Patents by Inventor Chia-Wen Weng

Chia-Wen Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor devices attachable to electronic devices
    Patent number: 11428552
    Abstract: In an example implementation according to aspects of the present disclosure, a system includes a sensor device attachable to an electronic device. The sensor device includes a first alignment member and a first conductive contact. The electronic device includes a second alignment member to align with the first alignment member of the sensor device, and a second conductive contact wherein, upon alignment of the sensor device with the electronic device via the first and second alignment members, to make contact with the first conductive contact of the sensor device.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: August 30, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ching-Sheng Cheng, Chia-Wen Weng
  • SENSOR DEVICES ATTACHABLE TO ELECTRONIC DEVICES
    Publication number: 20220113170
    Abstract: In an example implementation according to aspects of the present disclosure, a system includes a sensor device attachable to an electronic device. The sensor device includes a first alignment member and a first conductive contact. The electronic device Includes a second alignment member to align with the first alignment member of the sensor device, and a second conductive contact wherein, upon alignment of the sensor device with the electronic device via the first and second alignment members, to make contact with the first conductive contact of the sensor device.
    Type: Application
    Filed: April 25, 2019
    Publication date: April 14, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Ching-Sheng Cheng, Chia-Wen Weng