Patents by Inventor Chia-Yen Pai

Chia-Yen Pai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
    Publication number: 20240128125
    Abstract: A method of forming a semiconductor device includes providing a substrate having a recess, and growing an epitaxial feature in the recess. The method of growing the epitaxial feature includes: (a) growing a sub-layer of the epitaxial feature; (b) selectively etching the sub-layer of the epitaxial feature while providing a first UV radiation; and (c) repeating step (a) and step (b) alternately multiple times.
    Type: Application
    Filed: February 1, 2023
    Publication date: April 18, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Winnie Victoria Wei-Ning Chen, Chia-Ling Pai, Pang-Yen Tsai
  • GLASS SHEETS WITH IMPROVED EDGE QUALITY AND METHODS OF PRODUCING THE SAME
    Publication number: 20210078900
    Abstract: A method of manufacturing and treating a glass article wherein the treatment of the article includes directing a flow of plasma, such as a flow of plasma comprising an atmospheric pressure plasma jet, toward an edge surface of the article. Such treatment can reduce a density of particles on an edge surface of the article. Such treatment can also increase the edge strength of the article.
    Type: Application
    Filed: December 10, 2018
    Publication date: March 18, 2021
    Inventors: Jiangwei Feng, Chia-Yen Pai, James Joseph Price, Wanda Janina Walczak