Abstract: The present invention discloses a semiconductor package comprising a substrate having a plurality of substrate units, a plurality of semiconductor chips respectively disposed on the substrate units, and a plurality of conductive guard lines each disposed between two adjacent substrate units. Each substrate unit is provided with a plurality of contact pads and a plurality of conductive leads respectively connected to the corresponding contact pads. The semiconductor chips are electrically connected to the plurality of contact pads through the conductive leads. Each substrate unit has at least one of the contact pads electrically connected to the conductive guard lines such that the semiconductor package of the present invention can efficiently achieve the function of electrostatic discharge (ESD) protection.