Abstract: The present disclosure provides a correction system and method for correcting a semiconductor circuit. The correction system includes a plurality of redundant circuit units, a plurality of switching circuit units and a control circuit. The redundant circuit units are coupled to the semiconductor circuit. The switching circuit units are coupled to the redundant circuit units and a plurality of basic circuit units of the semiconductor circuit. The control circuit is coupled to the semiconductor circuit and the switching circuit units, is configured to obtain a noise signal of the semiconductor circuit, is configured to determine whether the semiconductor circuit passes a noise test by recognizing a characteristic of the noise signal, and is configured to replace one of the basic circuit units with one of the redundant circuit units by controlling the switching circuit units when the semiconductor circuit does not pass the noise test.

Abstract: Disclosed herein are novel single-stranded anti-sense oligonucleotides (ASOs) capable of reducing the transcription of thioredoxin domain containing protein 5 (TXNDC5) mRNA. Also disclosed is use of the single-stranded ASOs as disclosed herein for manufacturing medicaments suitable for treating a disease associated with upregulation of TXNDC5. Accordingly, a pharmaceutical composition comprising the disclosed ASO molecules is provided; as well as a method of treating a subject suffering from TXNDC5-mediated disease via administering to the subject the disclosed single-stranded ASO molecules.

Abstract: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.

Abstract: A stirrup module includes an outer stirrup set, an upper-opening stirrup set having an upper opening and provided in an opening of the outer stirrup of the outer stirrup set, and a lower-opening stirrup set having a lower opening and provided in the opening of the outer stirrup of the outer stirrup set. Wherein the upper opening and the opening of the outer stirrup are oriented in the same direction, the lower opening and the upper opening are in opposite directions to each other. Wherein the upper-opening stirrup set has a first bottom of stirrup opposite to the upper opening, and the first bottom of stirrup corresponds to the position of the lower opening; the lower-opening stirrup set has a second bottom rib opposite to the lower opening, and the second bottom rib corresponds to the position of the upper opening.

Abstract: A circuit of a resonant power converter comprising: a high-side switch and a low-side switch, coupled to form a half-bridge switching circuit which is configured to switch a transformer for generating an output voltage; a high-side drive circuit, generating a high-side drive signal coupled to drive the high-side switch in response to a high-side control signal; a bias voltage, coupled to a bootstrap diode and a bootstrap capacitor providing a power source from the bootstrap capacitor for the high-side drive circuit; wherein the high-side drive circuit generates the high-side drive signal with a fast slew rate to turn on the high-side switch when the high-side switch is to be turned on with soft-switching; the high-side drive circuit generates the high-side drive signal with a slow slew rate to turn on the high-side switch when the high-side switch is to be turned on without soft-switching.

Abstract: An antenna module includes two antenna units, two isolation members, and a grounding member. Each antenna unit consists of two feeding ends, two first radiators, and two second radiators. The isolating members are disposed between the first and second portions of each antenna unit. The grounding member is disposed beside the two antenna units and the two isolation members. A first slot is formed among each first radiator, the second radiator, and the grounding member. The two second radiators are connected to the third radiator. A third slot is formed between the second radiator and the second portion. The two antenna units are symmetric to the fourth slot in a mirrored manner, and the two first portions have widths gradually changing along an extending direction of the fourth position.

Abstract: Semiconductor devices and fabrication methods are provided. In one example, a semiconductor device includes: a substrate, a fin formed on the substrate, a gate structure formed on the fin, a metal contact formed on the fin and adjacent to the gate structure. The fin extends along a first horizontal direction, the gate structure and the metal contact extend along a second horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction. The gate structure further includes a gate electrode coupled to the fin and a dielectric gate isolation section separated from the gate electrode. The dielectric gate isolation section includes a dielectric material. A portion of the dielectric gate isolation section is aligned with a portion of the metal contact adjacent and proximate to the dielectric gate isolation section in the first horizontal direction.

Abstract: An immersion cooling system includes a work tank, a chip device, a microchannel device, a first communication pipeline, and a first heat exchange device. The work tank includes a fluid section. The chip device is in the fluid section and has an inlet and an outlet. The chip device includes a motherboard, a chip, and a cover. The motherboard has a main surface substantially parallel to a vertical line. The cover is on the motherboard. The chip is between the cover and the motherboard. The microchannel device is in the chip device. Two ends of the microchannel device are respectively in communication with the inlet and the outlet. The first communication pipeline and the first heat exchange device are in the fluid section. Two ends of the first communication pipeline are respectively in communication with the outlet and the first heat exchange device.

Abstract: A piece of immersion liquid cooling equipment, which is adapted for an electronic device, includes a tank, a condenser, a cold plate, and a first pipe. The tank accommodates a first fluid, and the electronic device is immersed in the first fluid in the form of a liquid. The condenser is disposed in the tank and located above the first fluid in the form of a liquid. The cold plate is disposed in the tank and is in thermal contact with at least one high power commodity of the electronic device. The first pipe is disposed and extends between an exterior and an interior of the tank. The first pipe communicates with the condenser and the cold plate. The first pipe is configured to receive a second fluid to flow through the condenser and the cold plate. A heat dissipation method for an electronic device.

Abstract: A midsole and a method of manufacturing it includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.

Abstract: A midsole and a method of manufacturing it includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.

Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.

Abstract: An article of footwear includes an upper and a sole assembly positioned beneath the upper. The sole assembly has a vertically extending channel formed in its bottom surface inward of a periphery of the sole assembly, the channel including opposed sidewalls and an end surface. The sole assembly includes a first portion having a first color; and a second portion having a second color that is different than the first color. An interface between the first portion and the second portion is positioned at a central portion of one of the sidewalls of the channel. A method of forming such an article of footwear is also disclosed.

Abstract: A sole assembly may be formed by a method that includes positioning a plurality of preforms having different colors together to form a sole assembly preform and placing the sole assembly preform in a recess in a first portion of a mold assembly. The sole assembly preform is subjected to heat for a predetermined amount of time such that the plurality of preforms bond to one another to form a sole assembly.

Abstract: A method of forming a sole assembly includes positioning a plurality of preforms having different colors together to form a sole assembly preform and placing the sole assembly preform in a recess in a first portion of a mold assembly. The sole assembly preform is subjected to heat for a predetermined amount of time such that the plurality of preforms bond to one another to form a sole assembly.

Abstract: An article of footwear includes an upper and a sole assembly positioned beneath the upper. The sole assembly has a vertically extending channel formed in its bottom surface inward of a periphery of the sole assembly, the channel including opposed sidewalls and an end surface. The sole assembly includes a first portion having a first color; and a second portion having a second color that is different than the first color. An interface between the first portion and the second portion is positioned at a central portion of one of the sidewalls of the channel. A method of forming such an article of footwear is also disclosed.

Abstract: An article of footwear includes an upper and a sole assembly positioned beneath the upper. The sole assembly has a vertically extending channel formed in its bottom surface inward of a periphery of the sole assembly, the channel including opposed sidewalls and an end surface. The sole assembly includes a first portion having a first color; and a second portion having a second color that is different than the first color. An interface between the first portion and the second portion is positioned at a central portion of one of the sidewalls of the channel. A method of forming such an article of footwear is also disclosed.

Abstract: The present invention relates to the growth of a native oxide layer on a surface of a silicon substrate. Deep ultraviolet (UV) light is irradiated to thereby effectively improve the quality of the native oxide layer. By improving the quality, the difficulty of the surface treatment of a cross-section sample for scanning capacitance microscopy (SCM) is improved. The life cycle and reliability of the sample are also improved with enhanced reproducibility for the measurement of SCM. Thus, the present invention provides an improved method and an apparatus using the same to prepare a cross-sectional sample for SCM. The feasibility and the concrete method for enhancing oxide layer quality on a silicon substrate surface by UV light irradiation under a humidity-controlled environment are established. The optimum parameters of irradiation time for n-type and p-type samples are made.

Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.

Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.