layer is located between the first and third sputtering layers, and includes a first metal element. The first sputtering layer includes the first metal element and a second metal element. The third sputtering layer includes the first metal element and a third metal element.