Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.

Abstract: An application module (A) running on a host computer in a computer network is failure-protected with one or more backup copies that are operative on other host computers in the network. In order to effect fault protection, the application module registers itself with a ReplicaManager daemon process (112) by sending a registration message, which message, in addition to identifying the registering application module and the host computer on which it is running, includes the particular replication strategy (cold backup, warm backup, or hot backup) and the degree of replication associated with that application module. The backup copies are then maintained in a fail-over state according to the registered replication strategy. A WatchDog daemon (113), running on the same host computer as the registered application periodically monitors the registered application to detect failures.

Abstract: An application module (A) running on a host computer in a computer network is failure-protected with one or more backup copies that are operative on other host computers in the network. In order to effect fault protection, the application module registers itself with a ReplicaManager daemon process (112) by sending a registration message, which message, in addition to identifying the registering application module and the host computer on which it is running, includes the particular replication strategy (cold backup, warm backup, or hot backup) and the degree of replication associated with that application module. The backup copies are then maintained in a fail-over state according to the registered replication strategy. A WatchDog daemon (113), running on the same host computer as the registered application periodically monitors the registered application to detect failures.