Patents by Inventor CHIA-YING CHOU

CHIA-YING CHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing polyimide composite film for flexible metal-clad substrate
    Patent number: 11655348
    Abstract: A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: May 23, 2023
    Assignee: TAIMIDE TECHNOLOGY INCORPORATION
    Inventors: Jia-Hao Wu, Chia-Ying Chou, Chun-Yi Cheng
  • METHOD FOR MANUFACTURING POLYIMIDE COMPOSITE FILM FOR FLEXIBLE METAL-CLAD SUBSTRATE
    Publication number: 20220411594
    Abstract: A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.
    Type: Application
    Filed: June 23, 2021
    Publication date: December 29, 2022
    Inventors: JIA-HAO WU, CHIA-YING CHOU, CHUN-YI CHENG