Patents by Inventor CHIA-WENG HSU

CHIA-WENG HSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12225660
    Abstract: A circuit board assembly in a camera module for blocking unwanted light when images are captured includes a circuit board, a sensor, and an optical blocking body connecting the circuit board and the sensor. The circuit board includes a base board and a photomask. The photomask is arranged on a surface of the base board, the base board includes conductive circuit layers and dielectric layers, the conductive circuit layers and the dielectric layers are alternately arranged, the sensor being electronically connected to the conductive layers. The optical blocking body, the photomask, and the dielectric layers block ambient light entering the camera module other than through the lens assembly of the camera module.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: February 11, 2025
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    Inventors: Ying-Lin Chen, Chia-Weng Hsu, Ping-Liang Eng, Feng-Chang Chien
  • Patent number: 12088906
    Abstract: An electronic device includes a camera module comprising a circuit board, a lens, a first IC chip, and at least one metal column. The lens is mounted on the circuit board. The first IC chip and the metal column are arranged on a surface of the circuit board away from the lens. An attachment includes a body and a second IC chip. The first IC chip and the second IC chip can communicate with each other. The circuit board includes a first surface closed to the attachment. The metal column is arranged on the first surface, and the body includes a second surface close to the camera module. The body further includes at least a connecting channel. The metal column is located in the connecting channel to realize the electrical connection between the camera module and the attachment.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: September 10, 2024
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    Inventors: Ye-Quang Chen, Chia-Weng Hsu, Wen-Ching Lai, Wan-Li Zhang
  • Publication number: 20230413426
    Abstract: A circuit board assembly in a camera module for blocking unwanted light when images are captured includes a circuit board, a sensor, and an optical blocking body connecting the circuit board and the sensor. The circuit board includes a base board and a photomask. The photomask is arranged on a surface of the base board, the base board includes conductive circuit layers and dielectric layers, the conductive circuit layers and the dielectric layers are alternately arranged, the sensor being electronically connected to the conductive layers. The optical blocking body, the photomask, and the dielectric layers block ambient light entering the camera module other than through the lens assembly of the camera module.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 21, 2023
    Inventors: YING-LIN CHEN, CHIA-WENG HSU, PING-LIANG ENG, FENG-CHANG CHIEN
  • Patent number: 11778291
    Abstract: A circuit board includes a circuit substrate, a first solder mask, and a plurality of heat dissipation fins. The circuit substrate includes a first surface. The first solder mask is arranged on the first surface. The plurality of heat dissipation fins are arranged on a surface of the first solder mask facing away from the first surface. A heat dissipation channel is formed between any two adjacent of the plurality of heat dissipation fins. A camera assembly having the circuit board and an electronic device having the circuit board are also provided.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: October 3, 2023
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    Inventor: Chia-Weng Hsu
  • Publication number: 20230171478
    Abstract: An electronic device includes a camera module comprising a circuit board, a lens, a first IC chip, and at least one metal column. The lens is mounted on the circuit board. The first IC chip and the metal column are arranged on a surface of the circuit board away from the lens. An attachment includes a body and a second IC chip. The first IC chip and the second IC chip can communicate with each other. The circuit board includes a first surface closed to the attachment. The metal column is arranged on the first surface, and the body includes a second surface close to the camera module. The body further includes at least a connecting channel. The metal column is located in the connecting channel to realize the electrical connection between the camera module and the attachment.
    Type: Application
    Filed: January 18, 2022
    Publication date: June 1, 2023
    Inventors: YE-QUANG CHEN, CHIA-WENG HSU, WEN-CHING LAI, WAN-LI ZHANG
  • Publication number: 20220321750
    Abstract: A circuit board includes a circuit substrate, a first solder mask, and a plurality of heat dissipation fins. The circuit substrate includes a first surface. The first solder mask is arranged on the first surface. The plurality of heat dissipation fins are arranged on a surface of the first solder mask facing away from the first surface. A heat dissipation channel is formed between any two adjacent of the plurality of heat dissipation fins. A camera assembly having the circuit board and an electronic device having the circuit board are also provided.
    Type: Application
    Filed: October 28, 2021
    Publication date: October 6, 2022
    Inventor: CHIA-WENG HSU