Patents by Inventor Chia-Ying Wu

Chia-Ying Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10943991
    Abstract: A semiconductor device and a method for fabricating the semiconductor device are provided, in which the method includes the steps of forming a gate structure on a substrate, forming a spacer on a sidewall of the gate structure, forming two recesses adjacent to two sides of the spacer, performing a cleaning process to trim the spacer for forming a void between the spacer and the substrate, and forming two portions of an epitaxial layer in the two recesses. The semiconductor device preferably includes a cap layer on the two portions of the epitaxial layer as the cap layer includes a planar top surface and an inclined sidewall.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: March 9, 2021
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Wei-Chih Chuang, Chia-Jong Liu, Kuang-Hsiu Chen, Chung-Ting Huang, Chi-Hsuan Tang, Kai-Hsiang Wang, Bing-Yang Jiang, Yu-Lin Cheng, Chun-Jen Chen, Yu-Shu Lin, Jhong-Yi Huang, Chao-Nan Chen, Guan-Ying Wu
  • Patent number: 10942181
    Abstract: The present disclosure provides a method for quantifying a vaccine. The method includes the steps of: 1) providing a plurality of standard mixtures, each of the standard mixtures having a standard antigen and an aluminum based adjuvant; 2) mixing a stabilizing solution with the vaccine and each of the standard mixtures; 3) determining dosages of the standard antigens in the standard mixtures to establish a standard curve; and 4) determining a dosage of a target antigen in the vaccine according to the standard curve.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: March 9, 2021
    Assignee: Adimmune Corporation
    Inventors: Juine-Ruey Chen, Chia-Ying Wu, Yung-Tsung Chen
  • Publication number: 20210025399
    Abstract: A pump body includes a housing, a first and a second chambers separated and communicated by the housing, an input pipe communicated with the first chamber and an output pipe communicated with the second chamber. The input pipe has a water outlet located in the first chamber. The output pipe has a water inlet located in the second chamber. The first pump has a first rotor placed in the first chamber. The second pump has a second rotor placed in the second chamber, wherein an extension line of a rotating shaft of the second rotor is perpendicular to a plane where a rotating shaft of the first rotor located.
    Type: Application
    Filed: July 24, 2020
    Publication date: January 28, 2021
    Inventors: Wei-Fang WU, Chia-Ying HSU, Chia-Yu YEH, Chi-Chang TENG
  • Publication number: 20210024277
    Abstract: A liquid storage tank includes a housing, a piston, a lower cover, an elastic element, and an outlet pipe. The piston is located in the housing. The lower cover is attached to the housing and has a support post extending toward the piston. The piston, the housing, and the lower cover define a tank chamber. The elastic element is connected with the tank hosing and the piston. The outlet pipe communicates with the tank chamber.
    Type: Application
    Filed: December 26, 2019
    Publication date: January 28, 2021
    Inventors: Yu-Jei HUANG, Wei-Fang WU, Chia-Ying HSU, Chih-Chieh LU
  • Publication number: 20210025397
    Abstract: A pump mechanism is provided, including a housing, a first impeller, a second impeller, and two driving modules. The housing includes a first recess, a second recess, a plate, a channel, an input pipe, a first output pipe, and a second output pipe. The plate is disposed between the first recess and the second recess. The channel passes through the plate and communicated with the first recess and the second recess. The input pipe is connected to the channel and passes through the housing and the plate. The first output pipe and the second output pipe are respectively communicated with the first recess and the second recess.
    Type: Application
    Filed: July 13, 2020
    Publication date: January 28, 2021
    Inventors: Wei-Fang WU, Chia-Ying HSU, Chia-Yu YEH, Chi-Chang TENG
  • Patent number: 10875060
    Abstract: Debris is removed from a collector of an extreme ultraviolet light source vessel by applying a suction force through a vacuum opening of a cable. The method for removing debris also includes weakening debris attachment by using a sticky surface or by spreading a solution through a nozzle, wherein the sticky surface and the nozzle are arranged on the cable proximal to the vacuum opening. A borescope system and interchangeable rigid portions of the cable assists in targeting a target area of the collector where the debris is.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: December 29, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shang-Ying Wu, Ming-Hsun Tsai, Sheng-Kang Yu, Yung-Teng Yu, Chi Yang, Shang-Chieh Chien, Chia-Chen Chen, Li-Jui Chen, Po-Chung Cheng
  • Publication number: 20200348241
    Abstract: A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.
    Type: Application
    Filed: July 20, 2020
    Publication date: November 5, 2020
    Inventors: Chun-Lin Louis CHANG, Shang-Chieh CHIEN, Shang-Ying WU, Li-Kai CHENG, Tzung-Chi FU, Bo-Tsun LIU, Li-Jui CHEN, Po-Chung CHENG, Anthony YEN, Chia-Chen CHEN
  • Publication number: 20200331038
    Abstract: Debris is removed from a collector of an extreme ultraviolet light source vessel by applying a suction force through a vacuum opening of a cable. The method for removing debris also includes weakening debris attachment by using a sticky surface or by spreading a solution through a nozzle, wherein the sticky surface and the nozzle are arranged on the cable proximal to the vacuum opening. A borescope system and interchangeable rigid portions of the cable assists in targeting a target area of the collector where the debris is.
    Type: Application
    Filed: April 18, 2019
    Publication date: October 22, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shang-Ying WU, Ming-Hsun TSAI, Sheng-Kang YU, Yung-Teng YU, Chi YANG, Shang-Chieh CHIEN, Chia-Chen CHEN, Li-Jui CHEN, Po-Chung CHENG
  • Publication number: 20200251812
    Abstract: An antenna device is provided. The antenna device includes a first substrate, a multilayer electrode, a second substrate, and a liquid-crystal layer. The multilayer electrode is disposed on the first substrate, and the multilayer electrode includes a first conductive layer, a second conductive layer, and a third conductive layer. The second conductive layer is disposed on the first conductive layer. The third conductive layer is disposed on the second conductive layer. The liquid-crystal layer is disposed between the first substrate and the second substrate. In addition, the third conductive layer includes a first portion that extends beyond the second conductive layer.
    Type: Application
    Filed: January 2, 2020
    Publication date: August 6, 2020
    Inventors: Chia-Ping TSENG, Ker-Yih KAO, Chia-Chi HO, Ming-Yen WENG, Hung-I TSENG, Shu-Ling WU, Huei-Ying CHEN
  • Publication number: 20200243664
    Abstract: A semiconductor device and a method for fabricating the semiconductor device are provided, in which the method includes the steps of forming a gate structure on a substrate, forming a spacer on a sidewall of the gate structure, forming two recesses adjacent to two sides of the spacer, performing a cleaning process to trim the spacer for forming a void between the spacer and the substrate, and forming two portions of an epitaxial layer in the two recesses. The semiconductor device preferably includes a cap layer on the two portions of the epitaxial layer as the cap layer includes a planar top surface and an inclined sidewall.
    Type: Application
    Filed: March 6, 2019
    Publication date: July 30, 2020
    Inventors: Wei-Chih Chuang, Chia-Jong Liu, Kuang-Hsiu Chen, Chung-Ting Huang, Chi-Hsuan Tang, Kai-Hsiang Wang, Bing-Yang Jiang, Yu-Lin Cheng, Chun-Jen Chen, Yu-Shu Lin, Jhong-Yi Huang, Chao-Nan Chen, Guan-Ying Wu
  • Patent number: 10718718
    Abstract: A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.
    Type: Grant
    Filed: September 29, 2019
    Date of Patent: July 21, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Lin Louis Chang, Shang-Chieh Chien, Shang-Ying Wu, Li-Kai Cheng, Tzung-Chi Fu, Bo-Tsun Liu, Li-Jui Chen, Po-Chung Cheng, Anthony Yen, Chia-Chen Chen
  • Publication number: 20200111651
    Abstract: An ion collector includes a plurality of segments and a plurality of integrators. The plurality of segments are physically separated from one another and spaced around a substrate support. Each of the segments includes a conductive element that is designed to conduct a current based on ions received from a plasma. Each of the plurality of integrators is coupled to a corresponding conductive element. Each of the plurality of integrators is designed to determine an ion distribution for a corresponding conductive element based, at least in part, on the current conducted at the corresponding conductive element. An example benefit of this embodiment includes the ability to determine how uniform the ion distribution is across a wafer being processed by the plasma.
    Type: Application
    Filed: December 5, 2019
    Publication date: April 9, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Otto Chen, Chi-Ying Wu, Chia-Chih Chen
  • Patent number: 10593877
    Abstract: A resistive random access memory is provided. The resistive random access memory includes a bottom electrode over a substrate, a top electrode, a resistance-switching layer, an oxygen exchange layer, and a sidewall protective layer. The top electrode is disposed over the bottom electrode. The resistance-switching layer is disposed between the bottom electrode and the top electrode. The oxygen exchange layer is disposed between the resistance-switching layer and the top electrode. The sidewall protective layer containing metal or semiconductor is disposed at sidewalls of the resistance-switching layer, and the sidewalls of the resistance-switching layer is doped with the metal or semiconductor from the sidewall protective layer.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: March 17, 2020
    Assignee: Winbond Electronics Corp.
    Inventors: Frederick Chen, Ping-Kun Wang, Shao-Ching Liao, Po-Yen Hsu, Yi-Hsiu Chen, Ting-Ying Shen, Bo-Lun Wu, Meng-Hung Lin, Chia-Hua Ho, Ming-Che Lin
  • Publication number: 20200052018
    Abstract: A method includes epitaxially growing a first III-V compound layer over a semiconductive substrate. A second III-V compound layer is epitaxially grown over the first III-V compound layer. A source/drain contact is formed over the second III-V compound layer. A gate structure is formed over the second III-V compound layer. A pattern is formed shielding the gate structure and the source/drain contact, in which a portion of the second III-V compound layer is free from coverage by the pattern.
    Type: Application
    Filed: October 21, 2019
    Publication date: February 13, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chien-Ying WU, Li-Hsin CHU, Chung-Chuan TSENG, Chia-Wei LIU
  • Publication number: 20200025688
    Abstract: A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.
    Type: Application
    Filed: September 29, 2019
    Publication date: January 23, 2020
    Inventors: Chun-Lin Louis CHANG, Shang-Chieh CHIEN, Shang-Ying WU, Li-Kai CHENG, Tzung-Chi FU, Bo-Tsun LIU, Li-Jui CHEN, Po-Chung CHENG, Anthony YEN, Chia-Chen CHEN
  • Patent number: 10495957
    Abstract: A wavelength conversion device includes a main body, at least one wavelength conversion layer, at least one heat dissipation plate, a heat conducting component and a driving unit. The wavelength conversion layer is disposed on the main body. The heat dissipation plate is disposed on a side of the main body with an interval. The heat conducting component is connected between the heat dissipation plate and the main body. The driving unit is connected to the main body and the heat dissipation plate and adapted to drive the main body and the heat dissipation plate to rotate. The driving unit and the heat conducting component have a gap therebetween. In addition, a projector including the wavelength conversion device is also provided. The wavelength conversion device according to the disclosure has good heat dissipation efficiency.
    Type: Grant
    Filed: November 12, 2018
    Date of Patent: December 3, 2019
    Assignee: Coretronic Corporation
    Inventors: Te-Ying Tsai, Tsung-Ching Lin, Shi-Wen Lin, Pei-Rong Wu, Chia-Lun Tsai
  • Publication number: 20190336439
    Abstract: The present disclosure relates generally to depot formulations of lurasidone and methods of making depot formulations of lurasidone. The depot formulations include a suspending agent and are highly syringeable.
    Type: Application
    Filed: May 1, 2019
    Publication date: November 7, 2019
    Inventors: Chung-Chiang Hsu, Tzu-Ying WU, Wei-Hsiang Wang, Chia-Yu Kuo
  • Patent number: 10453881
    Abstract: An infrared image sensor component includes a semiconductor substrate, an active pixel region disposed on the semiconductor substrate for receiving an infrared ray, and a transistor coupled to the active pixel region. The transistor includes a gate and a source/drain stressor disposed adjacent to the gate. The active pixel region includes a III-V compound material.
    Type: Grant
    Filed: January 13, 2018
    Date of Patent: October 22, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chien-Ying Wu, Li-Hsin Chu, Chung-Chuan Tseng, Chia-Wei Liu
  • Patent number: 10429314
    Abstract: A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: October 1, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Lin Louis Chang, Shang-Chieh Chien, Shang-Ying Wu, Li-Kai Cheng, Tzung-Chi Fu, Bo-Tsun Liu, Li-Jui Chen, Po-Chung Cheng, Anthony Yen, Chia-Chen Chen
  • Publication number: 20190293650
    Abstract: The present disclosure provides a method for quantifying a vaccine. The method includes the steps of: 1) providing a plurality of standard mixtures, each of the standard mixtures having a standard antigen and an aluminum based adjuvant; 2) mixing a stabilizing solution with the vaccine and each of the standard mixtures; 3) determining dosages of the standard antigens in the standard mixtures to establish a standard curve; and 4) determining a dosage of a target antigen in the vaccine according to the standard curve.
    Type: Application
    Filed: May 24, 2019
    Publication date: September 26, 2019
    Inventors: JUINE-RUEY CHEN, CHIA-YING WU, YUNG-TSUNG CHEN