Abstract: The invention provides a holder having a main body, a fixing module and an actuating module. Both the fixing module and the actuating module are positioned on the main body. When the actuating module moves along a first direction, the fixing module is driven from either a release state or a fixed state to another state along a second direction different from the first direction. The invention further provides a holder applied to an electronic apparatus. The holder has a main body and a detachable base. The detachable base is positioned on the main body, and has a base cover and a circuit board. The base cover has a connecting part. The circuit board is covered by the base cover, and has a plurality of pins for connecting to a connecting port of the electronic apparatus.

Abstract: A thin-type semiconductor device and a die pad thereof are proposed. The thin-type semiconductor device includes a semiconductor chip, a die pad, a plurality of leads and an encapsulant. With the use of a strengthening structure formed on a side surface of the die pad and/or on a first surface of the die pad other than an area for attaching the chip thereto, adherence between the die pad and the encapsulant can be enhanced, as well as delamination between the die pad and the encapsulant or crack in the encapsulant can be prevented from occurrence, and accordingly credibility and reliability of the semiconductor device can be assured.