Abstract: Semiconductor devices and fabrication methods are provided. In one example, a semiconductor device includes: a substrate, a fin formed on the substrate, a gate structure formed on the fin, a metal contact formed on the fin and adjacent to the gate structure. The fin extends along a first horizontal direction, the gate structure and the metal contact extend along a second horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction. The gate structure further includes a gate electrode coupled to the fin and a dielectric gate isolation section separated from the gate electrode. The dielectric gate isolation section includes a dielectric material. A portion of the dielectric gate isolation section is aligned with a portion of the metal contact adjacent and proximate to the dielectric gate isolation section in the first horizontal direction.

Abstract: An immersion cooling system includes a work tank, a chip device, a microchannel device, a first communication pipeline, and a first heat exchange device. The work tank includes a fluid section. The chip device is in the fluid section and has an inlet and an outlet. The chip device includes a motherboard, a chip, and a cover. The motherboard has a main surface substantially parallel to a vertical line. The cover is on the motherboard. The chip is between the cover and the motherboard. The microchannel device is in the chip device. Two ends of the microchannel device are respectively in communication with the inlet and the outlet. The first communication pipeline and the first heat exchange device are in the fluid section. Two ends of the first communication pipeline are respectively in communication with the outlet and the first heat exchange device.

Abstract: A piece of immersion liquid cooling equipment, which is adapted for an electronic device, includes a tank, a condenser, a cold plate, and a first pipe. The tank accommodates a first fluid, and the electronic device is immersed in the first fluid in the form of a liquid. The condenser is disposed in the tank and located above the first fluid in the form of a liquid. The cold plate is disposed in the tank and is in thermal contact with at least one high power commodity of the electronic device. The first pipe is disposed and extends between an exterior and an interior of the tank. The first pipe communicates with the condenser and the cold plate. The first pipe is configured to receive a second fluid to flow through the condenser and the cold plate. A heat dissipation method for an electronic device.

Abstract: A midsole and a method of manufacturing it includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.

Abstract: A midsole and a method of manufacturing it includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.

Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.

Abstract: An article of footwear includes an upper and a sole assembly positioned beneath the upper. The sole assembly has a vertically extending channel formed in its bottom surface inward of a periphery of the sole assembly, the channel including opposed sidewalls and an end surface. The sole assembly includes a first portion having a first color; and a second portion having a second color that is different than the first color. An interface between the first portion and the second portion is positioned at a central portion of one of the sidewalls of the channel. A method of forming such an article of footwear is also disclosed.

Abstract: A sole assembly may be formed by a method that includes positioning a plurality of preforms having different colors together to form a sole assembly preform and placing the sole assembly preform in a recess in a first portion of a mold assembly. The sole assembly preform is subjected to heat for a predetermined amount of time such that the plurality of preforms bond to one another to form a sole assembly.

Abstract: A method of forming a sole assembly includes positioning a plurality of preforms having different colors together to form a sole assembly preform and placing the sole assembly preform in a recess in a first portion of a mold assembly. The sole assembly preform is subjected to heat for a predetermined amount of time such that the plurality of preforms bond to one another to form a sole assembly.

Abstract: An article of footwear includes an upper and a sole assembly positioned beneath the upper. The sole assembly has a vertically extending channel formed in its bottom surface inward of a periphery of the sole assembly, the channel including opposed sidewalls and an end surface. The sole assembly includes a first portion having a first color; and a second portion having a second color that is different than the first color. An interface between the first portion and the second portion is positioned at a central portion of one of the sidewalls of the channel. A method of forming such an article of footwear is also disclosed.

Abstract: An article of footwear includes an upper and a sole assembly positioned beneath the upper. The sole assembly has a vertically extending channel formed in its bottom surface inward of a periphery of the sole assembly, the channel including opposed sidewalls and an end surface. The sole assembly includes a first portion having a first color; and a second portion having a second color that is different than the first color. An interface between the first portion and the second portion is positioned at a central portion of one of the sidewalls of the channel. A method of forming such an article of footwear is also disclosed.

Abstract: The present invention relates to the growth of a native oxide layer on a surface of a silicon substrate. Deep ultraviolet (UV) light is irradiated to thereby effectively improve the quality of the native oxide layer. By improving the quality, the difficulty of the surface treatment of a cross-section sample for scanning capacitance microscopy (SCM) is improved. The life cycle and reliability of the sample are also improved with enhanced reproducibility for the measurement of SCM. Thus, the present invention provides an improved method and an apparatus using the same to prepare a cross-sectional sample for SCM. The feasibility and the concrete method for enhancing oxide layer quality on a silicon substrate surface by UV light irradiation under a humidity-controlled environment are established. The optimum parameters of irradiation time for n-type and p-type samples are made.

Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.

Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.

Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.

Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.

Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.

Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.

Abstract: A mold used to form a midsole for an article of footwear and a method of manufacturing are disclosed. The mold includes a first portion and a second portion cooperating to define a midsole recess, the first portion including a major recess and plurality of wall segments extending throughout the major recess and cooperating to define a plurality of minor recesses. A fillet is provided at each intersection of adjacent wall segments. The mold may have a draft angle of less than or equal to approximately 2.5 degrees.

Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.